METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS

• US 6,426,552 B1
• Filed: 05/19/2000
• Issued: 07/30/2002
• Est. Priority Date: 05/19/2000
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Jiang, Tongbi, Reeder, W. Jeff
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Nhu, David
• Application Number:
  US09/574,759
• Time in Patent Office: 802 Days
• Field of Search: 257/666, 257/668, 257/678, 257/709, 257/724, 257/725, 257/777, 257/778, 257/779, 257/780, 257/781, 257/783
• US Class Current: 257/724
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/83856 Pre-cured adhesive, i.e. B-stage adhesive
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3737 : Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4951 : Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49513 : having bonding material between chip and die pad
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01R 4/04 : using electrically conductive adhesives
• CPC Class Codes: H05K 2203/0278 : Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/0058 : Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to each other. The pressure sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the hybrid adhesive material may be heated to cure the thermoset component thereof and to more permanently secure the semiconductor device components to one another. The cure temperature may be lower than about 200° C. and as low as about 120° C. or less. A system for effecting the method of the present invention is also disclosed, as well as semiconductor device assemblies that include the hybrid adhesive material.

Claims

1. A system for securing at least two semiconductor device components to one another, comprising:

an actuation element for moving a first semiconductor device component;

an adhesive applicator configured to apply a hybrid adhesive material to at least a portion of a surface of said first semiconductor device component as said actuation element brings said first semiconductor device component in proximity to said adhesive applicator;

a placement apparatus configured to receive a second semiconductor device component and to assemble said second semiconductor device component with said first semiconductor component with said hybrid adhesive material securing said first and second semiconductor device components to one another;

a diagnostic component for checking an alignment of said first semiconductor device component and the second semiconductor device component; and

a heating element for applying heat to said hybrid adhesive material and curing at least a thermoset component thereof.

2. The system of claim 1, wherein said actuation element is configured to engage sprocket holes in a lead frame.

3. The system of claim 1, wherein said actuation element comprises a conveyor belt.

4. The system of claim 1, wherein said adhesive applicator comprises a spray nozzle.

5. The system of claim 4, wherein said spray nozzle comprises an atomizing spray nozzle.

6. The system of claim 1, wherein said adhesive applicator is configured to apply a film bearing a quantity of said hybrid adhesive material to said first semiconductor device component.

7. The system of claim 1, wherein said adhesive applicator is configured to spread said hybrid adhesive material onto said first semiconductor device component.

8. The system of claim 1, wherein said adhesive applicator comprises a metered dispenser.

9. The system of claim 1, wherein said adhesive applicator comprises an extruder.

10. The system of claim 1, wherein said adhesive applicator comprises a contact applicator.

11. The system of claim 10, wherein said contact applicator comprises at least one of a roller or stamp.

12. The system of claim 1, wherein said placement apparatus comprises a pick-and-place apparatus.

13. The system of claim 1, wherein said placement apparatus is configured to press said second semiconductor device component against said first semiconductor device component.

14. The system of claim 1, wherein said diagnostic component comprises a machine vision system.

15. The system of claim 14, wherein said machine vision system comprises a pattern recognition system.

16. The system of claim 1, further comprising a repositioning element configured to separate and reassemble said first and second semiconductor device components.

17. The system of claim 1, wherein said heating element is configured to heat at least said hybrid adhesive material to a temperature of less than about 200°

C.

18. The system of claim 1, wherein said heating element is configured to heat at least said hybrid adhesive material to a temperature of about 120°

C.

19. An assembly of semiconductor device components, comprising:

a first semiconductor device component;

a quantity of hybrid adhesive material including at least a pressure sensitive component and a thermoset component on at least a portion of at least one surface of said first semiconductor device component; and

at least a second semiconductor device component positioned adjacent said first semiconductor device component and at least temporarily secured thereto by at least said pressure sensitive component of said hybrid adhesive material.

20. The assembly of claim 19, wherein said first semiconductor device component comprises a carrier.

21. The assembly of claim 20, wherein said carrier comprises at least one of a plurality of leads, a circuit board, an interposer, and at least one semiconductor die.

22. The assembly of claim 19, wherein said at least said second semiconductor device component comprises a semiconductor die.

23. The assembly of claim 19, wherein said at least said second semiconductor device component comprises a heat sink.

24. The assembly of claim 19, wherein said pressure sensitive component of said hybrid adhesive material comprises an acrylic pressure sensitive material.

25. The assembly of claim 19, wherein said thermoset component of said hybrid adhesive material comprises an epoxy thermoset adhesive material.

26. The assembly of claim 19, wherein at least said thermoset component of said hybrid adhesive material is at least partially cured.

27. The assembly of claim 26, wherein at least said thermoset component of said hybrid adhesive material permanently secures said first and second semiconductor device components to one another.

28. The assembly of claim 19, wherein said hybrid adhesive material is carried on a film.