Semiconductor device mounting structure and feeding-side charger with heat radiating unit

• US 6,426,874 B2
• Filed: 12/05/2000
• Issued: 07/30/2002
• Est. Priority Date: 12/10/1999
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
• Original Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
• Inventors: Kajiura, Katsuyuki
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/730,016
• Publication Number:
  US 20010038526A1
• Time in Patent Office: 602 Days
• Field of Search: 361/683, 361/690, 361/687-688, 361/692, 361/695, 361/700-710, 361/714-718, 361/737, 361/719-722, 165/80.3, 165/185, 165/104.26, 165/104.33, 165/104.34, 165/80.2, 165/80.4, 174/16.3, 174/52.2, 174/16.1, 257/706-727, 257/796, 257/787-789, 257/791
• US Class Current: 361/700
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

In a feeding-side charger, a heat transfer unit (23), which comes into contact with a heat radiating duct (16) fixed with a power circuit board (18), is fixed to the power circuit board (18) in which a power conversion circuit is formed. Each main body (22) of a plurality of MOSFETs (21) mounted on the power circuit board (18) comes into contact with the heat transfer unit (23) with a silicone sheet (24) being interposed therebetween.

Claims

1. A semiconductor device mounting structure,

wherein a heat transfer unit is fixed to a circuit board on which molded-type semiconductor devices are mounted, said heat transfer unit coming into contact with a heat radiating unit provided contiguous with said circuit board, and

wherein main bodies of said semiconductor devices mounted on said circuit board are pressed against said heat transfer unit by means of a fixing member that is fixed to said heat transfer unit.

2. A semiconductor device mounting structure, as set forth in claim 1, wherein an insulation sheet having thermal conductivity is interposed between said heat transfer unit and said semiconductor devices.

3. A semiconductor device mounting structure, as set forth in claim 1,

wherein said heat transfer unit is formed into a rectangular prism-like shape extending along said circuit board and has longitudinally parallel side faces thereof, contiguous with a fixing face which comes into contact with said circuit board, to be abutment faces for said semiconductor devices, and

wherein same numbers of said semiconductor devices come into contact with each of said abutment faces respectively.

5. A semiconductor device mounting structure, as set forth in claim 2,

wherein said heat transfer unit is formed into a rectangular prism-like shape extending along said circuit board and has longitudinally parallel side faces thereof, contiguous with a fixing face which comes into contact with said circuit board, to be abutment faces for said semiconductor devices, and

wherein same numbers of said semiconductor devices come into contact with each of said abutment faces respectively.

4. A semiconductor device mounting structure that is part of a feeding-side charger, comprising:

a heat transfer unit fixed to a circuit board on which a power conversion circuit including semiconductor devices is formed, said heat transfer unit coming into contact with a heat radiating duct provided contiguous with said circuit board such that said circuit board is parallel with one side of said heat radiating duct;

wherein main bodies of said semiconductor devices mounted on said circuit board come into contact with said heat transfer unit; and

wherein said power conversion circuit converts a commercial alternating current into a high-frequency alternating current.