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Semiconductor device mounting structure and feeding-side charger with heat radiating unit

  • US 6,426,874 B2
  • Filed: 12/05/2000
  • Issued: 07/30/2002
  • Est. Priority Date: 12/10/1999
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device mounting structure,wherein a heat transfer unit is fixed to a circuit board on which molded-type semiconductor devices are mounted, said heat transfer unit coming into contact with a heat radiating unit provided contiguous with said circuit board, and wherein main bodies of said semiconductor devices mounted on said circuit board are pressed against said heat transfer unit by means of a fixing member that is fixed to said heat transfer unit.

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