Method for continuous, non lot-based integrated circuit manufacturing
First Claim
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1. A method in an integrated circuit (IC) device manufacturing process for tracking IC devices through the manufacturing process, the method comprising:
- providing each of the IC devices with an identification (ID) code;
reading the identification (ID) code of each of the IC devices;
advancing the IC devices through the manufacturing process in a substantially continuous manner;
generating data related to the advancement of each of the IC devices through the manufacturing process; and
associating the data generated for each of the IC devices with the identification (ID) code of its associated IC device.
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Abstract
A method for continuous, non lot-based manufacturing of integrated circuit (IC) devices of the type to each have a unique fuse identification (ID) includes: reading the fuse ID of each of the IC devices; advancing multiple lots of the IC devices through, for example, a test step in the manufacturing process in a substantially continuous manner; generating data, such as test data, related to the advancement of each of the IC devices through the step in the process; and associating the data generated for each of the IC devices with the fuse ID of its associated IC device.
89 Citations
24 Claims
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1. A method in an integrated circuit (IC) device manufacturing process for tracking IC devices through the manufacturing process, the method comprising:
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providing each of the IC devices with an identification (ID) code;
reading the identification (ID) code of each of the IC devices;
advancing the IC devices through the manufacturing process in a substantially continuous manner;
generating data related to the advancement of each of the IC devices through the manufacturing process; and
associating the data generated for each of the IC devices with the identification (ID) code of its associated IC device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method in an integrated circuit (IC) device manufacturing process for tracking IC devices through back-end test steps in the manufacturing process, the method comprising:
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programming each of the IC devices with a unique fuse identification (ID);
for each of the back-end test steps, reading the unique fuse identification (ID) of each of the IC devices;
advancing the IC devices through the back-end test steps in the manufacturing process in a substantially continuous manner;
generating data related to the advancement of each of the IC devices through the back-end test steps; and
associating the data generated for each of the IC devices with the unique fuse identification (ID) of its associated IC device.
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13. A method of manufacturing integrated circuit (IC) devices from a semiconductor wafer, the method comprising:
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fabricating a plurality of IC'"'"'s on a wafer;
causing each of the IC'"'"'s to store a substantially unique identification (ID) code;
separating each of the IC'"'"'s from said wafer to form one of a plurality of IC devices;
reading the unique identification (ID) code from each of the IC devices;
testing each of the IC devices;
while manufacturing the IC devices;
advancing the IC devices through at least one manufacturing step in a substantially continuous manner;
generating data related to the advancement of each of the IC devices through the at least one manufacturing step; and
associating the data generated for each of the IC devices with the unique identification (ID) code of the IC in its associated IC device. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A method in an integrated circuit (IC) device manufacturing process for correlating process-related variables with performance variables related to the performance of IC devices as they advance through the manufacturing process, the method comprising:
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providing a plurality of IC devices with identification (ID) codes;
reading the identification (ID) code from each of the IC devices;
advancing the IC devices through at least one step in the manufacturing process in a substantially continuous manner;
while the IC devices advance through the step in the manufacturing process, generating data related to process variables associated with the step in the manufacturing process;
generating data related to performance variables associated with the performance of at least some of the IC devices as they advance through at least one step in the manufacturing process; and
associating the process variable-related data and the performance variable-related data generated for each of the IC devices with the identification (ID) code of the IC device associated with the data. - View Dependent Claims (21, 22, 23)
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24. A method of manufacturing Integrated Circuit (IC) modules from semiconductor wafers, the method comprising:
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providing a plurality of semiconductor wafers;
fabricating a plurality of IC'"'"'s on each wafer of the plurality of semiconductor wafers;
causing each of the IC'"'"'s on each wafer of the plurality of semiconductor wafers to store an identification (ID) code;
separating each of the IC'"'"'s on each wafer of the plurality of semiconductor wafers from its wafer to form one of a plurality of IC dice;
assembling a plurality of IC modules from the IC dice;
reading the identification (ID) codes from the IC dice in each of the IC modules;
testing each of the IC dice in each of the IC modules;
while manufacturing the IC modules;
advancing the IC modules through at least one manufacturing step in a substantially continuous manner;
generating data related to the advancement of the IC modules through the manufacturing step; and
associating the data generated for each of the IC modules with the identification (ID) codes of its associated IC dice.
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Specification