Coil component and manufacturing method for the same

• US 6,427,315 B1
• Filed: 06/16/1999
• Issued: 08/06/2002
• Est. Priority Date: 08/23/1996
• Status: Expired due to Fees

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Hata, Yukio, Kitagawa, Toshio
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US09/333,907
• Time in Patent Office: 1,147 Days
• Field of Search: 296/05, 296/021, 298/60, 336/192
• US Class Current: 29/602.1
• CPC Class Codes: H01F 5/04 Arrangements of electric connections to coils, e.g. leads
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

A coil component and a manufacturing method for producing the same permit a wire terminal to be bonded to an electrode with high reliability by implementing thermal compression bonding using a heater chip. The coil component comprises a bobbin around which a wire is wound, the wire having a solder layer on the outer peripheral surface of a core conductor and an insulating layer formed on the outer peripheral surface of the solder layer. The wire terminal is secured to the electrode provided on the bobbin by thermal compression bonding. A heated heater chip is applied to the terminal to break the insulating layer and to melt the solder layer at substantially the same time. Then, pressure is applied to the heater chip to provide intermetallic bonding between the core conductor and the electrode. Melted solder solidifies and covers the area around the core conductor, thereby securely bonding the wire terminal to the electrode.

Claims

1. A manufacturing method for a coil component comprising a wire wound around a bobbin, said wire having a core conductor provided with a solder layer formed on the outer peripheral surface thereof, and an insulating layer formed on the outer peripheral surface of said solder layer, said manufacturing method comprising the steps of:

positioning a terminal of said wire on an electrode provided on said bobbin and applying a heated heater chip to the terminal of said wire so as to degrade said insulating layer and to m elt said solder layer at substantially the same time;

pressurizing said heater chip against said terminal to provide intermetallic bonding adhesion between said core conductor and said electrode; and

removing said heater chip from said terminal.

2. The manufacturing method of claim 1, wherein said solder layer is formed to a thickness of approximately {fraction (1/10)} to {fraction (1/50)} of the diameter of the core conductor.

3. The manufacturing method of claim 1, wherein said step of pressurizing comprises pressurizing said heater chip against terminal at a force of approximately 0.5 to 3.0 kgf/cm².

4. The manufacturing method of claim 1, wherein said step of pressurizing comprises pressurizing said heater chip against said terminal for approximately 0.5 to 5 seconds.

5. The manufacturing method of claim 1, wherein said step of applying and said step of pressurizing are concurrently performed.

6. The manufacturing method of claim 1, wherein said step of pressurizing follows said step of applying.