Ink jet nozzle assembly including a fluidic seal

• US 6,428,147 B2
• Filed: 03/02/2001
• Issued: 08/06/2002
• Est. Priority Date: 07/15/1997
• Status: Expired due to Term

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Gordon, Raquel Yvette
• Application Number:
  US09/798,742
• Publication Number:
  US 20010008408A1
• Time in Patent Office: 522 Days
• Field of Search: 347/54, 347/87, 347/84, 347/49, 347/68, 347/69, 347/70, 347/71, 347/72, 347/50, 347/40, 347/20, 347/44, 347/47, 347/27, 399/261, 361/700, 298/901, 310/328-330
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 Electromagnetic transducer
• CPC Class Codes: B41J 2002/14346 Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14435 Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2202/15 Moving nozzle or nozzle plate
• CPC Class Codes: H04N 1/2112 using still video cameras
• CPC Class Codes: H04N 1/2154 the still video camera incorporating a hardcopy reproducing device, e.g. a printer
• CPC Class Codes: H04N 2101/00 Still video cameras
• CPC Class Codes: H04N 23/00 Cameras or camera modules comprising electronic image sensors; Control thereof
• CPC Class Codes: H04N 5/2628 Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation

Abstract

An ink jet print head includes a nozzle chamber for storage of ink to be ejected from an ink ejection nozzle formed in one wall of the nozzle chamber; and a movable paddle actuator mechanism formed in a first wall of the nozzle chamber, one end of the paddle actuator traversing along a second wall of the nozzle chamber, the second wall being substantially perpendicular to the first wall; the one end further including a flange having a surface abutting the second wall, the movable paddle actuator mechanism being operable to cause the ejection of ink from the ink ejection nozzle with the flange moving substantially tangentially to the second wall.

Claims

1. An ink jet nozzle assembly including a nozzle chamber containing ink to be ejected, said chamber including a fixed portion and a movable portion configured for relative movement in an ejection phase and alternate relative movement in a refill phase, wherein a fluidic seal comprising a meniscus formed by said ink extends between the movable portion and the fixed portion.

2. The ink jet nozzle assembly according to claim 1, wherein said movable portion is a thermal bend actuator.

3. The ink jet nozzle assembly according to claim 1, wherein said fixed portion is a wall of said nozzle chamber.

4. The ink jet nozzle assembly according to claim 1, wherein an air breathing slot is located between said movable portion and said fixed portion.

5. An ink jet nozzle assembly including:

a nozzle chamber having an inlet in fluid communication with an ink reservoir and a nozzle through which ink from said chamber can be ejected;

the chamber including a fixed portion and a movable portion configured for relative movement in an ejection phase and alternate relative movement in a refill phase;

the movable portion being formed in a first wall of said nozzle chamber and having one end traversing adjacent a second wall of said nozzle chamber, said second wall being substantially perpendicular to said first wall; and

the inlet being positioned and dimensioned relative to the nozzle such that ink is ejected preferentially from the chamber through the nozzle in droplet form during the ejection phase, and ink is alternately drawn preferentially into the chamber from the reservoir through the inlet during the refill phase.

6. An assembly according to claim 5 wherein the movable portion includes the nozzle and the fixed portion is mounted on a substrate.

7. An assembly according to claim 5 wherein the fixed portion includes the nozzle mounted on a substrate and a movable portion includes an ejection paddle.

8. The assembly according to claim 5 wherein said one end of said first wall further includes a flange including a surface adjacent said second wall.

9. An assembly according to claim 8 wherein said flange is spaced from said second wall by a slot.

10. The assembly according to claim 5 wherein said second wall of said chamber forms one wall of said inlet.

11. An assembly according to claim 5 wherein said movable portion includes a thermal bend actuator.

12. An assembly according to claim 11 wherein said thermal bend actuator comprises a conductive heater layer between layers of a substantially non-conductive material having a higher coefficient of thermal expansion.

13. An assembly according to claim 12 wherein said conductive heater layer is arranged in a serpentine form so that, upon conductive heating of said conductive heater layer, said conductive heater layer forms a concertina so as to allow for substantially unhindered expansion of said substantially non-conductive material.

14. An assembly according to claim 12 wherein said substantially non-conductive material comprises substantially polytetra-fluoroethylene.

15. An assembly according to claim 5 formed on a silicon wafer.

16. An assembly according to claim 15 wherein said inlet is formed by back etching a back surface of said silicon wafer.

17. An assembly according to claim 16 wherein said back etching comprises a plasma etching of said back surface.

18. An assembly according to claim 15 wherein said silicon wafer is initially processed utilizing a CMOS processing system so as to form a electrical circuit required to operate said ink jet nozzle assembly on said silicon wafer.

19. An assembly according to claim 5 wherein said movable portion, in being actuated to be eject a drop of ink, restricts a flow of ink into said chamber via said inlet.

20. An assembly according to claim 5 further including a slot around a substantial portion of said movable portion, said slot interconnecting said nozzle chamber with an external ambient atmosphere, said slot being dimensioned to provide for fluid movement during operation of said movable portion while not allowing for the ejection of fluid therethrough.