Moveable microelectromechanical mirror structures and associated methods

• US 6,428,173 B1
• Filed: 05/03/1999
• Issued: 08/06/2002
• Est. Priority Date: 05/03/1999
• Status: Expired due to Term

• Current Assignee: Memscap Incorporated
• Original Assignee: Viavi Solutions, Inc. (Lumentum Holdings Inc.)
• Inventors: Dhuler, Vijayakumar R., Walters, Mark David, Hill, Edward A., Cowen, Allen Bruce
• Primary Examiner(s): Shafer, Ricky D.
• Application Number:
  US09/304,301
• Time in Patent Office: 1,191 Days
• Field of Search: 359/198, 359/212, 359/223, 359/224, 359/230, 359/850, 359/855, 359/872, 359/881
• US Class Current: 359/872
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 6/357 Electrostatic force electrostatic forces controlling reflecting elements in general G02B26/0841
• CPC Class Codes: G02B 6/358 Latching of the moving element, i.e. maintaining or holding the moving element in place once operation has been performed; includes a mechanically bistable system
• CPC Class Codes: H01H 2001/0047 operable only by mechanical latching
• CPC Class Codes: H01H 2001/0063 having electrostatic latches, i.e. the activated position is kept by electrostatic forces other than the activation force

Abstract

Microelectromechanical structures (MEMS) are provided that are adapted to controllably move mirrors in response to selective thermal actuation. In one embodiment, the MEMS moveable mirror structure includes a thermally actuated microactuator adapted to controllably move along a predetermined path substantially parallel to the first major surface of an underlying microelectronic substrate. A mirror is adapted to move accordingly with the microactuator between a non-actuated and an actuated position. In all positions, the mirror has a mirrored surface disposed out of plane relative to the first major surface of the microelectronic substrate. The microactuator provided herein can include various thermal arched beam actuators, thermally actuated composite beam actuators, arrayed actuators, and combinations thereof. The MEMS moveable mirror structure can also include a mechanical latch and/or an electrostatic latch for controllably clamping the mirror in position. A MEMS moveable mirror array is also provided which permits individualized control of each individual MEMS moveable mirror structure within the array. The MEMS moveable mirror structures and the associated arrays can be used in a variety of applications including applications involving the controlled redirection of electromagnetic radiation. Accordingly, a method of redirecting electromagnetic radiation is provided. A method of fabricating MEMS moveable mirror structures is further provided.

Claims

1. A moveable microelectromechanical mirror structure comprising:

a microelectronic substrate having a first major surface;

a microactuator, disposed upon the first major surface of the microelectronic substrate and adapted for thermal actuation so as to controllably move along a predetermined path that extends substantially parallel to the first major surface of said microelectronic substrate; and

a mirror, adapted for movement with said microactuator between a non-actuated position and an actuated position in response to thermal actuation, said mirror having a mirrored surface disposed out of plane relative to the first major surface of said microelectronic substrate in both the non-actuated position and the actuated position, wherein said microactuator and said mirror are formed from a single crystal material.

2. A moveable microelectromechanical mirror structure according to claim 1, wherein said microactuator comprises a thermal arched beam actuator, said thermal arched beam actuator comprising at least two anchors affixed to said microelectronic substrate and at least one arched beam disposed between said anchors, wherein said at least one thermal arched beam is adapted to arch further and controllably move along said predetermined path in response to selective thermal actuation thereof.

3. A moveable microelectromechanical mirror structure according to claim 1, wherein said microactuator further comprises a spring, said spring adapted to flex during selective thermal actuation of said microactuator.

4. A moveable microelectromechanical mirror structure according to claim 1, wherein said mirror is formed integrally with said microactuator from the single crystal material.

5. A moveable microelectromechanical mirror structure according to claim 1, further comprising a source of electromagnetic radiation directed along a path intersecting said mirror such that the path of electromagnetic radiation is thereby redirected by said mirror.

6. A moveable microelectromechanical mirror structure comprising:

microelectronic substrate having a first major surface;

a microactuator, disposed upon the first major surface of the microelectronic substrate and adapted for thermal actuation so as to controllably move along a predetermined path that extends substantially parallel to the first major surface of said microelectronic substrate; and

a mirror, adapted for movement with said microactuator between a non-actuated position and an actuated position in response to thermal actuation, said mirror having a mirrored surface disposed out of plane relative to the first major surface of said microelectronic substrate in both the non-actuated position and the actuated position, wherein said microactuator and said mirror are formed from a single crystal 110 silicon wafer.

7. A moveable microelectromechanical mirror structure comprising:

a microelectronic substrate having a first major surface;

a microactuator, disposed upon the first major surface of the microelectronic substrate and adapted for thermal actuation so as to controllably move along a predetermined path that extends substantially parallel to the first major surface of said microelectronic substrate; and

a mirror, adapted for movement with said microactuator between a non-actuated position and an actuated position in response to thermal actuation, said mirror having a mirrored surface disposed out of plane relative to the first major surface of said microelectronic substrate in both the non-actuated position and the actuated position, further comprising;

a mechanical latch affixed to the first major surface of said microelectronic substrate, said mechanical latch adapted to open in response to thermal actuation so as to receive said microactuator, said mechanical latch further adapted to close in response to the removal of thermal actuation and controllably clamp said microactuator in position once said mirror is in the actuated position.

8. A moveable microelectromechanical mirror structure according to claim 7, wherein said mechanical latch is further adapted to reopen in response to further thermal actuation so as to controllably unclamp and release said microactuator.

9. A method of redirecting electromagnetic radiation directed along at least one path using one or more moveable microelectromechanical mirror structures, each microelectromechanical mirror structure comprising a microelectronic substrate having a first major surface;

a microactuator, disposed upon the first major surface of the microelectronic substrate and adapted for thermal actuation so as to controllably move along a predetermined path that extends substantially parallel to the first major surface of said microelectronic substrate; and

a mirror, adapted for movement with said microactuator between a non-actuated position and an actuated position in response to thermal actuation, said mirror having a mirrored surface disposed out of plane relative to the first major surface of said microelectronic substrate in both the non-actuated position and the actuated position, the method of redirecting comprising the steps of;

providing at least one source of electromagnetic radiation directed along at least one path;

selectively thermally actuating at least one microactuator to controllably move along the predetermined path that extends substantially parallel to the first major surface of the microelectronic substrate;

controllably moving at least one mirror in response to thermal actuation of said at least one microactuator, wherein said controllably moving step comprises controllably moving each corresponding mirror from a non-actuated position in which the mirrored surface is out of plane relative to the first major surface of the microelectronic substrate to an actuated position in which one mirrored surface intersects said at least one path of electromagnetic radiation while remaining out of plane relative to the first major surface of the microelectronic substrate; and

redirecting said at least one path of electromagnetic radiation intersected by said at least one mirror, wherein each microelectromechanical mirror structure further comprises a latch selected from the group consisting of a mechanical latch and an electrostatic latch, the method of redirecting further comprising the step of clamping said at least one microactuator in position using the latch following thermal actuation of said at least one microactuator such that the corresponding mirror is are held in position relative to said at least one path of electromagnetic radiation.

10. An optical switch comprising:

a microelectronic substrate having a surface;

a microactuator, disposed upon the surface of the microelectronic substrate and adapted for thermal actuation so as to controllably move along a path that extends substantially parallel to the surface of said microelectronic substrate; and

a mirror, that is integral with the microactuator and protruding therefrom, the mirror being adapted for movement with said microactuator between a non-actuated position and an actuated position in response to thermal actuation of the microactuator, said mirror having a mirrored surface disposed out of plane relative to the surface of said microelectronic substrate in both the non-actuated position and the actuated position, wherein the mirror is planar in the actuated position and in the nonactuated position and said microactuator and said mirror are integral with one another and are an integrated unit of crystal 110 silicon.