Low temperature material bonding technique
First Claim
Patent Images
1. A device comprising:
- a first non-perforated glass piece;
a second non-perforated glass piece having a surface mating with a corresponding surface of the first non-perforated glass piece;
a film disposed between the first and the second non-perforated glass pieces and bonding the first and second non-perforated glass pieces, the film being made of a bonding agent that is capable of covalently bonding to both mating surfaces, wherein the bonding between the first and second non-perforated glass pieces is effected without use of temperatures greater than 90°
C., wherein the bonding agent is sodium silicate, silicic acid, polymeric forms of silicic acid, alkoxysilane, silane, or tetramethoxysilane; and
at least one microchannel located on the mating surfaces of the glass pieces, wherein the at least one microchannel is a groove in the mating surface of the first or the second non-perforated glass piece.
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Abstract
A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.
82 Citations
27 Claims
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1. A device comprising:
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a first non-perforated glass piece;
a second non-perforated glass piece having a surface mating with a corresponding surface of the first non-perforated glass piece;
a film disposed between the first and the second non-perforated glass pieces and bonding the first and second non-perforated glass pieces, the film being made of a bonding agent that is capable of covalently bonding to both mating surfaces, wherein the bonding between the first and second non-perforated glass pieces is effected without use of temperatures greater than 90°
C., wherein the bonding agent is sodium silicate, silicic acid, polymeric forms of silicic acid, alkoxysilane, silane, or tetramethoxysilane; and
at least one microchannel located on the mating surfaces of the glass pieces, wherein the at least one microchannel is a groove in the mating surface of the first or the second non-perforated glass piece. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A device comprising two bonded, mating non-perforated glass pieces having respective mating surfaces and at least one microchannel located on the mating surfaces of the glass pieces, the mating surfaces being bonded by a bonding agent comprising a thin layer of silicate, wherein the bonding occurs without use of temperatures greater than 90°
- C. and the at least one microchannel is a groove in the mating surface of at least one of the glass pieces.
- View Dependent Claims (13, 14, 15, 16)
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17. A device prepared by a process comprising:
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providing first and second non-perforated mating pieces having respective mating surfaces and at least one microchannel located on the mating surfaces of the first or the second mating pieces, wherein the at least one microchannel is a groove in the mating surface of at least one of the mating pieces;
applying an aqueous solution of silicate to a surface of the first non-perforated mating piece, wherein the concentration of silicate in the aqueous solution is less than 30 wt. %;
eliminating excess water from the applied aqueous solution to form a film on the first non-porous mating piece, the film comprising a molecule having the ability to covalently bond to the first non-perforated mating piece with a reactive moiety at one position on the molecule and covalently bond with the second non-perforated mating piece with a reactive moiety at another position on the molecule;
bringing the second non-perforated mating piece in contact with the first non-perforated mating piece with the film located between the first non-perforated mating piece and the second non-perforated mating piece, wherein the bonding method provides for strong bonds at temperatures of 90°
C. and less.- View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification