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Low temperature material bonding technique

  • US 6,428,896 B1
  • Filed: 06/17/1998
  • Issued: 08/06/2002
  • Est. Priority Date: 05/16/1996
  • Status: Expired due to Fees
First Claim
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1. A device comprising:

  • a first non-perforated glass piece;

    a second non-perforated glass piece having a surface mating with a corresponding surface of the first non-perforated glass piece;

    a film disposed between the first and the second non-perforated glass pieces and bonding the first and second non-perforated glass pieces, the film being made of a bonding agent that is capable of covalently bonding to both mating surfaces, wherein the bonding between the first and second non-perforated glass pieces is effected without use of temperatures greater than 90°

    C., wherein the bonding agent is sodium silicate, silicic acid, polymeric forms of silicic acid, alkoxysilane, silane, or tetramethoxysilane; and

    at least one microchannel located on the mating surfaces of the glass pieces, wherein the at least one microchannel is a groove in the mating surface of the first or the second non-perforated glass piece.

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