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Flip chip device and method of manufacture

  • US 6,429,046 B1
  • Filed: 07/13/2000
  • Issued: 08/06/2002
  • Est. Priority Date: 07/13/2000
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a flip-chip device comprising:

  • providing a copper structure formed over a semiconductor device;

    applying an electrically conductive non-wettable layer over the power copper structure;

    applying a wettable stud over the electrically conductive non-wettable layer; and

    applying a solder bump to the wettable stud.

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  • 22 Assignments
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