Electrical device including a leaded cell assembly

• US 6,429,507 B1
• Filed: 04/03/2000
• Issued: 08/06/2002
• Est. Priority Date: 04/03/2000
• Status: Expired due to Fees

• Current Assignee: Artesyn Technologies Incorporated (Artesyn Embedded Technologies, Inc.)
• Original Assignee: Artesyn Technologies Incorporated (Artesyn Embedded Technologies, Inc.)
• Inventors: Knudtsen, Stephen F., White, Robert V., Teuber, Kathryn J.
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US09/541,843
• Time in Patent Office: 855 Days
• Field of Search: 257/678, 257/666, 257/685, 438/123, 438/106, 438/121, 361/704, 361/707, 361/813
• US Class Current: 257/678
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electrical device. The electrical device includes a first substrate, a second substrate facing the first substrate, a unpackaged semiconductor die electrically and thermally connected to the first substrate, a first lead electrically connected between the unpackaged semiconductor die and the second substrate, and a second lead electrically connected between the first and second substrates.

Claims

1. An electrical device, comprising:

a first substrate;

a second substrate facing the first substrate;

an unpackaged semiconductor die electrically and thermally connected to the first substrate;

a first lead electrically connected between the unpackaged semiconductor die and the second substrate; and

a second lead electrically connected between the first and second substrates.

2. The device of claim 1, wherein the unpackaged semiconductor die includes an unpackaged silicon die.

3. The device of claim 1, wherein the unpackaged semiconductor die includes a rectifier.

4. The device of claim 1, wherein the first substrate includes an insulated metal substrate.

5. The device of claim 1, wherein the second substrate includes a circuit board.

6. The device of claim 1, further comprising a first conductive tab electrically and thermally connected between the unpackaged semiconductor die and the first substrate.

7. The device of claim 1, further comprising a second conductive tab electrically and thermally connected to the unpackaged semiconductor die and electrically connected to the first lead.

8. The device of claim 1, wherein the first lead includes a strain relief portion.

9. The device of claim 1, including a layer of non-conductive material covering the unpackaged semiconductor die.

10. The device of claim 3, wherein the rectifier includes a Schottky rectifier.

11. The device of claim 6, wherein the first conductive tab includes molybdenum.

12. The device of claim 7, wherein the second conductive tab includes molybdenum.

13. The device of claim 9, wherein the layer of non-conductive material includes epoxy.

14. An electrical device, comprising:

a first substrate;

a second substrate facing the first substrate;

an unpackaged semiconductor die electrically and thermally connected to the first substrate;

a first lead electrically connected between the unpackaged semiconductor die and the second substrate;

a second lead electrically connected between the first and second substrates;

a first conductive tab interposed between the unpackaged semiconductor die and the first substrate; and

a second conductive tab interposed between the unpackaged semiconductor die and the first lead.

15. The device of claim 14, wherein:

the unpackaged semiconductor die includes silicon;

the first conductive tab includes molybdenum; and

the second conductive tab includes molybdenum.

16. The device of claim 14, wherein:

the first substrate includes an insulated metal substrate; and

the second substrate includes a circuit board.

17. The device of claim 14, wherein the first lead includes a strain relief portion.

18. A converter, comprising:

a first substrate;

a second substrate facing the first substrate;

an unpackaged rectifier electrically and thermally connected to the first substrate;

a first lead electrically connected between the rectifier and the second substrate;

a second lead electrically connected between the first and second substrates; and

a transformer electrically connected to the second substrate.

19. The converter of claim 18, wherein:

the first substrate includes an insulated metal substrate; and

the second substrate includes a circuit board.

20. The converter of claim 18, wherein the rectifier is a Schottky rectifier.

21. The converter of claim 18, wherein the rectifier is one of a plurality of unpackaged rectifiers electrically and thermally connected to the first substrate.

22. The converter of claim 18, wherein the rectifier is facing the transformer.

23. The converter of claim 18, wherein the converter is encapsulated.