Acoustic 3D analysis of circuit structures

• US 6,430,728 B1
• Filed: 09/30/1999
• Issued: 08/06/2002
• Est. Priority Date: 09/30/1999
• Status: Expired due to Fees

• Current Assignee: Advanced Micro Devices SDN Berhad (Advanced Micro Devices, Inc.)
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Goruganthu, Rama R., Bruce, Michael R., Birdsley, Jeffrey D., Davis, Brennan V., Ring, Rosalinda M.
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): Kik, Phallaka
• Application Number:
  US09/410,147
• Time in Patent Office: 1,041 Days
• Field of Search: 716/1-21, 700/108-110, 702/54, 702/58-59, 702/103, 702/117, 702/118, 324/512, 324/520, 324/537, 324/765
• US Class Current: 324/520
• CPC Class Codes: G01R 31/307 of integrated circuits
• CPC Class Codes: G10K 15/046 using optical excitation, e.g. laser bundle

Abstract

According to an example embodiment, the present invention is directed to a system and method for analyzing an integrated circuit. A laser is directed to the back side of an integrated circuit and causes local heating, which generates acoustic energy in the circuit. The acoustic energy propagation in the integrated circuit is detected via at least two detectors. Using the detected acoustic energy from the detectors, at least one circuit defect is detected and located.

Claims

1. A method for analyzing an integrated circuit, wherein the circuit has circuitry in a circuit side opposite a back side, the method comprising:

removing substrate from the back side and exposing a target region;

directing a laser at the target region and generating local heating in the integrated circuit;

detecting acoustic energy propagation in the integrated circuit via at least two acoustic energy detectors;

using the detected acoustic energy at each acoustic energy detector to generate parameters; and

using the acoustic energy detected at each detector to locate at least one defect in the circuit as a function of the parameters.

2. A method for analyzing an integrated circuit, according to claim 1, further comprising controlling the substrate removal process responsive to the detected acoustic energy.

3. A method for analyzing an integrated circuit, according to claim 1, wherein directing a laser at the target region in the back side of the integrated circuit includes pulsing the laser.

4. A method for analyzing an integrated circuit, according to claim 3, further comprising maintaining pn junctions near their operating voltage.

5. A method for analyzing an integrated circuit, according to claim 1, wherein the laser is synchronized with the at least two acoustic energy detectors, and wherein locating at least one defect includes detecting a phase shift of the detected acoustic energy at each acoustic energy detector.

6. A method for analyzing an integrated circuit, according to claim 1, wherein using the detected acoustic energy at each acoustic energy detector to generate parameters ineludes using a computer arrangement.

7. A method for analyzing an integrated circuit, according to claim 1, wherein locating at least one defect in the circuit as a function of the parameters includes locating at least one of:

an open circuit and a short circuit.

8. A method for analyzing an integrated circuit, according to claim 7, wherein locating at least one defect in the circuit as a function of the parameters includes comparing the parameters to at least one standard parameter for a non-defective integrated circuit.

9. A method for analyzing an integrated circuit, according to claim 8, wherein detecting acoustic energy propagation in the integrated circuit having a lower frequency and amplitude than the standard parameter indicates a short circuit.

10. A method for analyzing an integrated circuit, according to claim 8, wherein detecting an acoustic energy propagation in the integrated circuit having a higher frequency and amplitude than the standard parameter indicates an open circuit.

11. A method for analyzing an integrated circuit, according to claim 8, wherein removing substrate from the back side and exposing a target region includes removing an amount of substrate that corresponds to an amount of substrate removed from the non-defective integrated circuit when the at least one standard parameter was ascertained.

12. A method for analyzing an integrated circuit, according to claim 1, wherein the integrated circuit is not powered.

13. A method for analyzing an integrated circuit, according to claim 1, further comprising:

pulsing the laser several times; and

making a series of phase measurements for each pulse via the at least two detectors.

14. A method for analyzing an integrated circuit, according to claim 13, wherein making a series of phase measurements includes making measurements for different frequencies.

15. A method for analyzing an integrated circuit, according to claim 1, further comprising adjusting the wavelength of the laser and directing acoustic energy to target circuitry.

16. A method for analyzing an integrated circuit, according to claim 15, wherein the target circuitry is located at a depth into the substrate, and wherein the wavelength is adjusted to direct energy at that depth.

17. A system for analyzing an integrated circuit having circuitry in a circuit side opposite a back side, the system comprising:

means for removing substrate from the back side;

a laser device adapted to generate acoustic energy in the integrated circuit, affecting circuit activity

means for detecting acoustic energy propagation in the integrated circuit via at least two locations;

means for using the detected acoustic energy propagation to generate a parameter; and

means for detecting at least one defect in the circuit based on the geterated parameter.

18. A system for analyzing an integrated circuit having circuitry in a circuit side opposite a back side, the system comprising:

a substrate removal device;

a laser configured and arranged to generate acoustic energy in the integrated circuit affecting circuit activity;

at least two acoustic energy detectors to detect acoustic energy in the integrated circuit; and

a computer configured and arranged to use detected acoustic energy and generate a parameter that is used to locate at least one defect in the integrated circuit.

19. A system for analyzing an integrated circuit, according to claim 18, wherein the laser, the at least two acoustic energy detectors, and the computer are communicatively coupled.

20. A system for analyzing an integrated circuit, according to claim 19, wherein the computer is configured and arranged to control the laser.

21. A system for analyzing an integrated circuit, according to claim 18, wherein the computer is further configured and arranged to locate at least one defect in the integrated circuit using the detected acoustic energy.

22. A system for analyzing an integrated circuit, according to claim 21, wherein the computer is configured and arranged to detect at least one of:

a short circuit and an open circuit.