Apparatus and method for fabricating a microbattery
First Claim
Patent Images
1. A microbattery, comprising:
- a) a dielectric porous membrane;
b) a first electrode containing anodic material mounted on one side of the porous membrane;
c) a second electrode containing cathodic material mounted on the opposite side of the porous membrane;
d) a first silicon frame mounted with the first electrode and on the side opposite the porous membrane;
e) a second silicon frame mounted with the second electrode and on the side opposite the porous membrane; and
f) electrical connectors passing through each frame for providing electrical connectivity from the first and second electrodes to external circuitry.
3 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and method for fabricating a microbattery that uses silicon as the structural component, packaging component, and semiconductor to reduce the weight, size, and cost of thin film battery technology is described. When combined with advanced semiconductor packaging techniques, such a silicon-based microbattery enables the fabrication of autonomous, highly functional, integrated microsystems having broad applicability.
-
Citations
15 Claims
-
1. A microbattery, comprising:
-
a) a dielectric porous membrane;
b) a first electrode containing anodic material mounted on one side of the porous membrane;
c) a second electrode containing cathodic material mounted on the opposite side of the porous membrane;
d) a first silicon frame mounted with the first electrode and on the side opposite the porous membrane;
e) a second silicon frame mounted with the second electrode and on the side opposite the porous membrane; and
f) electrical connectors passing through each frame for providing electrical connectivity from the first and second electrodes to external circuitry. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A microbattery, comprising:
-
a) a dielectric porous membrane;
b) a first electrode containing anodic material mounted on one side of the porous membrane;
c) a second electrode containing cathodic material mounted on the opposite side of the porous membrane;
d) a first frame mounted with the first electrode and on the side opposite the porous membrane, and wherein the first frame is conducting or semiconducting;
e) a first dielectric layer on the side of the first frame facing the porous membrane; and
f) a second frame mounted with the second electrode and on the side opposite the porous membrane, and wherein the second frame is conducting or semiconducting;
g) a second dielectric layer on the side of the second frame facing the porous membrane; and
h) electrical connectors passing through each frame for providing electrical connectivity from the first and second electrodes to external circuitry. - View Dependent Claims (7, 8, 9, 10)
-
-
11. A microbattery, comprising:
-
a) a dielectric porous membrane;
b) a first electrode comprising a honeycomb cell structure in silicon containing anodic material mounted on one side of the porous membrane;
c) a second electrode comprising a honeycomb cell structure in silicon containing cathodic material mounted on the opposite side of the porous membrane;
d) a first frame mounted with the first electrode and on the side opposite the porous membrane;
e) a second frame mounted with the second electrode and on the side opposite the porous membrane; and
f) electrical connectors passing through each frame for providing electrical connectivity from the first and second electrodes to external circuitry. - View Dependent Claims (12)
-
-
13. A microbattery, comprising:
-
a) a dielectric porous membrane;
b) a first electrode containing anodic material mounted on one side of the porous membrane;
c) a second electrode containing cathodic material mounted on the opposite side of the porous membrane;
d) a first frame mounted with the first electrode and on the side opposite the porous membrane;
e) a second frame mounted with the second electrode and on the side opposite the porous membrane; and
f) electrical connectors comprising a plurality of through-frame plated vias passing through each frame for providing electrical connectivity from the first and second electrodes to external circuitry. - View Dependent Claims (14, 15)
-
Specification