Method for forming a flip chip pressure sensor die package

• US 6,432,737 B1
• Filed: 01/03/2001
• Issued: 08/13/2002
• Est. Priority Date: 01/03/2001
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): HOANG, QUOC DINH
• Application Number:
  US09/754,239
• Time in Patent Office: 587 Days
• Field of Search: 438/48, 438/51, 438/53, 257/419, 257/619
• US Class Current: 438/53
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a custom substrate having holes. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard flip chip techniques.

The resulting array of pressure sensor sub-assemblies is then molded, so that a cavity is formed that is open at the bottom of each hole in the custom substrate. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of the hole in the substrate. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the hole. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Claims

1. A method for making a pressure sensor die package comprising:

providing a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

providing a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said substrate further comprising a hole connecting said substrate first surface and said substrate second surface, said hole being located in said die attach region of said substrate first surface;

attaching said pressure sensor die first surface to said substrate first surface in said die attach region such that a first region of said pressure sensor die first surface covers said hole in said die attach region; and

applying encapsulant to at least a portion of said substrate first surface and said pressure sensor die second surface, said encapsulant comprising an outer surface.

2. The method for making a pressure sensor die package of claim 1, further comprising:

filling at least a portion of said hole in said substrate with coupling gel such that said coupling gel covers said first region of said pressure sensor die first surface.

3. The method for making a pressure sensor die package of claim 2, wherein said hole in said substrate has a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square.

4. The method for making a pressure sensor die package of claim 2, wherein said hole in said substrate is filled with coupling gel to approximately at least 80% above said first region of said first surface of said pressure sensor die.

5. The method for making a pressure sensor die package of claim 2 further comprising:

forming solder bumps, said solder bumps electrically connecting electrical contacts on said pressure sensor die first surface to electrical contacts on said substrate first surface in a flip-chip configuration.

6. The method for making a pressure sensor die package of claim 5, wherein said pressure sensor die is an absolute pressure sensor die.

7. The method for making a pressure sensor die package of claim 6, further comprising:

forming a plurality of solder balls on electrical contacts on said substrate second surface.

8. The method for making a pressure sensor die package of claim 6, further comprising:

forming a plurality pins on electrical contacts on said substrate second surface.

9. The method for making a pressure sensor die package of claim 6, further comprising:

forming a plurality leadless chip carrier contacts on electrical contacts on said substrate second surface.

10. The method for making a pressure sensor die package of claim 5, further comprising:

forming an encapsulant through hole in said encapsulant, said encapsulant through hole extending from said outer surface of said encapsulant to a first region of said second surface of said pressure sensor die.

11. The method for making a pressure sensor die package of claim 10, wherein said pressure sensor die is a differential pressure sensor die, said differential pressure sensor die comprising a die hole connecting said second surface of said differential pressure sensor die to a cavity formed in said differential pressure sensor die;

and

at least partially aligning said die hole with said encapsulant through hole.

12. The method for making a pressure sensor die package of claim 11, further comprising:

forming a plurality of solder balls on electrical contacts on said substrate second surface.

13. The method for making a pressure sensor die package of claim 11, further comprising:

forming a plurality pins on electrical contacts on said substrate second surface.

14. The method for making a pressure sensor die package of claim 11, further comprising:

forming a plurality leadless chip carrier contacts on electrical contacts on said substrate second surface.

15. The method for making a pressure sensor die package of claim 11, wherein said pressure sensor die package has a thickness measured from said substrate second surface to said encapsulant outer surface of approximately 1.8 mm.

16. The method for making a pressure sensor die package of claim 2, wherein said pressure sensor die package has a thickness measured from said substrate second surface to said encapsulant outer surface of approximately 1.8 mm.

17. A method for making pressure sensor die packages comprising:

providing a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

forming an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said array substrate comprising a plurality of holes connecting said array substrate first surface and said array substrate second surface, wherein;

each die attach region of said plurality of die attach regions has a corresponding one of said plurality of holes therein;

attaching each of said pressure sensor die first surfaces to said array substrate first surface in a corresponding one of said die attach regions such that a first region of each of said pressure sensor die first surfaces covers said corresponding hole in each of said die attach regions; and

applying encapsulant to at least a portion of said array substrate first surface and said pressure sensor die second surfaces, said encapsulant comprising an outer surface.

18. The method for making pressure sensor die packages of claim 17, further comprising:

filling at least a portion of each of said plurality of holes in said array substrate with coupling gel such that each of said first regions of said first surfaces of said plurality of pressure sensor dice is covered by said coupling gel.

19. The method for making pressure sensor die packages of claim 18, further comprising:

forming solder bumps, said solder bumps electrically connecting electrical contacts on each of said plurality of pressure sensor dice first surfaces to electrical contacts on said array substrate first surface.

20. The method for making pressure sensor die packages of claim 19, wherein each of said plurality of pressure sensor dice is an absolute pressure sensor die.

21. The method for making pressure sensor die packages of claim 19, further comprising:

forming a plurality of encapsulant through holes in said encapsulant, each encapsulant through hole of said plurality of encapsulant through holes extending from said encapsulant outer surface to a first region of said first surface of each of said plurality of pressure sensor dice.

22. The method for making pressure sensor die packages of claim 21, wherein each of said plurality of pressure sensor dice is a differential pressure sensor die, said plurality of differential pressure sensor dice each comprising a die hole connecting said second surface of each of said differential pressure sensor dice to a cavity formed in each of said differential pressure sensor dice;

and

at least partially aligning each of said die holes with one of said plurality of array substrate through holes.

23. A method for making a pressure sensor die package comprising:

providing a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

providing a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said substrate further comprising a hole connecting said substrate first surface and said substrate second surface, said hole being located in said die attach region of said substrate first surface, said hole in said substrate comprising a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square;

attaching said pressure sensor die first surface to said substrate first surface in said die attach region such that a first region of said pressure sensor die first surface covers said hole in said die attach region;

applying encapsulant to at least a portion of said substrate first surface and said pressure sensor die second surface, said encapsulant comprising an outer surface; and

filling at least a portion of said hole in said substrate with coupling gel such that said coupling gel covers said first region of said pressure sensor die first surface.

24. A method for making a pressure sensor die package comprising:

providing a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface, said pressure sensor die comprising a differential pressure sensor die with a die hole connecting said second surface of said differential pressure sensor die to a cavity formed in said differential pressure sensor die;

providing a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said substrate further comprising a hole connecting said substrate first surface and said substrate second surface, said hole being located in said die attach region of said substrate first surface, said hole in said substrate comprising a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square;

attaching said pressure sensor die first surface to said substrate first surface in said die attach region such that a first region of said pressure sensor die first surface covers said hole in said die attach region;

applying encapsulant to at least a portion of said substrate first surface and said pressure sensor die second surface, said encapsulant comprising an outer surface;

filling at least a portion of said hole in said substrate with coupling gel such that said coupling gel covers said first region of said pressure sensor die first surface;

forming an encapsulant through hole in said encapsulant, said encapsulant through hole extending from said outer surface of said encapsulant to a first region of said second surface of said pressure sensor die; and

at least partially aligning said die hole with said encapsulant through hole.

25. A method for making pressure sensor die packages comprising:

providing a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

forming an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said array substrate comprising a plurality of holes connecting said array substrate first surface and said array substrate second surface, wherein;

each die attach region of said plurality of die attach regions has a corresponding one of said plurality of holes therein;

attaching each of said pressure sensor die first surfaces to said array substrate first surface in a corresponding one of said die attach regions such that a first region of each of said pressure sensor die first surfaces covers said corresponding hole in each of said die attach regions;

applying encapsulant to at least a portion of said array substrate first surface and said pressure sensor die second surfaces, said encapsulant comprising an outer surface; and

filling at least a portion of each of said plurality of holes in said array substrate with coupling gel such that each of said first regions of said first surfaces of said plurality of pressure sensor dice is covered by said coupling gel.

26. A method for making pressure sensor die packages comprising:

providing a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface, each of said plurality of pressure sensor dice comprising a differential pressure sensor die, said plurality of pressure sensor dice each comprising a die hole connecting said second surface of each of said pressure sensor dice to a cavity formed in each of said pressure sensor dice;

forming an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said array substrate comprising a plurality of holes connecting said array substrate first surface and said array substrate second surface, wherein;

each die attach region of said plurality of die attach regions has a corresponding one of said plurality of holes therein;

attaching each of said pressure sensor die first surfaces to said array substrate first surface in a corresponding one of said die attach regions such that a first region of each of said pressure sensor die first surfaces covers said corresponding hole in each of said die attach regions;

applying encapsulant to at least a portion of said array substrate first surface and said pressure sensor die second surfaces, said encapsulant comprising an outer surface;

filling at least a portion of each of said plurality of holes in said array substrate with coupling gel such that each of said first regions of said first surfaces of said plurality of pressure sensor dice is covered by said coupling gel;

forming a plurality of encapsulant through holes in said encapsulant, each encapsulant through hole of said plurality of encapsulant through holes extending from said encapsulant outer surface to a first region of said first surface of each of said plurality of pressure sensor dice; and

at least partially aligning each of said die holes with one of said plurality of array substrate through holes.