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Method for forming a flip chip pressure sensor die package

  • US 6,432,737 B1
  • Filed: 01/03/2001
  • Issued: 08/13/2002
  • Est. Priority Date: 01/03/2001
  • Status: Expired due to Term
First Claim
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1. A method for making a pressure sensor die package comprising:

  • providing a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

    providing a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said substrate further comprising a hole connecting said substrate first surface and said substrate second surface, said hole being located in said die attach region of said substrate first surface;

    attaching said pressure sensor die first surface to said substrate first surface in said die attach region such that a first region of said pressure sensor die first surface covers said hole in said die attach region; and

    applying encapsulant to at least a portion of said substrate first surface and said pressure sensor die second surface, said encapsulant comprising an outer surface.

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