Gas distribution apparatus for semiconductor processing
First Claim
1. A method of processing a substrate in a reaction chamber wherein a gas distribution system includes a support member defining a baffle chamber therein, the support member having a first gas supply opening into a central area of the baffle chamber and a second gas supply opening into a peripheral area of the baffle chamber, a baffle arrangement located in the baffle chamber such that gas from the first gas supply passes through first openings in baffle arrangement and gas from the second gas supply passes through second openings in the baffle arrangement, and a showerhead supported by the support member such that the gas passing through the first and second openings mixes together and passes through third openings in the showerhead, the method comprising:
- supplying a semiconductor substrate to the reaction chamber;
supplying process gas to the first and second gas supplies such that the process gas flows through the baffle arrangement without mixing until the process gas passes through the baffle arrangement after which the mixed process gas passes through the showerhead and into an interior of the reaction chamber; and
processing the semiconductor substrate with the process gas passing through the showerhead.
0 Assignments
0 Petitions
Accused Products
Abstract
A gas distribution system for uniformly or non-uniformly distributing gas across the surface of a semiconductor substrate. The gas distribution system includes a support plate and a showerhead which are secured together to define a gas distribution chamber therebetween. A baffle assembly including one or more baffle plates is located within the gas distribution chamber. The baffle arrangement includes a first gas supply supplying process gas to a central portion of the baffle chamber and a second gas supply supplying a second process gas to a peripheral region of the baffle chamber. Because the pressure of the gas is greater at locations closer to the outlets of the first and second gas supplies, the gas pressure at the backside of the showerhead can be made more uniform than in the case with a single gas supply. In one arrangement, the first and second gas supplies open into a plenum between a top baffle plate and a temperature controlled support member wherein the plenum is divided into the central and peripheral regions by an O-ring. In a second arrangement, the first gas supply opens into the central region above an upper baffle plate and the second gas supply opens into the periphery of a plenum between the upper baffle plate and a lower baffle plate.
337 Citations
17 Claims
-
1. A method of processing a substrate in a reaction chamber wherein a gas distribution system includes a support member defining a baffle chamber therein, the support member having a first gas supply opening into a central area of the baffle chamber and a second gas supply opening into a peripheral area of the baffle chamber, a baffle arrangement located in the baffle chamber such that gas from the first gas supply passes through first openings in baffle arrangement and gas from the second gas supply passes through second openings in the baffle arrangement, and a showerhead supported by the support member such that the gas passing through the first and second openings mixes together and passes through third openings in the showerhead, the method comprising:
-
supplying a semiconductor substrate to the reaction chamber;
supplying process gas to the first and second gas supplies such that the process gas flows through the baffle arrangement without mixing until the process gas passes through the baffle arrangement after which the mixed process gas passes through the showerhead and into an interior of the reaction chamber; and
processing the semiconductor substrate with the process gas passing through the showerhead. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification