Molded assembly with heating element captured therein

• US 6,433,317 B1
• Filed: 04/07/2000
• Issued: 08/13/2002
• Est. Priority Date: 04/07/2000
• Status: Expired due to Term

• Current Assignee: Watlow Electric Manufacturing Company
• Original Assignee: Watlow Polymer Technologies
• Inventors: Schlesselman, John W., Laken, Keith, Papenfuss, Ronald E., Arx, Theodore Von
• Primary Examiner(s): PAIK, SANG YEOP
• Application Number:
  US09/544,873
• Time in Patent Office: 858 Days
• Field of Search: 219/443.1, 219/465.1, 219/467.1, 219/468.1, 219/468.2, 219/211, 219/212, 219/527, 219/528, 219/529, 219/544, 219/545, 219/546, 219/547, 219/548, 219/549, 219/552, 219/553
• US Class Current: 219/468.1
• CPC Class Codes: A47G 19/2288 with means for keeping liquid cool or hot
• CPC Class Codes: A47J 27/004 with integral electrical heating means drinking cups with integral heating means A47J36/2466
• CPC Class Codes: A47J 27/2105 of the cordless type, i.e. whereby the water vessel can be plugged into an electrically-powered base element
• CPC Class Codes: A47J 36/2461 with electrical heating means
• CPC Class Codes: H05B 2203/002 Heaters using a particular layout for the resistive material or resistive elements
• CPC Class Codes: H05B 2203/003 using serpentine layout
• CPC Class Codes: H05B 2203/013 Heaters using resistive films or coatings
• CPC Class Codes: H05B 2203/014 Heaters using resistive wires or cables not provided for in H05B3/54
• CPC Class Codes: H05B 2203/017 Manufacturing methods or apparatus for heaters
• CPC Class Codes: H05B 2203/033 Heater including particular mechanical reinforcing means
• CPC Class Codes: H05B 3/00 Ohmic-resistance heating
• CPC Class Codes: H05B 3/18 the conductor being embedded in an insulating material
• CPC Class Codes: H05B 3/26 heating conductor mounted on insulating base for transparent areas H05B3/84, H05B3/86
• CPC Class Codes: H05B 3/28 heating conductor embedded in insulating material
• CPC Class Codes: Y10T 29/49083 Heater type
• CPC Class Codes: Y10T 29/49087 with envelope or housing
• CPC Class Codes: Y10T 29/49098 Applying terminal
• CPC Class Codes: Y10T 29/49101 Applying terminal
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections. The resistance heating element is easily fixed in a position between the first and second molded sections and is capable of providing heat on vertical, horizontal and contoured surfaces.

Claims

1. A heated element assembly, comprising:

(a) a first molded section;

(b) a second molded section shaped to mate with said first molded section; and

(c) a resistance heating element, comprising;

(i) a supporting substrate having a first surface thereon; and

(ii) an electrical resistance heating material fastened to said supporting substrate, said electrical resistance heating material forming a predetermined circuit path having a pair of terminal end portions,

wherein said first and second molded sections are connected so to substantially encompass said circuit path such that at least a portion of said heating element is secured in a gapped area defined between said first and second molded sections by a mechanical fit between said molded sections.

2. The heated element assembly of claim 1, wherein said resistance heating element further comprises a second supporting substrate having a second surface thereon, said electrical resistance heating material fastened between said supporting substrate and said second supporting substrate.

3. The heated element assembly of claim 2, wherein a selected one of said supporting substrates is more thermally insulating than a second one of said supporting substrates.

4. The heated element assembly of claim 1, wherein said electrical resistance heating material is glued, sewn, fused, or a combination thereof to said supporting substrate.

5. The heated element assembly of claim 4, wherein said electrical resistance heating material is sewn to said supporting substrate with a thread.

6. The heated element assembly of claim 1, wherein said resistance heating element further comprises a pair of electrical conductors fixed to said terminal end portions of said electrical resistance heating material.

7. The heated element assembly of claim 1, wherein said predetermined circuit path is shaped to substantially conform to an area defined between said first molded section and said second molded section.

8. The heated element assembly of claim 1, wherein said supporting substrate comprises a woven or non-woven fibrous layer.

9. The heated element assembly of claim 8, wherein said fibrous layer comprises metal, polymer, glass, graphite, synthetic or natural fibers.

10. The heated element assembly of claim 1, wherein said supporting substrate is porous.

11. The heated element assembly of claim 1, wherein said first and second molded sections are connected to each other at a seam formed between said molded sections, said seam being formed, at least in part, by spin welding, melt bonding, sonic welding, vibration welding, hot air welding, diffusion bonding, fasteners, a snap fitting, or combination thereof.

12. The heated element assembly of claim 1, wherein said first and second molded sections are fused together.

13. The heated element assembly of claim 1, wherein said electrical resistance heating material does not contact said molded sections.

14. The heated element assembly of claim 1, wherein a selected one of said molded sections is more thermally conductive than the other molded section.

15. The heated element assembly of claim 14, wherein said more thermally conductive molded section is thinner than said other molded section.

16. The heated element assembly of claim 14, wherein said more thermally conductive molded section is formed from a material that is more thermally conductive than a material forming said other molded section.

17. The heated element assembly of claim 14, wherein said more thermally conductive molded section includes a thermally conductive additive.

18. A heated element assembly, comprising:

(a) a first molded polymeric section;

(b) a second molded polymeric section shaped to mate with said first molded polymeric section; and

(c) a resistance heating element, comprising;

(i) a heat resistant supporting substrate having a first surface thereon;

(ii) an electrical resistance heating material sewn with a thread to said first heat resistant supporting substrate, said electrical resistance heating material forming a predetermined circuit path having a pair of terminal end portions; and

(iii) a pair of electrical conductors fixed to said terminal end portion of said electrical resistance heating material,

wherein said first and second molded polymeric sections are connected so to substantially encompass said circuit path, such that at least a portion of said heating element is secured between said first and second molded sections by a mechanical fit between said molded sections and said electrical resistance heating material is spaced apart from said first and second molded sections by an air gap.

19. The heated element assembly of claim 18, wherein said resistance heating element further comprises a second heat resistant supporting substrate having a second surface thereon, said electrical resistance heating material sewn with a thread between said heat resistant supporting substrate and said second heat resistant supporting substrate.

20. The heated element assembly of claim 19, wherein a selected one of said supporting substrates is more thermally insulating than a second one of said supporting substrates.

21. The heated element assembly of claim 18, wherein said predetermined circuit path is shaped to substantially conform to an area defined between said first molded section and said second molded section.

22. The heated element assembly of claim 18, wherein said first and second molded sections are connected to each other at a seam formed between said molded sections, said seam being formed, at least in part, by spin welding, melt bonding, sonic welding, vibration welding, diffusion bonding, hot air welding, fasteners, a snap fitting, or combination thereof.

23. The heated element assembly of claim 18, wherein said first and second molded sections are fused together.

24. The heated element assembly of claim 18, wherein a selected one of said molded sections is more thermally conductive than the other molded section.

25. The heated element assembly of claim 24, wherein said more thermally conductive molded section is thinner than said other molded section.

26. The heated element assembly of claim 24, wherein said more thermally conductive molded section is formed from a material that is more thermally conductive than a material forming said other molded section.

27. The heated element assembly of claim 24, wherein said more thermally conductive molded section includes a thermally conductive additive.