Packaging micromechanical devices

• US 6,433,411 B1
• Filed: 05/22/2000
• Issued: 08/13/2002
• Est. Priority Date: 05/22/2000
• Status: Expired due to Term

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agere Systems Guardian Corp. (Broadcom, Inc.), Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Degani, Yinon, Tai, King Lien, Dudderar, Thomas Dixon
• Primary Examiner(s): Abraham, Fetsum
• Assistant Examiner(s): Andujar, Leonardo
• Application Number:
  US09/575,883
• Time in Patent Office: 813 Days
• Field of Search: 257/678-798
• US Class Current: 257/678
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]

Abstract

The specification describes packaging assemblies for micro-electronic machined mechanical systems (MEMS). The MEMS devices in these package assemblies are based on silicon MEMS devices on a silicon support and the MEMS devices and the silicon support are mechanically isolated from foreign materials. Foreign materials pose the potential for differential thermal expansion that deleteriously affects optical alignment in the MEMS devices. In a preferred embodiment the MEMS devices are enclosed in an all-silicon chamber. Mechanical isolation is also aided by using a pin contact array for interconnecting the silicon support substrate for the MEMS devices to the next interconnect level. The use of the pin contact array also allows the MEMS devices to be easily demountable for replacement or repair.

Claims

1. A micro-electronic machined mechanical (MEMS) assembly comprising a silicon chamber having a silicon base and silicon sidewalls, and a MEMS device mounted on the silicon base within the silicon chamber.

2. The assembly of claim 1 wherein the MEMS device is a photonic device and wherein the assembly further includes a chamber top comprising a transparent window.

3. The assembly of claim 2 wherein the silicon base, silicon sidewalls, and chamber top form a hermetically sealed container.

4. A micro-electronic machined mechanical (MEMS) assembly comprising:

(a) an interconnect substrate with a top and bottom surface, an array of contact pins extending from the top surface of the interconnect substrate,

(b) a chamber assembly mounted on the interconnect substrate, the chamber assembly comprising;

(i) a silicon substrate with a top and bottom surface,

(ii) silicon sidewalls attached to the top surface of the silicon substrate, the silicon sidewalls combining with the silicon substrate to form a silicon chamber,

(iii) a MEMS device mounted on the top surface of the silicon substrate within the silicon chamber, and

(iv) a plurality of electrical contact pads on only the bottom surface of the silicon substrate, each of the electrical contact pads aligned with and contacting a contact pin extending from the top surface of the interconnect substrate.

5. The assembly of claim 4 wherein the MEMS device is a photonic device and wherein the assembly further includes a chamber top for the chamber assembly, the chamber top comprising a transparent window.

6. The assembly of claim 5 wherein the silicon substrate, silicon sidewalls, and chamber top form a hermetically sealed chamber.

7. The assembly of claim 4 further including a photodiode array on the MEMS assembly and mechanical means for moving the MEMS assembly in response to signals from the photodiode array.

8. The assembly of claim 4 wherein the each of the electrical contact pads aligned with and contacting a contact pin extending from the top surface of the interconnect substrate contacts the contact pin but is not attached thereto.

9. A micro-electronic machined mechanical (MEMS) assembly comprising:

(a) an interconnect substrate with a top and bottom surface, an array of contact pins extending from the top surface of the interconnect substrate,

(b) a silicon substrate mounted on the interconnect substrate, the silicon substrate having a top surface and a bottom surface,

(c) a MEMS device mounted on the top surface of the silicon substrate,

(d) a plurality of electrical contact pads on only the bottom surface of the silicon substrate, each of the electrical contact pads aligned with and contacting a contact pin extending from the top surface of the interconnect substrate.

10. The assembly of claim 9 wherein the interconnect substrate has a recess formed in the central region thereof, and the silicon substrate and the MEMS device are contained within the recess.

11. The assembly of claim 10 further including a top covering the recess and wherein the top comprises a transparent window.

12. The assembly of claim 11 wherein the interconnection substrate and the top covering the recess in the interconnection substrate form a hermetically sealed chamber.

13. The assembly of claim 9 further including a photodiode array on the MEMS assembly and mechanical means for moving the MEMS assembly in response to signals from the photodiode array.

14. The assembly of claim 9 wherein the array of contact pins extending from the top surface of the interconnect substrate also extends from the bottom surface of the interconnect substrate.

15. The assembly of claim 14 further including a system interconnect substrate having an array of contact pads on the surface thereof, with the interconnect substrate supported by the system interconnect substrate and with the array of contact pins contacting the contact pads of the system interconnect substrate.

16. The assembly of claim 9 wherein the each of the electrical contact pads aligned with and contacting a contact pin extending from the top surface of the interconnect substrate contacts the contact pin but is not attached thereto.