Apparatus for testing an integrated circuit in an oven during burn-in
First Claim
1. A method for testing an integrated circuit (“
- IC”
) memory during burn-in, the method comprising;
placing the IC memory in a heated oven;
selecting the IC memory;
writing a data word to the IC memory, a first half of the data word being transferred on a first set of data lines, a second half of the data word being transferred on a second set of data lines, the first set of data lines and the second set of data lines each receiving signals from a set of shared data lines;
reading the IC memory, comprising;
reading a first half of a data word from the IC memory; and
reading a second half of the data word from the IC memory;
wherein the first half and the second half of the data word in the IC memory are each transferred on the set of shared data lines.
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Accused Products
Abstract
An apparatus for testing an integrated circuit in an oven during burn-in. A burn-in board in the oven is electrically connected to a plurality of integrated circuit (“ICE”) components. A driver/interface board outside the oven is electrically connected to the burn-in board through a plurality of contacts and sends and receives a plurality of signals between the IC components and a test controller. A switch module on the burn-in board comprises a plurality of high-temperature switches for transferring signals between the plurality of IC components and the driver/interface board during burn-in. A plurality of signals entering the switch module from the driver/interface board does not exceed in number the plurality of contacts, and is fewer in number than a plurality of signals exiting the switch module to the plurality of IC components.
30 Citations
3 Claims
-
1. A method for testing an integrated circuit (“
- IC”
) memory during burn-in, the method comprising;placing the IC memory in a heated oven;
selecting the IC memory;
writing a data word to the IC memory, a first half of the data word being transferred on a first set of data lines, a second half of the data word being transferred on a second set of data lines, the first set of data lines and the second set of data lines each receiving signals from a set of shared data lines;
reading the IC memory, comprising;
reading a first half of a data word from the IC memory; and
reading a second half of the data word from the IC memory;
wherein the first half and the second half of the data word in the IC memory are each transferred on the set of shared data lines. - View Dependent Claims (2, 3)
- IC”
Specification