Low metalization creep sensor
First Claim
Patent Images
1. An accelerometer comprising:
- a substrate having a proof mass and a vibratable assembly connected therewith, the proof mass and the vibratable assembly being configured to detect an acceleration force;
an adhesive layer disposed over less than an entirety of the vibratable assembly; and
a conductive path disposed over the vibratable assembly and intermittently supported in a bonded relationship therewith through the adhesive layer, said bonded relationship consisting of a reduced bonding area that is less than the area of said conductive path.
0 Assignments
0 Petitions
Accused Products
Abstract
Performance-enhancing, reduced-area metalization adhesion areas in force-sensing transducers are described.
26 Citations
9 Claims
-
1. An accelerometer comprising:
-
a substrate having a proof mass and a vibratable assembly connected therewith, the proof mass and the vibratable assembly being configured to detect an acceleration force;
an adhesive layer disposed over less than an entirety of the vibratable assembly; and
a conductive path disposed over the vibratable assembly and intermittently supported in a bonded relationship therewith through the adhesive layer, said bonded relationship consisting of a reduced bonding area that is less than the area of said conductive path. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification