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Low metalization creep sensor

  • US 6,435,029 B1
  • Filed: 10/30/2000
  • Issued: 08/20/2002
  • Est. Priority Date: 08/14/1997
  • Status: Expired due to Fees
First Claim
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1. An accelerometer comprising:

  • a substrate having a proof mass and a vibratable assembly connected therewith, the proof mass and the vibratable assembly being configured to detect an acceleration force;

    an adhesive layer disposed over less than an entirety of the vibratable assembly; and

    a conductive path disposed over the vibratable assembly and intermittently supported in a bonded relationship therewith through the adhesive layer, said bonded relationship consisting of a reduced bonding area that is less than the area of said conductive path.

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