Multi-function chamber for a substrate processing system

• US 6,435,868 B2
• Filed: 12/07/2000
• Issued: 08/20/2002
• Est. Priority Date: 05/20/1998
• Status: Expired due to Fees

• Current Assignee: Applied Komatsu Technology, Inc.
• Original Assignee: Applied Komatsu Technology, Inc.
• Inventors: White, John M., Blonigan, Wendell T., Richter, Michael W.
• Primary Examiner(s): WILSON, GREGORY A
• Application Number:
  US09/732,159
• Publication Number:
  US 20010000747A1
• Time in Patent Office: 621 Days
• Field of Search: 432/4, 432/5, 432/18, 432/24, 432/129, 432/184, 432/247, 432/249, 432/253, 414/217, 414/222, 414/225, 219/390, 118/719, 118/722, 118/724, 118/725, 118/728
• US Class Current: 432/247
• CPC Class Codes: H01L 21/67098 Apparatus for thermal treatment
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67236 the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece

Abstract

A load lock chamber includes a chamber body having an aperture to allow a substrate to be transferred into or out of the chamber. The load lock chamber is configurable in several configurations, including a base configuration for providing a transition between two different pressures, a heating configuration for heating the substrate and providing a transition between two different pressures, and a cooling configuration for cooling the substrate and providing a transition between two different pressures. Various features of the chamber configurations help increase the throughput of the system by enabling rapid heating and cooling of substrates and simultaneous evacuation and venting of the chamber, and help compensate for thermal losses near the substrate edges, thereby providing a more uniform temperature across the substrate.

Claims

1. A method of processing a substrate in a processing chamber, the method comprising:

decreasing the volume of the chamber from a first processing volume to a second processing volume;

supporting the substrate on a substrate support mechanism within the chamber;

changing the pressure in the chamber from a first pressure to a second pressure; and

controlling surface temperatures in the chamber to compensate for thermal losses near edges of the substrate.

2. The method of claim 1, further comprising heating the substrate in the processing chamber by conduction.

3. The method of claim 2, further comprising transferring the substrate from the support mechanism onto a heating platen.

4. The method of claim 1 further comprising heating the substrate in the processing chamber by radiation.

5. The method of claim 4, wherein heating the substrate by radiation comprises:

raising the substrate to a heating position near a stationary plate; and

heating the stationary plate so that the plate has a temperature gradient that generally increases from a point near a center of the plate to a point near a perimeter of the plate.

6. The method of claim 1, further comprising:

transferring the substrate from the support mechanism onto a heating platen; and

moving the heating platen to a position within the chamber to reduce a viewing angle of the substrate edge with respect to walls of the chamber.

7. The method of claim 1, wherein decreasing the volume of the chamber comprises positioning at least one volume reducing element therein.

8. The method of claim 7, wherein the volume reducing element comprises materials selected from plastics, metals, and combinations thereof.

9. The method of claim 7, further comprising replacing the volume reducing element with at least one heating assembly.

10. The method of claim 9, further comprising positioning at least one heating assembly above the substrate support.

11. The method of claim 9, further comprising positioning the at least one heating assembly below the substrate support.

12. The method of claim 11, wherein controlling surface temperatures in the chamber comprises maintaining a higher temperature near the periphery of the heating assembly with respect to the center of the heating assembly.

13. The method of claim 12, wherein maintaining a higher temperature near the periphery of the heating assembly with respect to the center of the heating assembly comprises heating at least one outer heating loop of the heating assembly to a higher temperature with respect to at least one inner heating loop of the heating assembly.

14. The method of claim 7 further comprising configuring the processing chamber as a load lock chamber.

15. The method of claim 14, further comprising configuring the load lock chamber as an input load lock chamber and wherein the first pressure is atmospheric pressure and the second pressure is a processing pressure.

16. The method of claim 14, further comprising configuring the load lock chamber as an output load lock chamber and wherein the first pressure is a processing pressure and the second pressure is atmospheric pressure.

17. The method of claim 14, further comprising providing a gas to the chamber to transition the first pressure to the second pressure.

18. The method of claim 17, wherein the gas comprises an inert gas.

19. The method of claim 17, wherein the gas comprises nitrogen, argon, and combinations thereof.

20. A method of processing a substrate in a processing chamber, comprising:

decreasing the volume of the chamber from a first processing volume to a second processing volume;

supporting the substrate on a substrate support mechanism within the chamber;

changing the pressure in the chamber from a first pressure to a second pressure;

controlling surface temperatures in the chamber to compensate for thermal losses near edges of the substrate; and

heating the substrate in the processing chamber by conduction, wherein heating the substrate comprises transferring the substrate from the substrate support mechanism onto a heating platen and heating the platen so that an upper surface of the platen has a temperature gradient that generally increases from a point near a center of the platen to a point near a perimeter of the platen.

21. The method of claim 20, wherein decreasing the volume of the chamber from a first processing volume to a second processing volume comprises positioning at least one volume reducing element therein.

22. The method of claim 21, further comprising replacing the volume reducing element with a heating assembly.

23. A method of processing a substrate in a processing chamber, comprising:

decreasing the volume of the chamber from a first processing volume to a second processing volume;

supporting the substrate on a substrate support mechanism within the chamber;

changing the pressure in the chamber from a first pressure to a second pressure;

controlling surface temperatures in the chamber to compensate for thermal losses near edges of the substrate; and

heating the substrate in the processing chamber by conduction, wherein heating the substrate comprises;

transferring the substrate from the substrate support mechanism onto a heating platen;

heating the platen so that an upper surface of the platen has a temperature gradient that generally increases from a point near a center of the platen to a point near a perimeter of the platen; and

providing a contact area between the upper surface of the platen and a first surface area of the substrate near the perimeter of the substrate that is greater than a contact area between the upper surface of the platen and a second surface area of the substrate near the center of the substrate, wherein the first and second surface areas of the substrate are the same size.

24. The method of claim 23, wherein decreasing the volume of the chamber from a first processing volume to a second processing volume comprises positioning at least one volume reducing element therein.

25. The method of claim 24, further comprising replacing the volume reducing element with a heating assembly.