Process device

• US 6,436,230 B1
• Filed: 11/22/2000
• Issued: 08/20/2002
• Est. Priority Date: 11/26/1999
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Kondo, Tomomi, Kimura, Hidetoshi
• Primary Examiner(s): Mills, Gregory
• Assistant Examiner(s): HASSANZADEH, PARVIZ
• Application Number:
  US09/717,279
• Time in Patent Office: 636 Days
• Field of Search: 156/345.47, 156/345.34, 156/345.46, 156/345.43, 156/345.44, 156/345.49, 118/723.E, 118/723.MA, 118/723.MR, 204/298.2, 204/298.21, 204/298.22, 204/298.37, 315/111.41, 315/111.71, 315/111.21
• US Class Current: 156/345.46
• CPC Class Codes: H01J 37/32623 Mechanical discharge control means
• CPC Class Codes: H01J 37/3266 Magnetic control means

Abstract

A process device and a method for processing a substrate. A dipole ring magnet (DRM) is arranged in a manner so that a leakage magnetic field in the neighborhood of the process device and at a position a prescribed distance therefrom is minimized. The dipole ring magnet (DRM) rotates around an outer periphery of a process chamber which has a plasma generation device, a substantially cylindrical shield plate covering an outer periphery of the dipole ring magnet. The shield is rotated coaxially with the dipole ring magnet and in a direction opposite to the rotation of the dipole ring magnet. In this way a magnetic field is generated in a direction that cancels leakage magnetic flux generated outside the dipole ring magnet.

Claims

1. A process device, comprising:

a generally cylindrical chamber accommodating a substrate to be processed;

an energy supply, disposed in the chamber, for supplying energy to a gas introduced in the chamber to convert the gas into a plasma-state gas;

a dipole ring magnet, having portions disposed cylindrically surrounding the chamber, on an outer periphery of the cylinder a plurality of magnets being disposed, the dipole ring magnet be rotated in one direction around an axis passing through a center portion of the bottom of the cylinder;

a shield plate disposed surrounding a circumference of the dipole ring magnet and supported rotatable coaxially with a rotation axis of the dipole ring magnet; and

a shield plate rotation mechanism which rotates the shield plate in a direction opposite to that of the dipole ring magnet.

2. The process device as set forth in claim 1 wherein the shield plate rotation mechanism rotates the shield plate with a rotational speed subordinate to that of the dipole ring magnet.

3. The process device as set forth in claim 2 wherein the shield plate rotation mechanism comprises:

an external ear disposed on an outer periphery surface of the dipole ring magnet;

an internal gear disposed on an inner periphery surface of the shield plate; and

a pinion gear engaging with the external gear and the internal gear.

4. The process device as set forth in claim 2 wherein the shield plate has a plurality of minute through holes bored therethrough.

5. The process device as set forth in claim 1 wherein the shield plate rotation mechanism rotates the shield plate with a rotational speed controllably set independently from a rotation of the dipole ring magnet.

6. The process device as set fort in claim 5 wherein the shield plate rotation mechanism comprises a dedicated motor disposed for the rotation thereof.

7. The process device as set forth in claim 6, further comprising a sensor at a secluded position outside the shield plate for detecting a magnetic flux density, and wherein the rotation of the motor is controlled based on the detected magnetic flux density.

8. The process device as set forth in claim 6 wherein the shield plate has a plurality of minute through holes bored therethrough.

9. The process device as set forth in claim 5, further comprising a sensor at a secluded position outside the shield plate for detecting a magnetic flux density, and wherein the shield plate rotation mechanism controls the rotational speed of the shield plate based on the detected magnetic flux density.

10. The process device as set forth in claim 5 wherein the shield plate has a plurality of minute through holes bored therethrough.

11. The process device as set forth in claim 1 wherein the shield plate has a plurality of minute through holes bored therethrough.

12. A process device, comprising:

a process chamber where processing of a substrate can be performed, the process chamber having a chamber wall;

a conductive member, disposed in the process chamber, for supplying energy to a gas introduced in the chamber to convert the gas into a plasma-state gas;

a dipole ring magnet, having portions disposed cylindrically about the chamber, for generating a magnetic field in the chamber, the dipole ring magnet rotating in one direction around an axis of the cylinder through a central portion of the bottom of the cylinder;

a shield plate disposed surrounding a circumference of the dipole ring magnet and supported rotatably without coming into contact with the dipole ring magnet; and

a shield plate rotation mechanism which rotates the shield plate so as to suppress magnetic flux leaking outside the dipole ring magnet.

13. The process device as set forth in claim 12 wherein the shield plate rotation mechanism rotates the shield plate with a rotational speed subordinate to that of the dipole ring magnet.

14. The process device as set forth in claim 13 wherein the shield plate has a plurality of minute through holes bored therethrough.

15. The process device as set forth in claim 12 wherein the shield plate rotation mechanism rotates the shield plate with a rotational speed controllably set independent from a rotation of the dipole ring magnet.

16. The process device as set forth in claim 15, further comprising a sensor at a secluded position outside the shield plate for detecting a magnetic flux density, and wherein the shield plate rotation mechanism controls a rotational speed of the shield plate based on the detected magnetic flux density.

17. The process device as set forth in claim 15 wherein the shield plate has a plurality of minute through holes bored therethrough.

18. The process device as set forth in claim 12 wherein the shield plate has a plurality of minute through holes bored therethrough.

19. A process device, comprising:

process chamber for processing a substrate;

energy supplying means, disposed in the process chamber, for supplying energy to a gas to convert the gas into a plasma-state gas;

magnetic field generating means, having portions disposed surrounding the process chamber and rotatable around an axis of the chamber that passes through a central portion of the bottom of the chamber, for generating a magnetic field in the process chamber;

magnetic flux shielding means, disposed surrounding a circumference of the magnetic field generating means without coming into contact therewith, for shielding magnetic flux leaking outside the magnetic field generating means; and

rotating means for rotating the magnetic flux shielding means so that the magnetic flux is suppressed from leaking.

20. The process device as set forth in claim 19 wherein the rotating means rotates the magnetic flux shielding means with a rotational speed subordinate to that of the magnetic field generating means.