Thick adherent dielectric films on plastic substrates and method for depositing same

• US 6,436,739 B1
• Filed: 04/27/2000
• Issued: 08/20/2002
• Est. Priority Date: 04/27/2000
• Status: Expired due to Fees

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Wickboldt, Paul, Theiss, Steven D., Smith, Patrick M., Ellingboe, Albert R.
• Primary Examiner(s): LEBENTRITT, MICHAEL
• Application Number:
  US09/560,058
• Time in Patent Office: 845 Days
• Field of Search: 438/149, 438/151, 438/152, 438/166
• US Class Current: 438/149
• CPC Class Codes: C23C 14/10 Glass or silica
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: C23C 16/402 Silicon dioxide
• CPC Class Codes: C23C 16/46 characterised by the method used for heating the substrate C23C16/48, C23C16/50 take precedence

Abstract

Thick adherent dielectric films deposited on plastic substrates for use as a thermal barrier layer to protect the plastic substrates from high temperatures which, for example, occur during laser annealing of layers subsequently deposited on the dielectric films. It is desirable that the barrier layer has properties including: a thickness of 1 μm or greater, adheres to a plastic substrate, does not lift-off when cycled in temperature, has few or no cracks and does not crack when subjected to bending, resistant to lift-off when submersed in fluids, electrically insulating and preferably transparent. The thick barrier layer may be composed, for example, of a variety of dielectrics and certain metal oxides, and may be deposited on a variety of plastic substrates by various known deposition techniques. The key to the method of forming the thick barrier layer on the plastic substrate is maintaining the substrate cool during deposition of the barrier layer. Cooling of the substrate maybe accomplished by the use of a cooling chuck on which the plastic substrate is positioned, and by directing cooling gas, such as He, Ar and N₂, between the plastic substrate and the cooling chucks. Thick adherent dielectric films up to about 5 μm have been deposited on plastic substrates which include the above-referenced properties, and which enable the plastic substrates to withstand laser processing temperatures applied to materials deposited on the dielectric films.

Claims

1. In a method for depositing protective adherent dielectric films on a plastic substrate incapable of withstanding temperatures of above about 200°

C. for a sustained time period, the improvement comprising;

maintaining the plastic substrate at or below room temperature during deposition.

2. The improvement of claim 1, wherein the temperature is maintained by positioning the plastic substrate on a cooling chuck.

3. The improvement of claim 2, additionally including supplying a gas intermediate the cooling chuck and the plastic substrate.

4. The improvement of claim 3, additionally including selecting the gas from the group consisting of He, Ar, N₂, and other gases which do not significantly disturb the deposition process.

5. The improvement of claim 2, additionally providing at least one opening in the cooling chuck, and directing a gas through the at least one opening and intermediate the plastic substrate and an adjacent surface of the cooling chuck.

6. The improvement of claim 5, additionally including selecting the gas from the group consisting of He, Ar, N₂.

7. The improvement of claim 1, additionally including depositing the adherent dielectric films to a thickness in the range of 1 μ

m to about 5 μ

m.

8. The improvement of claim 1, additionally including depositing the adherent dielectric film from a material selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, metal oxides, amorphous silicon, and amorphous germanium.

9. The improvement of claim 8, wherein the material selected is silicon oxide and is deposited to a thickness of at least 1 μ

m.

10. The improvement of claim 1, additionally including selecting the plastic substrate from the group consisting of PET, PEN, and KAPTON.

11. The improvement of claim 1, additionally including depositing the adherent dielectric film by deposition techniques selected from the group consisting of plasma CVD using RF, DC, ECR, and Helicon plasma sources, thermal CVD, evaporation, sputtering, and reactive sputtering.

12. A method for depositing at least 1 μ

m thick protective adherent dielectric films on plastic substrates, comprising;

maintaining the plastic substrate at about room temperature, and

using a material source method to form a film of material on a surface of the plastic substrate.

13. The method of claim 12, wherein maintaining the plastic substrate at about room temperature is carried out by placing the substrate on a cooled substrate holder.

14. The method of claim 13, additionally including directing a cooling gas intermediate the substrate and the cooling substrate holder.

15. The method of claim 12, wherein the material source method is selected from the group of evaporation, sputtering, reactive sputtering, or PEcup using ECR, helicon, rf, dc or arc-jet plasma sources.

16. The method of claim 15, wherein a plasma is directed toward the substrate and deposition material.

17. The method of claim 16, wherein additionally a source material is introduced either as a gas or by evaporation or sputtering, and the source material reacts with the plasma, thereon to produce an adherent film selected from the group consisting of SiO_x, SiN_x, SiC_x, SiN_xO_y, Al₂O₃, and MgO.