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Thick adherent dielectric films on plastic substrates and method for depositing same

  • US 6,436,739 B1
  • Filed: 04/27/2000
  • Issued: 08/20/2002
  • Est. Priority Date: 04/27/2000
  • Status: Expired due to Fees
First Claim
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1. In a method for depositing protective adherent dielectric films on a plastic substrate incapable of withstanding temperatures of above about 200°

  • C. for a sustained time period, the improvement comprising;

    maintaining the plastic substrate at or below room temperature during deposition.

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