Sensor element having temperature measuring means

• US 6,439,056 B1
• Filed: 08/20/1999
• Issued: 08/27/2002
• Est. Priority Date: 02/20/1997
• Status: Expired due to Term

• Current Assignee: MKS Instruments Incorporated
• Original Assignee: MKS Instruments Incorporated
• Inventors: Jonsson, Staffan
• Primary Examiner(s): Oen, William
• Application Number:
  US09/377,832
• Time in Patent Office: 1,103 Days
• Field of Search: 737/08, 737/18, 737/24, 737/14, 361/283, 361/283.4
• US Class Current: 73/708
• CPC Class Codes: G01L 19/0092 Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass

Abstract

A pressure sensor of substantially ceramic material comprises a rigid housing having a thick base plate, an interior shielding plate, and a movable diaphragm. A cavity providing a reference pressure is formed between the shielding plate and the diaphragm and on the opposite walls thereof are electrodes, which form a capacitor, the capacity of which is sensed. A temperature sensor comprises thermistors positioned inside the housing, between the base plate and the shielding plate, with the reference resistors on the surface of the base plate facing outwards. The shielding plate is thin, so that the thermistors are located near the diaphragm and are sensitive to the temperature thereof. Therefore the temperature sensor element has minimum influence on the electric properties of the pressure sensor and in particular on the mechanical properties of the diaphragm.

Claims

1. A pressure sensor comprising:

a pressure sensor housing assembly of substantially ceramic material, and including;

a substantially rigid housing part,

an at least partly movable diaphragm attached to the housing, and

a cavity formed between the substantially rigid housing part and the at least partly movable diaphragm,

the substantially rigid housing part comprising a base plate and a shielding plate that is thinner than the base plate, the shielding plate having a surface which forms a wall in the cavity,

at least one temperature sensor located between the base plate and the shielding plate and positioned so as to not to interfere with pressure sensing by electrodes in the cavity.

4. The pressure sensor of claim 1, wherein the at least one temperature sensor is located at the periphery of said substantially rigid housing part and is positioned so as not to interfere with electrical fields at central portions of said substantially rigid housing part and the at least partly movable diaphragm.

5. The pressure sensor of claim 1, wherein said substantially rigid housing part comprises a thicker base plate and a thinner shielding plate, the thinner shielding plate having a surface, which forms a wall in the cavity, the at least one temperature sensor located between the thicker base plate and the thinner shielding plate.

6. The pressure sensor of claim 5, wherein said substantially rigid housing part comprises a joint attaching the thicker base plate to the thinner shielding plate, the at least one temperature sensor located between an interior surface of the thicker base plate and the joint.

7. The pressure sensor of claim 5, wherein said substantially rigid housing part comprises an electrically conducting, shielding layer located between the thicker base plate and the thinner shielding plate.

8. The pressure sensor of claim 7, wherein the shielding layer is located centrally in a contact surface between the thicker base plate and the thinner shielding plate.

9. The pressure sensor of claim 7, wherein the shielding layer and the at least one temperature sensor are located separately from each other as seen in directions in the contact surface between the thicker base plate and the thinner shielding plate.

10. The pressure sensor of claim 1, further comprising a first electrode centrally located on the surface of said housing part at the cavity, and a second electrode centrally located on the surface of the diaphragm at the cavity;

and wherein the area of said first electrode is somewhat smaller than the area of said second electrode.

11. The pressure sensor of claim 1, further comprising an electrode centrally located on a surface of the at least partly movable diaphragm at the cavity and an annular shielding layer made of an electrically conducting material also located on the surface of the at least partly movable diaphragm, the annular shielding layer surrounding the electrode.

12. The pressure sensor of claim 1, wherein said substantially rigid housing part has the shape of a plate and comprises two temperature sensor elements positioned opposite each other along a diameter of and symmetrically in said substantially rigid housing part in relation to a central axis of said substantially rigid housing part.

13. The pressure sensor of claim 1, further comprising at least one reference resistor applied to or at an exterior surface of said substantially rigid housing part.

14. The pressure sensor of claim 13, wherein said substantially rigid housing part has the shape of a plate and comprises two reference resistances applied opposite each other along a diameter of and symmetrically on or at said substantially rigid housing part respectively in relation to a central axis of said substantially rigid housing part.

15. The pressure sensor of claim 12, wherein said substantially rigid housing part has the shape of a substantially circular plate.

16. The pressure sensor of claim 14, wherein said substantially rigid housing part has the shape of a substantially circular plate.

2. A pressure sensor comprising:

a pressure sensor housing assembly of substantially ceramic material, and including;

a substantially rigid housing part,

an at least partly movable diaphragm attached to the housing, and

a cavity formed between the substantially rigid house part and the at least partly movable diaphragm, the cavity containing pressure sensing electrodes,

the substantially rigid housing part comprising a ceramic plate,

at least one temperature sensor positioned in the interior of the substantially rigid housing part, separated from the cavity only by the ceramic plate, the ceramic plate being a thin plate having a thickness substantially equal to or larger than the thickness of the at least partly movable diaphragm and at most equal to twice the thickness of the at least partly movable diaphragm.

3. The pressure sensor of claim 2, wherein said ceramic plate separating the at least one temperature sensor from the cavity comprises a thin plate having a thickness substantially equal to or larger than the thickness of the at least partly movable diaphragm and at most equal to twice the thickness of the at least partly movable diaphragm.

17. A pressure sensor, including a temperature sensor, comprising:

a non-deformable housing comprising a base plate and a shielding plate that is thinner than the base plate;

a diaphragm attached to the housing, the diaphragm including at least a portion movable with the pressure to be sensed;

a cavity formed between the diaphragm and a first surface of the shielding plate;

opposing electrodes formed on the diaphragm and the first surface forming a capacitor for sensing pressure; and

a temperature sensor including first resistive elements positioned between the base plate and a second surface of the shielding plate and second resistive elements positioned on an outward surface of the base plate.

18. The pressure sensor of claim 17 wherein the temperature sensor is a bridge circuit, the first resistive elements are thermistors positioned on an inward surface of the base plate and the second resistive elements are reference resistors.

19. The pressure sensor of claim 18 further comprising an electrically conducting, shielding layer located between the base plate and shielding plate.

20. The pressure sensor of claim 18 wherein the thermistors are located at a periphery of the inward surface of the base plate and at an angular distance of 90°

from the reference resistors on the outward surface of the base plate.