Apparatus for molding semiconductor components

• US 6,439,869 B1
• Filed: 08/16/2000
• Issued: 08/27/2002
• Est. Priority Date: 08/16/2000
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Kit-Tan, Kay, Seng, Toh Kok, Tay, Liang C.
• Primary Examiner(s): DAVIS, ROBERT B
• Application Number:
  US09/638,948
• Time in Patent Office: 741 Days
• Field of Search: 425/89, 425/116, 425/544, 264/272.17
• US Class Current: 425/89
• CPC Class Codes: B29C 2045/14663 the mould cavity walls being lined with a film, e.g. release film
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films and also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.

Claims

1. A molding apparatus for molding semiconductor components comprising:

a mold chase comprising a surface and a plurality of mold cavities proximate to the surface configured to retain a release film and to form molded portions on the components; and

a movable pot and a plunger configured to inject a molding compound into the mold cavities, the pot mounted for axial movement relative to the mold chase and comprising a clamping surface, the pot movable from an open position in which the clamping surface is spaced from the surface of the mold chase, to a closed position in which the clamping surface clamps the release film to the surface of the mold chase.

2. The molding apparatus of claim 1 further comprising an alignment member on the mold chase for aligning the release film to the mold cavities.

3. The molding apparatus of claim 1 wherein the mold cavities are configured to retain a leadframe and the mold cavities align with die mounting sites on the leadframe.

4. The molding apparatus of claim 1 wherein the mold chase comprises an opening wherein the movable pot is mounted and the surface comprises a chamfer on the opening.

5. A molding apparatus for a semiconductor component comprising:

a mold chase comprising a mold cavity, an opening and a surface, the mold cavity configured to receive a molding film and to form a molded portion of the component; and

a pot mounted for axial movement within the opening, the pot comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping the release film to the surface.

6. The molding apparatus of claim 5 wherein the surface comprises a chamfered portion of the opening.

7. The molding apparatus of claim 5 wherein the surface comprises a chamfered portion of the opening, and the pot comprises an enlarged clamping surface configured for mating engagement with the chamfered portion.

8. The molding apparatus of claim 5 wherein the mold chase comprises a plurality of mold cavities configured to retain a leadframe and to align with die mounting sites on the leadframe.

9. A molding apparatus for a semiconductor component comprising:

a first mold chase comprising a surface and a mold cavity configured to form a molded portion of the semiconductor component and to receive a release film for releasing the molded portion from the mold cavity;

a second mold chase configured for mating engagement with the first mold chase; and

a movable pot proximate to the first mold chase comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping the release film to the surface.

10. The molding apparatus of claim 9 wherein the first mold chase comprises an opening wherein the movable pot is mounted.

11. The molding apparatus of claim 9 wherein the second mold chase comprises a second mold cavity configured for mating engagement with the mold cavity.

12. The molding apparatus of claim 9 wherein the first mold chase comprises a plurality of mold cavities configured to retain a leadframe comprising a plurality of die mounting sites aligned with the mold cavities.

13. The molding apparatus of claim 9 wherein the clamping surface comprises an enlarged angled portion of the pot.

14. A molding apparatus for a semiconductor component comprising:

a first mold chase comprising a surface and a first mold cavity for receiving a release film;

a second mold chase comprising a second mold cavity configured for mating engagement with the first mold cavity for forming a molded portion of the semiconductor component and a runner in flow communication with the second mold cavity; and

a movable pot mounted to the first mold chase comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound through the runner into the second mold cavity, and a clamping surface for clamping the release film to the surface.

15. The molding apparatus of claim 14 further comprising a pot drive mechanism for moving the movable pot.

16. The molding apparatus of claim 14 wherein the movable pot comprises an enlarged clamping surface for clamping the release film to the surface.

17. The molding apparatus of claim 14 further comprising a second opening in the first mold chase in flow communication with the first mold cavity configured to direct a vacuum for pulling the release film into the first mold cavity.

18. The molding apparatus of claim 14 further comprising an alignment member on the first mold chase for aligning the release film to the first mold cavity.

19. The molding apparatus of claim 14 further comprising an air pressure opening in the first mold cavity for pulling the release film into the first mold cavity.

20. The molding apparatus of claim 14 wherein the component comprises an element selected from the group consisting of plastic packages, ball grid array devices, and chip scale packages.

21. A molding apparatus for molding a semiconductor component comprising:

a pair of opposing mold chases comprising mating mold cavities configured to form a molded portion of the component; and

a movable pot mounted to one of the mold chases and configured to inject a molding compound into the mold cavities, the movable pot configured to clamp a release film to the one of the mold chases to prevent the molding compound from wrinkling the release film, and to prevent the molding compound from seeping under the release film during injection into the mold cavities.

22. The molding apparatus of claim 21 further comprising an opening in the one of the mold chases wherein the movable pot is mounted having a chamfered surface for clamping the release film.

23. The molding apparatus of claim 21 further comprising an enlarged clamping surface on the movable pot for clamping the release film.

24. The molding apparatus of claim 21 wherein the component comprises an element selected from the group consisting of plastic packages, ball grid array devices, and chip scale packages.

25. A system for molding a semiconductor component comprising:

a mold chase comprising a mold cavity configured to form a molded portion of the component;

a pot mounted for axial movement relative to the mold chase, the pot comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping a release film to the mold chase; and

a drive mechanism for moving the pot.

26. The system of claim 25 wherein the drive mechanism comprises springs.

27. The system of claim 25 further comprising a drive mechanism for moving the plunger through the reservoir.

28. A system for molding a semiconductor component comprising:

a pair of opposing mold chases comprising mating mold cavities configured to form a molded portion of the component;

a movable pot mounted to one of the mold chases and configured to inject a molding compound into the mold cavities, the movable pot configured to clamp a release film to the one of the mold chases to prevent the molding compound from wrinkling the release film, and to prevent the molding compound from seeping under the release film during injection into the mold cavities; and

a drive mechanism attached to the movable pot configured to move the movable pot.

29. The system of claim 28 further comprising a clamping mechanism for clamping the mold chases together.

30. The system of claim 28 further comprising a plunger on the movable pot having an enlarged clamping surface for clamping the release film.

31. The system of claim 28 wherein the mold chases comprise a plurality of mold cavities configured to retain a leadframe and to align with die mounting sites on the leadframe.

32. The system of claim 28 further comprising a vacuum source in flow communication with the mold cavities.