Apparatus for molding semiconductor components
First Claim
1. A molding apparatus for molding semiconductor components comprising:
- a mold chase comprising a surface and a plurality of mold cavities proximate to the surface configured to retain a release film and to form molded portions on the components; and
a movable pot and a plunger configured to inject a molding compound into the mold cavities, the pot mounted for axial movement relative to the mold chase and comprising a clamping surface, the pot movable from an open position in which the clamping surface is spaced from the surface of the mold chase, to a closed position in which the clamping surface clamps the release film to the surface of the mold chase.
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Abstract
A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films and also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.
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Citations
32 Claims
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1. A molding apparatus for molding semiconductor components comprising:
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a mold chase comprising a surface and a plurality of mold cavities proximate to the surface configured to retain a release film and to form molded portions on the components; and
a movable pot and a plunger configured to inject a molding compound into the mold cavities, the pot mounted for axial movement relative to the mold chase and comprising a clamping surface, the pot movable from an open position in which the clamping surface is spaced from the surface of the mold chase, to a closed position in which the clamping surface clamps the release film to the surface of the mold chase. - View Dependent Claims (2, 3, 4)
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5. A molding apparatus for a semiconductor component comprising:
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a mold chase comprising a mold cavity, an opening and a surface, the mold cavity configured to receive a molding film and to form a molded portion of the component; and
a pot mounted for axial movement within the opening, the pot comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping the release film to the surface. - View Dependent Claims (6, 7, 8)
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9. A molding apparatus for a semiconductor component comprising:
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a first mold chase comprising a surface and a mold cavity configured to form a molded portion of the semiconductor component and to receive a release film for releasing the molded portion from the mold cavity;
a second mold chase configured for mating engagement with the first mold chase; and
a movable pot proximate to the first mold chase comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping the release film to the surface. - View Dependent Claims (10, 11, 12, 13)
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14. A molding apparatus for a semiconductor component comprising:
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a first mold chase comprising a surface and a first mold cavity for receiving a release film;
a second mold chase comprising a second mold cavity configured for mating engagement with the first mold cavity for forming a molded portion of the semiconductor component and a runner in flow communication with the second mold cavity; and
a movable pot mounted to the first mold chase comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound through the runner into the second mold cavity, and a clamping surface for clamping the release film to the surface. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A molding apparatus for molding a semiconductor component comprising:
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a pair of opposing mold chases comprising mating mold cavities configured to form a molded portion of the component; and
a movable pot mounted to one of the mold chases and configured to inject a molding compound into the mold cavities, the movable pot configured to clamp a release film to the one of the mold chases to prevent the molding compound from wrinkling the release film, and to prevent the molding compound from seeping under the release film during injection into the mold cavities. - View Dependent Claims (22, 23, 24)
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25. A system for molding a semiconductor component comprising:
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a mold chase comprising a mold cavity configured to form a molded portion of the component;
a pot mounted for axial movement relative to the mold chase, the pot comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping a release film to the mold chase; and
a drive mechanism for moving the pot. - View Dependent Claims (26, 27)
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28. A system for molding a semiconductor component comprising:
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a pair of opposing mold chases comprising mating mold cavities configured to form a molded portion of the component;
a movable pot mounted to one of the mold chases and configured to inject a molding compound into the mold cavities, the movable pot configured to clamp a release film to the one of the mold chases to prevent the molding compound from wrinkling the release film, and to prevent the molding compound from seeping under the release film during injection into the mold cavities; and
a drive mechanism attached to the movable pot configured to move the movable pot. - View Dependent Claims (29, 30, 31, 32)
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Specification