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Apparatus for molding semiconductor components

  • US 6,439,869 B1
  • Filed: 08/16/2000
  • Issued: 08/27/2002
  • Est. Priority Date: 08/16/2000
  • Status: Expired due to Fees
First Claim
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1. A molding apparatus for molding semiconductor components comprising:

  • a mold chase comprising a surface and a plurality of mold cavities proximate to the surface configured to retain a release film and to form molded portions on the components; and

    a movable pot and a plunger configured to inject a molding compound into the mold cavities, the pot mounted for axial movement relative to the mold chase and comprising a clamping surface, the pot movable from an open position in which the clamping surface is spaced from the surface of the mold chase, to a closed position in which the clamping surface clamps the release film to the surface of the mold chase.

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