Dielectric composition

• US 6,440,642 B1
• Filed: 09/15/1999
• Issued: 08/27/2002
• Est. Priority Date: 09/15/1999
• Status: Expired due to Fees

• Current Assignee: Shipley Company, LLC (Dow, Inc.)
• Original Assignee: Shipley Company, LLC (Dow, Inc.)
• Inventors: Aubry, James L., Canlas, Jennifer Patricia, Shelnut, James G., Sonnenberg, Wade
• Primary Examiner(s): Huff, Mark F.
• Assistant Examiner(s): BARRECA, NICOLE M
• Application Number:
  US09/397,301
• Time in Patent Office: 1,077 Days
• Field of Search: 430/315, 430/270.1, 430/280.1, 428/411.1, 428/901
• US Class Current: 430/315
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: H01B 3/30 plastics; resins; waxes
• CPC Class Codes: H01B 3/40 epoxy resins
• CPC Class Codes: H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0158 Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
• CPC Class Codes: H05K 3/4661 Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]

Abstract

Low VOC, dielectric compositions suitable for use in circuit board manufacture are disclosed. Also disclosed are methods of making circuit boards using the low VOC, dielectric compositions.

Claims

1. A definable composition consisting essentially of:

a) from 1 to 99% by weight of at least one low dielectric constant, crosslinkable material selected from the group consisting of polybutadiene, functionalized polybutadiene, polyphenyleneoxides, functionalized polyphenyleneoxides, polyfluorocarbons, functionalized polyfluorocarbons and mixtures thereof;

b) from 1 to 99% by weight of at least one reactive diluent; and

c) a catalyst selected from the group consisting of thermal acid generators, photoacid generators, thermal base generators, photobase generators, and mixtures thereof;

wherein the composition comprises up to 2% of organic solvent.

2. The composition of claim 1 wherein the catalyst is selected from the group consisting of thermal acid generators, photoacid generators and mixtures thereof.

3. The composition of claim 1 wherein the amount of the catalyst is in the range of 0.1 to 25% by weight, based on the weight of the composition.

4. The composition of claim 1 further comprising a crosslinking agent.

5. The composition of claim 4 wherein the amount of the crosslinking agent is in the range of 10 to 80% by weight, based on the weight of the composition.

6. The composition of claim 4 wherein the crosslinking agent is selected from the group comprising phenolic resins, amine containing compounds, epoxy containing materials, compounds containing at least two vinyl ether groups, allyl substituted aromatic compounds, and combinations thereof.

7. The composition of claim 6 wherein the crosslinking agent is selected from the group comprising phenolic resins and amine containing compounds.

8. The composition of claim 1 wherein the reactive diluent is selected from the group comprising (meth)acrylic acid monomers or polymers, alkyl(meth)acrylate monomers or polymers, (meth)acrylamide monomers and polymers, low molecular weight acetals, vinyl ethers, poly(vinyl ethers), polyamides, polyetherimides, urethanes and epoxies.

9. A substrate coated with the dielectric composition of claim 1.

10. The substrate of claim 9 wherein the substrate is a printed circuit board.

11. A definable composition consisting essentially of:

a) from 20 to 80% by weight of at least one low dielectric constant, crosslinkable material selected from the group consisting of polybutadiene, functionalized polybutadiene, polyphenyleneoxides, functionalized polyphenyleneoxides, polyfluorocarbons, functionalized polyfluorocarbons and mixtures thereof;

b) from 10 to 80% by weight of at least one crosslinking agent;

c) from 0.1 to 25% by weight of at least one catalyst selected from the group consisting of thermal acid generators, photoacid generators, thermal base generators, photobase generators, and mixtures thereof; and

d) from 5 to 60% by weight of a reactive diluent;

wherein the composition comprises up to 2% of organic solvent.

12. The composition of claim 11 wherein the crosslinking agent is selected from the group comprising phenolic resins, amine containing compounds, epoxy containing materials, compounds containing at least two vinyl ether groups, allyl substituted aromatic compounds, and combinations thereof.

13. The composition of claim 12 wherein the crosslinking agent is selected from the group comprising phenolic resins and amine containing compounds.

14. The composition of claim 11 wherein the reactive diluent is selected from the group comprising (meth)acrylic acid monomers or polymers, alkyl(meth)acrylate monomers or polymers, (meth)acrylamide monomers and polymers, low molecular weight acetals, vinyl ethers, poly(vinyl ethers), polyamides, polyetherimides, urethanes and epoxies.

15. A substrate coated with the dielectric composition of claim 11.