Method of making integrated circuit having a micromagnetic device

• US 6,440,750 B1
• Filed: 02/23/2000
• Issued: 08/27/2002
• Est. Priority Date: 06/10/1997
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Guardian Corp. (Broadcom, Inc.)
• Inventors: Lotfi, Ashraf W., Steigerwald, Michael L., Kossives, Dean P., Van Dover, R. Bruce, Schneemeyer, Lynn F., Feygenson, Anatoly
• Primary Examiner(s): Pham, Long
• Assistant Examiner(s): Shukla, Ravindra B.
• Application Number:
  US09/511,343
• Time in Patent Office: 916 Days
• Field of Search: 438/3, 257/798, 257/421, 365/145, 360/318, 360/328, 360/123, 360/125, 360/126
• US Class Current: 438/3
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/325 Magnetic layer next to second metal compound-containing layer

Abstract

A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.

Claims

1. A method of manufacturing an integrated circuit formed on a substrate having an insulator coupled thereto, comprising:

conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor;

depositing an adhesive over said insulator; and

forming said ferromagnetic core of said appropriate dimensions over said adhesive.

2. The method as recited in claim 1 wherein said conformally mapping comprises transforming said appropriate dimensions to a hyperelliptical representation.

3. The method as recited in claim 2 wherein said conformally mapping further comprises reducing said hyperelliptical representation to at least one elliptical integral.

4. The method as recited in claim 3 wherein said conformally mapping further comprises solving said at least one elliptical integral to render at least an approximation of a fringing magnetic field magnitude of said micromagnetic device.

5. The method as recited in claim 1 wherein said micromagnetic device further comprises at least one winding proximate said ferromagnetic core.

6. The method as recited in claim 5 wherein said micromagnetic device is selected from the group consisting of:

an inductor,

and a transformer.

7. The method as recited in claim 5 further comprising depositing an insulator between said at least one winding and said ferromagnetic core.

8. The method as recited in claim 1 further comprising forming a passivation layer over said substrate.

9. The method as recited in claim 8 wherein said passivation layer includes an organic polymer.

10. The method as recited in claim 1 wherein said adhesive is a metallic adhesive.