System for facilitating uniform heating temperature of photoresist

• US 6,441,349 B1
• Filed: 04/26/2000
• Issued: 08/27/2002
• Est. Priority Date: 04/26/2000
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Advanced Micro Devices SDN Berhad (Advanced Micro Devices, Inc.)
• Inventors: Singh, Bhanwar, Rangarajan, Bharath, Yedur, Sanjay K.
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): FASTOVSKY, LEONID M
• Application Number:
  US09/558,643
• Time in Patent Office: 853 Days
• Field of Search: 165/80.1, 165/80.4, 165/1, 361/234, 62/37, 385/16, 219/444.1, 219/390, 347/62, 430/330, 118/728, 324/760, 396/576, 438/702, 216/27
• US Class Current: 219/444.1
• CPC Class Codes: H01L 21/67103 mainly by conduction

Abstract

A system and method for facilitating uniform heating temperature of a material is provided. The material may be a photoresist, a top or bottom anti-reflective coating, a low K dielectric material, SOG or other spin-on material. The system can include at least one heating element and a heat transfer fluid, the heating element heating the heat transfer fluid, which in turn heats the material. The transfer fluid more evenly distributes the heat from the heating element, which can have hot and cold spots at the material.

Claims

1. A system for facilitating uniform photoresist heating temperature, comprising:

at least one heating element operative to heat a heat transfer fluid, the heat transfer fluid coupled to a substrate so as to heat a photoresist thereon.

2. The system of claim 1, wherein the heat transfer fluid is a liquid.

3. The system of claim 1, wherein the heat transfer fluid is a gas.

4. The system of claim 1, further including a shell for containing the heat transfer fluid.

5. The system of claim 4, wherein the at least one heating element is coupled to the shell and the shell is coupled to the substrate.

6. The system of claim 5, wherein the at least one heating element is inside the shell.

7. The system of claim 1, wherein the at least one heating element is a fluid heating system outside the shell and fluid is provided to the shell through a distribution line.

8. The system of claim 1, further including at least one temperature monitoring system for providing temperature information on the photoresist.

9. The system of claim 1, further including at least one temperature monitoring system for providing temperature information on the heat transfer fluid.

10. The system of claim 1, further including at least one temperature monitoring system for providing temperature information on the photoresist and the heat transfer fluid.

11. The system of claim 1, further including a first temperature monitoring system for providing temperature information on the photoresist and a second temperature monitoring system for providing temperature information the heat transfer fluid.

12. The system of claim 1, further including a temperature regulating system for regulating the temperature of the photoresist.

13. The system of claim 12, wherein the temperature regulating system regulates the temperature of the heat transfer fluid based on temperature measurements made by a temperature measurement system.

14. The system of claim 13, the temperature measurement system measuring the temperature of the photoresist.

15. The system of claim 13, the temperature measurement system measuring the temperature of the heat transfer fluid.

16. The system of claim 13, the temperature measurement system measuring the temperature of the photoresist and the heat transfer fluid.

17. The system of claim 13, wherein the temperature regulating system includes at least one processor operatively coupled to the at least one heating element, the processor receiving temperature data from the temperature measuring system, and the processor using the data to regulate the temperature of the at least one heating element.

18. A system for facilitating uniform heating temperature of a photoresist covering a substrate, comprising:

a plate for supporting the substrate, the plate including;

a surface for engaging a shell containing a heat transfer fluid,

at least one heating element operatively coupled to the plate for regulating temperature of at least portions of the photoresist, respectively, via heat conduction through the plate, shell, and substrate; and

a temperature regulating system for regulating temperature of at least a portion of the photoresist, the temperature regulating system including

a temperature measuring system; and

a processor operatively coupled to the temperature measuring system and the at least one heating element.

19. The system of claim 18, further including a memory storing acceptable temperature values for the photoresist.

20. The system of claim 18, wherein the processor controls at least one heating element to regulate the temperature of the photoresist.

21. The system of claim 20, wherein the processor controls at least one heating element via a heating element driver to regulate the temperature of the photoresist.

22. The system of claim 18, wherein the processor controls at least one heating element to regulate the temperature of the heat transfer fluid.

23. A method for facilitating uniform photoresist heating temperature, comprising:

heating a heat transfer fluid to a temperature using at least one heating element; and

coupling a substrate with the heat transfer fluid so as to heat a photoresist thereon to a temperature.

24. The method of claim 23, wherein the heat transfer fluid is a liquid.

25. The method of claim 23, wherein the heat transfer fluid is a gas.

26. The method of claim 23, wherein the heat transfer fluid is contained in a shell and the shell is coupled to the substrate.

27. The method of claim 26, wherein the heat transfer fluid is heated by at least one heating element coupled to the shell.

28. The method of claim 27, wherein the at least one heating element is inside the shell.

29. The method of claim 28, further comprising regulating the temperature of the at least one heating element.

30. The method of claim 23, further comprising regulating the temperature of the photoresist.

31. The method of claim 23, further comprising regulating the temperature of the heat transfer fluid.

32. The method of claim 23, further comprising monitoring the temperature of the heat transfer fluid and monitoring the temperature of the photoresist.

33. A system for facilitating uniform heating of a photoresist, comprising:

means for heating a heat transfer fluid to a temperature; and

means for coupling the heat transfer fluid to a substrate so as to heat a photoresist thereon to a temperature.

34. The system of claim 33, further including means for regulating the temperature of the photoresist.

35. The system of claim 33, further including means for regulating the temperature of the heat transfer fluid.

36. The system of claim 33, further including means for monitoring the temperature of the photoresist.

37. A system for facilitating uniform heating temperature of a material, comprising:

at least one heating element operative to heat a heat transfer fluid, the heat transfer fluid coupled to the material.

38. The system of claim 37, the material being a top anti-reflective coating.

39. The system of claim 37, the material being a bottom anti-reflective coating.

40. The system of claim 37, the material being a low K dielectric material.

41. The system of claim 37, the material being spin on glass.

42. The system of claim 37, the material being a spin-on material.