Bond wire pressure sensor die package

• US 6,441,503 B1
• Filed: 01/03/2001
• Issued: 08/27/2002
• Est. Priority Date: 01/03/2001
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/754,393
• Time in Patent Office: 601 Days
• Field of Search: 257/787, 257/417, 257/419, 257/687
• US Class Current: 257/787
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/141 Monolithic housings, e.g. molded or one-piece housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques.

The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool that closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Claims

1. A pressure sensor die package comprising:

a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said pressure sensor die second surface being attached to said substrate first surface in said die attach region;

encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said substrate first surface and said pressure sensor die, said encapsulant comprising a cavity over said pressure sensor die first surface such that a first region of said pressure sensor die first surface is not covered by said encapsulant; and

coupling gel, said coupling gel filling at least a portion of said cavity in said encapsulant such that said coupling gel covers said first region of said pressure sensor die first surface.

2. The pressure sensor die package of claim 1, wherein said cavity in said encapsulant has a depth perpendicular to said pressure sensor die first surface of approximately at least 0.254 mm.

3. The pressure sensor die package of claim 1, wherein said cavity in said encapsulant has a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square.

4. The pressure sensor die package of claim 1, wherein said coupling gel fills approximately at least 80% of said cavity in said encapsulant.

5. The pressure sensor die package of claim 1, further comprising:

bond wires, said bond wires electrically connecting electrical contacts on said pressure sensor die first surface to electrical contacts on said substrate first surface.

6. The pressure sensor die package of claim 5, wherein said pressure sensor die is an absolute pressure sensor die.

7. The pressure sensor die package of claim 6, further comprising:

a plurality of solder balls, said plurality of solder balls being formed on electrical contacts on said substrate second surface.

8. The pressure sensor die package of claim 6, further comprising:

a plurality pins, said plurality of pins being formed on electrical contacts on said substrate second surface.

9. The pressure sensor die package of claim 6, further comprising:

a plurality leadless chip carrier contacts, said plurality of leadless chip carrier contacts being formed on electrical contacts on said substrate second surface.

10. The pressure sensor die package of claim 1, wherein said pressure sensor die package has a thickness measured from said substrate second surface to said encapsulant outer surface of approximately 1.8 mm.

11. The pressure sensor die package of claim 5, further comprising:

a substrate through hole in said substrate, said substrate through hole extending from said substrate second surface to said substrate first surface in said die attach region.

12. The pressure sensor die package of claim 11, wherein said pressure sensor die is an differential pressure sensor die, said differential pressure sensor die comprising a die hole connecting said second surface of said differential pressure sensor die to a cavity formed in said differential pressure sensor die, said die hole being at least partially aligned with said substrate through hole.

13. The pressure sensor die package of claim 12, further comprising:

a plurality of solder balls, said plurality of solder balls being formed on electrical contacts on said substrate second surface.

14. The pressure sensor die package of claim 12, further comprising:

a plurality pins, said plurality of pins being formed on electrical contacts on said substrate second surface.

15. The pressure sensor die package of claim 12, further comprising:

a plurality leadless chip carrier contacts, said plurality of leadless chip carrier contacts being formed on electrical contacts on said substrate second surface.

16. The pressure sensor die package of claim 12, wherein said pressure sensor die package has a thickness measured from said substrate second surface to said encapsulant outer surface of approximately 1.8 mm.

17. An array of pressure sensor die packages comprising:

a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said pressure sensor dice second surfaces being attached to said die attach regions such that no more than one pressure sensor die is attached in each die attach region; and

encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said array substrate first surface and said pressure sensor dice, said encapsulant comprising a plurality of cavities over said pressure sensor dice first surfaces such that a first region of each of said pressure sensor dice first surfaces is not covered by said encapsulant.

18. The array of pressure sensor die packages of claim 17, further comprising:

coupling gel, said coupling gel filling at least a portion of each of said plurality of cavities in said encapsulant such that said first regions of said first surfaces of each of said plurality of pressure sensor dice is covered by said coupling gel.

19. The array of pressure sensor die packages of claim 18, further comprising:

bond wires, said bond wires electrically connecting electrical contacts on each of said plurality of pressure sensor dice first surfaces to electrical contacts on said substrate first surface.

20. The array of pressure sensor die packages of claim 19, wherein each of said plurality of pressure sensor dice is an absolute pressure sensor die.

21. The pressure sensor die package of claim 19, further comprising:

a plurality of substrate through holes in said array substrate, each of said plurality of substrate through holes extending from said array substrate second surface to said array substrate first surface in each of said plurality of die attach regions.

22. The array of pressure sensor die packages of claim 21, wherein each of said plurality of pressure sensor dice is a differential pressure sensor die, said plurality of differential pressure sensor dice each comprising a die hole connecting said second surface of each of said differential pressure sensor dice to a cavity formed in said differential pressure sensor dice, each of said die holes being at least partially aligned with one of said plurality of substrate through holes.

23. A pressure sensor package comprising:

pressure sensor means, said pressure sensor means comprising a pressure sensor means first surface and a pressure sensor means second surface, opposite said pressure sensor means first surface;

a support means, said support means comprising a support means first surface and a support means second surface, opposite said support means first surface, said support means first surface comprising a pressure sensor means attach region;

means for attaching said pressure sensor means second surface to said support means first surface in said pressure sensor means attach region;

means for forming a cavity over a first region of said pressure sensor means first surface, said cavity comprising side surfaces and a bottom surface wherein;

said first region of said pressure sensor means first surface is said bottom surface of said cavity and said first region of said pressure sensor means first surface is exposed at the bottom of said cavity; and

coupling means for covering said first region of said first surface of said pressure sensor means at the bottom of said cavity, said coupling means filling at least a portion of said cavity.

24. A pressure sensor die package comprising:

a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said pressure sensor die second surface being attached to said substrate first surface in said die attach region;

encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said substrate first surface and said pressure sensor die, said encapsulant comprising a cavity over said pressure sensor die first surface, said cavity in said encapsulant comprising a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square and a cavity depth perpendicular to said pressure sensor die first surface of approximately at least 0.254 mm, such that a first region of said pressure sensor die first surface is not covered by said encapsulant; and

coupling gel, said coupling gel filling at least a portion of said cavity in said encapsulant such that said coupling gel covers said first region of said pressure sensor die first surface.

25. A pressure sensor die package comprising:

a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface, said pressure sensor die comprising a differential pressure sensor die with a die hole connecting said second surface of said pressure sensor die to a cavity formed in said pressure sensor die;

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said pressure sensor die second surface being attached to said substrate first surface in said die attach region;

encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said substrate first surface and said pressure sensor die, said encapsulant comprising a cavity over said pressure sensor die first surface, said cavity in said encapsulant comprising a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square and a cavity depth perpendicular to said pressure sensor die first surface of approximately at least 0.254 mm, such that a first region of said pressure sensor die first surface is not covered by said encapsulant;

coupling gel, said coupling gel filling at least a portion of said cavity in said encapsulant such that said coupling gel covers said first region of said pressure sensor die first surface; and

a substrate through hole in said substrate, said substrate through hole extending from said substrate second surface to said substrate first surface in said die attach region wherein, said die hole is at least partially aligned with said substrate through hole.

26. An array of pressure sensor die packages comprising:

a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said pressure sensor dice second surfaces being attached to said die attach regions such that no more than one pressure sensor die is attached in each die attach region;

encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said array substrate first surface and said pressure sensor dice, said encapsulant comprising a plurality of cavities over said pressure sensor dice first surfaces such that a first region of each of said pressure sensor dice first surfaces is not covered by said encapsulant; and

coupling gel, said coupling gel filling at least a portion of each of said plurality of cavities in said encapsulant such that said first regions of said first surfaces of each of said plurality of pressure sensor dice is covered by said coupling gel.

27. An array of pressure sensor die packages comprising:

a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface, each of said plurality of pressure sensor dice being a differential pressure sensor die, said plurality of pressure sensor dice each comprising a die hole connecting said second surface of each of said pressure sensor dice to a corresponding cavity formed in each of said pressure sensor dice;

an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said pressure sensor dice second surfaces being attached to said die attach regions such that no more than one pressure sensor die is attached in each die attach region;

encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said array substrate first surface and said pressure sensor dice, said encapsulant comprising a plurality of cavities over said pressure sensor dice first surfaces such that a first region of each of said pressure sensor dice first surfaces is not covered by said encapsulant;

coupling gel, said coupling gel filling at least a portion of each of said plurality of cavities in said encapsulant such that said first regions of said first surfaces of each of said plurality of pressure sensor dice is covered by said coupling gel; and

a plurality of substrate through holes in said array substrate, each of said plurality of substrate through holes extending from said array substrate second surface to said array substrate first surface in each of said plurality of die attach regions wherein, each of said die holes is at least partially aligned with one of said plurality of substrate through holes.

28. A pressure sensor package comprising:

pressure sensor means, said pressure sensor means comprising a pressure sensor means first surface and a pressure sensor means second surface, opposite said pressure sensor means first surface;

a support means, said support means comprising a support means first surface and a support means second surface, opposite said support means first surface, said support means first surface comprising a pressure sensor means attach region;

means for attaching said pressure sensor means second surface to said support means first surface in said pressure sensor means attach region; and

means for forming a cavity over a first region of said pressure sensor means first surface, said cavity comprising side surfaces and a bottom surface wherein;

said first region of said pressure sensor means first surface is said bottom surface of said cavity and said first region of said pressure sensor means first surface is exposed at the bottom of said cavity; and

coupling means for covering said first region of said first surface of said pressure sensor means at the bottom of said cavity, said coupling means filling at least a portion of said cavity.