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Bond wire pressure sensor die package

  • US 6,441,503 B1
  • Filed: 01/03/2001
  • Issued: 08/27/2002
  • Est. Priority Date: 01/03/2001
  • Status: Expired due to Term
First Claim
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1. A pressure sensor die package comprising:

  • a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;

    a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said pressure sensor die second surface being attached to said substrate first surface in said die attach region;

    encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said substrate first surface and said pressure sensor die, said encapsulant comprising a cavity over said pressure sensor die first surface such that a first region of said pressure sensor die first surface is not covered by said encapsulant; and

    coupling gel, said coupling gel filling at least a portion of said cavity in said encapsulant such that said coupling gel covers said first region of said pressure sensor die first surface.

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