Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
DCFirst Claim
1. A process for incorporating at least one electronic element in the manufacture of a plastic device comprising the steps of:
- (a) providing first and second plastic core sheets;
(b) positioning said at least one electronic element in the absence of a non-electronic carrier directly between said first and second plastic core sheets to form a core, said plastic core sheets defining a pair of inner and outer surfaces of said core;
(c) positioning said core in a laminator apparatus, and subjecting said core to a heat and pressure cycle, said heat and pressure cycle comprising the steps of;
(I) heating said core to a first period of time;
(II) applying a first pressure to said core for a second prior of time such that said at least one electronic element is encapsulated by said core;
(III) cooling said core while applying a second pressure to said core;
(d) coating at least one of said outer surfaces of said core with a layer of ink; and
(e) applying a layer of overlaminate film to at least one outer surface of said core.
1 Assignment
Litigations
0 Petitions
Accused Products
Abstract
A ultra-thin flexible durable radio frequency plastic of other substrate identification device, such as cards, tags, badges, bracelets and labels including at least one electronic element embedded therein and a hot or cold lamination process for the manufacture of radio frequency identification devices including a micro IC chip embedded therein. The process results in a device having an overall thickness in the range of 0.005 inches to 0.033 inches with a surface suitable for receiving dye sublimation printing—the variation in the device thickness across the surface is less than 0.0005 inches. The hot lamination process of the present invention results in an aesthetically pleasing device which can be used as a sticker when adhesive is applied to the device. The invention also relates to a plastic device in all shapes and sizes formed in accordance with the hot lamination process of the present invention and can withstand harsh chemicals and various pressures.
-
Citations
18 Claims
-
1. A process for incorporating at least one electronic element in the manufacture of a plastic device comprising the steps of:
-
(a) providing first and second plastic core sheets;
(b) positioning said at least one electronic element in the absence of a non-electronic carrier directly between said first and second plastic core sheets to form a core, said plastic core sheets defining a pair of inner and outer surfaces of said core;
(c) positioning said core in a laminator apparatus, and subjecting said core to a heat and pressure cycle, said heat and pressure cycle comprising the steps of;
(I) heating said core to a first period of time;
(II) applying a first pressure to said core for a second prior of time such that said at least one electronic element is encapsulated by said core;
(III) cooling said core while applying a second pressure to said core;
(d) coating at least one of said outer surfaces of said core with a layer of ink; and
(e) applying a layer of overlaminate film to at least one outer surface of said core. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 18)
(a) positioning an overlaminate film on at least one ink coated surface of said core;
(b) subjecting said core to a second heat and pressure cycle comprising the steps of;
(I) heating said core to a temperature between approximately 175°
F. to 300°
F. for approximately 10 to 25 minutes;
(II) applying approximately 1000 p.s.i. ram pressure to said core; and
(III) cooling said core to a temperature in the range of approximately 40°
F. to 65°
F. for approximately 10 to 25 minutes.
-
-
13. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a micro-chip and an associated antenna of wire, copper etched, screen printed or litho-printed conductive inks or carbon inks.
-
14. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a micro-chip and an associated circuit board antenna.
-
15. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a read/write integrated chip and an associated antenna.
-
16. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a micro-chip and an associated printed antenna.
-
18. The process as recited in claim 15 wherein said first and second core layers are devoid of any appreciable cut outs.
-
17. A hot lamination process for the manufacture of plastic devices, said process comprising the steps of:
-
(a) providing first and second plastic core sheets;
(b) positioning at least one electronic element in the absence of a non-electronic carrier directly between said first and second plastic sheets to form a layered core;
(c) positioning said core in a laminator apparatus, and subjecting said core to a heat and pressure cycle, said heat and pressure cycle comprising the steps of;
(I) heating said core in said laminator apparatus, in the presence of a minimal first ram pressure, to a temperature which causes controlled flow of said plastic which makes up said first and second plastic core sheets;
(II) applying a second pressure uniformly across said core for encapsulating said at least one electronic element within said controlled flow plastic;
(III) subsequently cooling said core in conjunction with the concurrent application of a third pressure uniformly across said core, said core including upper and lower surfaces.
-
Specification