Electronic device

• US 6,442,028 B2
• Filed: 05/03/2001
• Issued: 08/27/2002
• Est. Priority Date: 05/09/2000
• Status: Expired due to Fees

• Current Assignee: Sony Computer Entertainment Incorporated (Sony Group Corp.)
• Original Assignee: Sony Computer Entertainment Incorporated (Sony Group Corp.)
• Inventors: Yamazaki, Kouichi
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US09/848,679
• Publication Number:
  US 20010043462A1
• Time in Patent Office: 481 Days
• Field of Search: 165/80.3, 165/185, 174/16.3, 174/35.R, 174/252, 361/687, 361/704, 361/705, 361/707, 361/709-712, 361/715, 361/717-719, 361/816, 361/818
• US Class Current: 361/704
• CPC Class Codes: G11B 31/003 with radio receiver
• CPC Class Codes: G11B 31/02 with automatic musical instruments
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
• CPC Class Codes: H05K 9/002 with localised screening
• CPC Class Codes: H05K 9/0022 of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218

Abstract

An electronic device having a circuit board, a shielding plate disposed thereon and a three-terminal regulator is provided with a heat sink positioned on the outer side of the circuit board and connected to the three-terminal regulator. The heat of three-terminal regulator is radiated from the heat sink, thus making it possible to prevent heating of the shielding plate. In this way, electronic device elements that do not stand up very well to heat, such as an optical pickup unit, can be placed directly on shielding plate, so that the heat of three-terminal regulator is efficiently dissipated and the size of the electronic devices may be reduced.

Claims

1. An electronic device comprising:

a) a circuit board on which is mounted a computation processing device and on which is formed a power supply wiring pattern for supplying electric power to said computation processing device,

b) at least one metal shielding plate covering said circuit board,

c) a regulator for stabilizing the supplied voltage mounted on said power supply wiring pattern,

d) a heat radiator provided on said regulator and positioned on the outer side of said circuit board as seen approximately from the direction normal to the board plane of said circuit board, and

e) an opening formed in said at least one metal shielding plate through which a portion of said regulator protrudes without coming into contact with said at least one shielding plate, and said heat radiator is connected to said portion of said regulator protruding through said opening.

2. An electronic device in accordance with claim 1, wherein said electronic device is contained within a cabinet, said cabinet further comprising an inner rim surface and a plurality of engagement parts arranged on said inner rim surface on which is mounted said heat radiator.

3. An electronic device in accordance with claim 2, wherein said cabinet further comprises protrusions that contact said at least one metal shielding plate and are formed in positions away from the connection between said heat radiator and said regulator.

4. An electronic device in accordance with claim 2, wherein said heat radiator further comprises a plurality of slots for sliding engagement of said heat radiator with said engagement parts on said cabinet.

5. An electronic device in accordance with claim 4, wherein said heat radiator further comprises a first portion removably attached to said engagement parts and a second portion removably attached to said regulator, said first and second portions being disposed at an angle with respect to each other.

6. An electronic device in accordance with claim 5, wherein said first and second portions of said heat radiator are disposed perpendicularly with respect to each other.

7. An electronic device in accordance with claim 6, wherein said heat radiator is clipped to said regulator.

8. An electronic device in accordance with claim 2, wherein said heat radiator further comprises protrusions that secure the connection between the at least one metal shielding plate and the circuit board.

9. An electronic device in accordance with claim 8, wherein said heat radiator protrusions are L-shaped.