Solder-packaged optical MEMs device and method for making the same

• US 6,442,307 B1
• Filed: 11/03/2000
• Issued: 08/27/2002
• Est. Priority Date: 11/03/2000
• Status: Expired due to Term

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agere Systems Guardian Corp. (Broadcom, Inc.), Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Jin, Sungho, Soh, Hyongsok, Pardo, Flavio, Greywall, Dennis S., Carr, Dustin W.
• Primary Examiner(s): Kim, Robert H.
• Assistant Examiner(s): WANG, GEORGE Y
• Application Number:
  US09/705,350
• Time in Patent Office: 662 Days
• Field of Search: 385/14, 385/18, 359/245
• US Class Current: 385/18
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: B81C 3/002 Aligning microparts
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 6/266 the optical element being an attenuator
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/3556 NxM switch, i.e. regular arrays of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/356 in an optical cross-connect device, e.g. routing and switching aspects of interconnecting different paths propagating different wavelengths to (re)configure the various input and output links switching polarized beams G02B6/3594; power equalizers G02B6/356 and G02B6/3594; path selecting means H04Q11/0001
• CPC Class Codes: G02B 6/357 Electrostatic force electrostatic forces controlling reflecting elements in general G02B26/0841
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: G02B 6/3594 Characterised by additional functional means, e.g. means for variably attenuating or branching or means for switching differently polarized beams

Abstract

In accordance with the invention, a MEMs mirror device comprises a mirror layer including a frame structure and at least one mirror movably coupled to the frame and an actuator layer including at least one conductive path and at least one electrode for moving the mirror. The mirror layer and the actuator layer are provided with metallization pads and are bonded together in lateral alignment and with predetermined vertical gap spacing by solder bonds between the pads. The device has utility in optical cross connection, variable attenuation and power gain equalization.

Claims

1. A micro-electro-mechanical device comprising:

a mirror layer comprising a frame, at least one mirror and a plurality of solder wettable metallized regions, the mirror movably coupled to the frame;

an actuation layer comprising at least one conductive path at least one electrode and a plurality of solder wettable metallized regions;

the mirror layer and the actuation layer bonded together by solder joints between metallized regions on the respective layers with a gap spacing and in lateral alignment so that the movement of the mirror is controlled by an electrical signal applied to the electrode.

2. The device of claim 1 wherein the mirror layer comprises a plurality of mirrors disposed in an array and the actuation layer comprises a plurality of electrodes laterally aligned for controlling the movement of the plurality of mirrors.

3. The device of claim 1 wherein the actuation layer comprises a plurality of electrodes for controlling each mirror.

4. The device of claim 1 wherein the mirror is coupled to the frame via a movable gimbal.

5. The device of claim 1 wherein the vertical gap spacing between the mirror layer and actuation layer is within ±

10% of a predetermined gap spacing and the lateral alignment is with an accuracy of ±

5% of the mirror effective diameter.

6. The device of claim 5 wherein the vertical gap spacing between the mirror layer and actuation layer is within ±

5% of a predetermined gap spacing and the lateral alignment is with an accuracy of ±

1% of the mirror effective diameter.

7. The device of claim 1 wherein the mirror layer comprises silicon.

8. The device of claim 1 wherein the actuator layer comprises silicon.

9. The device of claim 1 wherein the mirror comprises a metal layer comprising Au, Ag, or Al.

10. The device of claim 1 further comprising one or more spacers between the mirror layer and the actuator layer to control the gap spacing between the layers.

11. The device of claim 10 wherein said one or more spacers is pre-attached to one of the mirror layer or the actuator layer and solder bonded to metallization pads on the other layer.

12. The device of claim 10 wherein said one or more spacers is solder bonded to metallization pads on the mirror layer and metallization pads on the actuator layer.

13. The device of claim 10 wherein the spacer comprises a metal, ceramic, silicon or polymer material.

14. The device of claim 1 further comprising at least one spacer between 1o the mirror layer and the actuator layer wherein the spacer extends around more than 20% of the boundary around the mirror for aerodynamic isolation.

15. The device of claim 10 wherein the CTE of the spacer differs by less than 20% from the CTE of the solder.

16. The device of claim 10 wherein the spacer is attached to either the mirror layer or the actuator layer.

17. The device of claim 10 wherein the spacer is a permanent spacer.

18. The device of claim 10 wherein the spacer is a drop-in permanent spacer which is vertically trapped by compressive stress caused by solder joint solidification and thermal contraction.

19. The device of claim 10 wherein the spacer is laterally aligned and constrained by an alignment notch.

25. In an optical cross connect system comprising a plurality of input optical fibers, a plurality of input optical fibers, a plurality of output optical fibers and an optical MEMs device including a plurality of mirrors aligned for receiving optical signals from respective input fibers and reflecting the signals to respective output fibers,

The improvement wherein the optical MEMs device is a device according to claim 1.

26. An optical variable attenuator comprising:

at least one input optical fiber;

at least one output optical fiber; and

at least one optical MEMs device according to claim 1, the device mirror aligned to receive an optical signal from the input fiber and to reflect a portion of the input signal to the output fiber, the size of the portion reflected to the output fiber chosen in accordance with the desired attenuation.

27. An optical power gain equalizer system comprising:

a plurality of input optical fibers;

a plurality of output optical fibers; and

at least one optical MEMs device according to claim 2, the mirrors of the array aligned to receive optical signals from respective input fibers and to reflect portions of the input signals to respective output fibers, the size of the respective portions chosen to equalize the respective output signals.

28. The device of claim 1 wherein the mirror layer comprises a composite layer of silicon, insulator and silicon.

29. The device of claim 28 wherein the mirror is formed on the layer of silicon proximal the actuation layer.

30. The device of claim 28 wherein the mirror is formed on the layer of silicon distal from the actuation.

31. The device of claim 30 wherein the layer of silicon proximal the actuation layer is configured to at least partially enclose the region underlying the mirror between the mirror and the actuation layer.

32. The device of claim 31 wherein the layer of silicon proximal the actuation layer is doped with impurities or coated with conductive material to provide electrostatic shielding of the mirror.

20. A method of making an optical MEMs device comprising a mirror layer including at least one mirror movably coupled to the layer and an actuator layer including at least one conductive path and at least one electrode for moving the mirror, comprising the steps of:

a) forming a plurality of solder-wettable metallization pads on a surface of the mirror layer and on a mating surface of the actuator level,

b) applying solder between metalization pads of the respective layers; and

c) heating and bonding together the respective layers by forming solder joints of predetermined gap spacing between the metallization pads of the respective layers.

21. The method of claim 20 wherein the quantity of solder between metallization pads is chosen to provide the predetermined gap spacing.

22. The method of claim 20 further comprising the step of disposing a spacer between the layers to control the spacing between them.

23. The method of claim 22 wherein the spacer is removed after formation of the solder joints.

24. The method of claim 22 wherein the spacer is left between the layers after formation of the solder joints.