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Method and apparatus for dynamic sampling of a production line

  • US 6,442,496 B1
  • Filed: 08/08/2000
  • Issued: 08/27/2002
  • Est. Priority Date: 08/08/2000
  • Status: Expired due to Fees
First Claim
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1. A method, comprising:

  • processing a first plurality of semiconductor wafers based upon at least one control input parameter signal;

    calculating a minimum sampling rate of semiconductor wafers;

    selecting and analyzing wafers from the first plurality of said semiconductor wafers at the calculated sampling rate;

    quantifying the performance of said processing of said first plurality of semiconductor wafers, based upon said analyzed wafers; and

    performing a dynamic sampling process based upon said quantification of the performance of said processing of semiconductor wafers.

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