Optical module with solder bond

• US 6,443,631 B1
• Filed: 02/20/2001
• Issued: 09/03/2002
• Est. Priority Date: 02/20/2001
• Status: Expired due to Fees

• Current Assignee: CyberOptics Corporation (Nordson Corporation)
• Original Assignee: Avanti Optics Corporation
• Inventors: Case, Steven K., Skunes, Timothy A., Mowry, Gregory S.
• Primary Examiner(s): Healy, Brian
• Assistant Examiner(s): Wood, Kevin S
• Application Number:
  US09/789,185
• Publication Number:
  US 20020114592A1
• Time in Patent Office: 560 Days
• Field of Search: 385/49, 385/50, 385/51, 385/52, 385/88-94, 385/97, 385/98, 385/137, 385/138
• US Class Current: 385/91
• CPC Class Codes: G02B 6/255 Splicing of light guides, e.g. by fusion or bonding
• CPC Class Codes: G02B 6/2553 Splicing machines, e.g. optical fibre fusion splicer
• CPC Class Codes: G02B 6/2555 Alignment or adjustment devices for aligning prior to splicing
• CPC Class Codes: G02B 6/32 having lens focusing means positioned between opposed fibre ends with lens being an integral part of the single fibre end G02B6/262
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3873 Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
• CPC Class Codes: G02B 6/4207 with optical elements reducing the sensitivity to optical feedback anti-reflection devices specially adapted for lasers, see H01S3/0064
• CPC Class Codes: G02B 6/4221 involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4225 by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/4227 Active alignment methods, e.g. procedures and algorithms
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4236 Fixing or mounting methods of the aligned elements
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material

Abstract

An optical module for use in an optical device is provided which includes an optical component. The optical component is bonded to a relative reference mount which can be attached to couple to a fixed reference mount. The bond is formed by solder.

Claims

1. An optical module for use in an optical device, comprising:

an optical component;

a relative reference mount which supports the optical component, the relative reference mount having a registration feature configured to couple to a registration feature of a fixed reference mount, the registration features configured to provide a coupling at a fixed position relative to the fixed reference mount, the coupling repeatable in six degrees of freedom; and

solder configured to secure the optical component at a fixed position relative to the relative reference mount registration feature whereby the optical component position is fixed in six degrees of freedom at a prealigned position relative to the relative reference mount registration feature.

2. The optical module of claim 1 including a heater element configured to melt the solder.

3. The optical module of claim 1 including a bonding pad on the relative reference mount to promote adhesion of the relative reference mount to the solder.

4. The optical module of claim 1 including a bonding pad operably coupled to the optical component to promote adhesion of the optical component to the solder.

5. The optical module of claim 1 wherein the optical component is mounted to an optical component mount which is bonded by the solder to the relative reference mount.

6. The optical module of claim 1 wherein the solder is distributed over an area to reduce strain applied to the optical component.

7. The optical module of claim 2 including electrical conductors coupled to the heater element.

8. The optical module of claim 7 wherein the heater element comprises an electrically resistive element.

9. The optical module of claim 2 wherein the heater element is coupled to the relative reference mount.

10. The optical module of claim 2 including at least one additional heater element and wherein the heater elements are actuated sequentially.

11. The optical module of claim 5 wherein the optical component mount and the relative reference mount are substantially planar.

12. The optical module of claim 1 the relative reference mount includes a registration feature configured to align with a substrate.

13. The optical module of claim 1 wherein prior to bonding the solder has a tapered region and a large surface area region wherein during the bonding process solder flows from the tapered region toward the large surface area region.

14. The optical module of claim 1 including a bonding material surrounding the solder to provide additional stability.

15. The optical module of claim.1 wherein solder provides an electrical connection to the optical component.

16. The optical module of claim 1 wherein the optical component mount and relative reference mount are substantially planar and positioned substantially parallel to each other.

17. A method of making an optical module comprising:

obtaining an optical component;

obtaining a relative reference mount;

positioning the relative reference mount and the optical component proximate each other with solder therebetween, wherein there is a gap between the solder and at least one of the relative reference mount and the optical component;

heating the solder to cause the solder to change state and flow into and fill the gap due to a surface tension effect;

cooling the solder to thereby fix the relative positions of the relative reference mount and the optical component; and

wherein positioning comprises positioning with six degrees of freedom.

18. The method of claim 17 wherein positioning includes positioning the optical component relative to a registration feature on the relative reference mount.

19. The method of claim 17 wherein surface tension causes the solder to flow into and fill the gap by the step of heating.

20. The method of claim 17 wherein heating the solder comprises energizing an electrical heater element.

21. The method of claim 20 including electrically contacting contacts which couple to the electrical heating element.

22. The method of claim 17 wherein heating the solder comprises applying radiation to the solder.

23. The method of claim 17 wherein the solder has a large surface area region and a tapered region to heating and wherein during the step of heating the solder from the tapered region flows towards the large surface area region.

24. An optical module made in accordance with the method of claim 17.

25. The method of claim 17 wherein the relative reference mount and the optical component mount are substantially planar and the positioning places them substantially parallel to each other.

26. The method of claim 17 wherein the solder fixes the optical component in six degrees of freedom relative to the relative reference mount.

31. The method of claim 20 including electrically contacting contacts which couple to the electrical heating element.

27. A method of making an optical module comprising:

obtaining an optical component;

obtaining a relative reference mount;

positioning the relative reference mount and the optical component proximate each other with solder therebetween, wherein there is a gap between the solder and at least one of the relative reference mount and the optical component;

heating the solder to cause the solder to change state and. flow into and fill the gap due to a surface tension effect;

cooling the solder to thereby fix the relative positions of the relative reference mount and the optical component; and

wherein the solder fixes the optical component in six degrees of freedom relative to the relative reference mount.

28. The method of claim 27 wherein positioning includes positioning the optical component relative to a registration feature on the relative reference mount.

29. The method of claim 27 wherein surface tension causes the solder to flow into and fill the gap by the step of heating.

30. The method of claim 27 wherein heating the solder comprises energizing an electrical heater element.

32. The method of claim 27 wherein heating the solder comprises applying radiation to the solder.

33. The method of claim 27 wherein positioning comprises positioning with six degrees of freedom.

34. The method of claim 27 wherein the solder has a large surface area region and a tapered region to heating and wherein during the step of heating the solder from the tapered region flows towards the large surface area region.

35. An optical module made in accordance with the method of claim 27.

36. The method of claim 27 wherein the relative reference mount and the optical component mount are substantially planar and the positioning places them substantially parallel to each other.