Flexible silicon strain gage
First Claim
1. A method for forming a strain sensor on a flexible substrate, the method comprising the steps of:
- providing a wafer having a portion of base material and a portion of sensor material that has at least one property that varies with an applied strain;
forming said strain sensor out of said sensor material;
forming said flexible substrate over said strain sensor; and
removing at least part of said base material to expose at least part of said sensor.
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Accused Products
Abstract
A generally flexible strain gage comprising a strain sensing element, and a generally flexible substrate supporting the strain sensing element. The strain sensing element is made of single crystal or polycrystalline semiconducting material. The invention also includes a method for forming a generally flexible strain gage comprising the step of selecting a wafer having a portion of a base material and portion of a single crystal or polycrystalline semiconducting material located thereon. The method further comprises the steps of etching a strain sensing element out of the semiconducting material and forming a generally flexible substrate onto said sensing element.
73 Citations
31 Claims
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1. A method for forming a strain sensor on a flexible substrate, the method comprising the steps of:
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providing a wafer having a portion of base material and a portion of sensor material that has at least one property that varies with an applied strain;
forming said strain sensor out of said sensor material;
forming said flexible substrate over said strain sensor; and
removing at least part of said base material to expose at least part of said sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for forming a flexible strain gage comprising the steps of:
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selecting a wafer having a portion of a base material and portion of a single crystal semiconducting material or polycrystalline semiconducting material located thereon;
etching a strain sensing element out of said semiconducting material; and
forming a flexible substrate onto said sensing element;
etching away said base material after said forming step. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for forming a strain sensor array comprising the steps of:
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providing a wafer having a portion of base material and a portion of sensor material that has at least one property that varies with an applied strain;
forming a plurality of strain sensors out of said sensor material;
forming a flexible substrate over said plurality of strain sensors; and
removing at least part of said base material to expose at least part of each sensor. - View Dependent Claims (25, 26, 27)
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28. A method for forming a strain sensor on a flexible substrate, the method comprising the steps of:
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selecting a wafer having a portion of base material and a portion of sensor material;
forming said strain sensor by etching said sensor material;
directly depositing said substrate over said sensor in a liquid form;
allowing said substrate to cure such that said substrate is in a solid but flexible form; and
removing at least part of said base material to expose said sensor.
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29. A method for manufacturing a flexible strain gage comprising the steps of:
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providing a wafer having a portion of base material and a portion of sensor material that has at least one property that varies with an applied strain;
etching said sensor material to form a strain gage;
depositing at least one lead on said wafer, said at least one lead being electrically coupled to said strain gage;
depositing a flexible substrate over said substrate and said at least one lead; and
removing at least part of the base material located over said sensor and located over said at least one lead to expose said at least one lead.
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30. A method for forming a strain sensor on a flexible substrate, the method comprising the steps of:
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providing a wafer having a portion of base material and a portion of semiconducting material;
forming said strain sensor out of said portion of semiconducting material;
forming said flexible substrate over said sensor; and
removing at least part of said base material to expose at least part of said sensor. - View Dependent Claims (31)
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Specification