Three-dimensional micro-coils in planar substrates
First Claim
1. A micro-coil device comprising:
- a first silicon wafer having a trench defining an inductive cavity, said trench having metal formed therein;
a second silicon wafer having at least one hole therein for providing a non metallic path for magnetic flux to exit said inductive cavity without passing through the solid part of either of said first or said second silicon wafer;
a first metal formed on said first wafer and having a first pad connected thereto; and
a second metal formed on said second wafer and having a second pad connected thereto; and
wherein;
said first and second wafers are proximate to each other; and
said first and second metals are connected at one end to form a first coil having at least one turn and the coil is formed around an inductive cavity, and are situated between said first and second wafers.
1 Assignment
0 Petitions
Accused Products
Abstract
A three-dimensional micro-coil situated in a planar substrate. Two wafers have metal strips formed in them, and the wafers are bonded together. The metal strips are connected in such a fashion to form a coil and are encompassed within the wafers. Also, metal sheets are formed on the facing surfaces of the wafers to result in a capacitor. The coil may be a single or multi-turn configuration. It also may have a toroidal design with a core volume created by etching a trench in one of the wafers before the metal strips for the coil are formed on the wafer. The capacitor can be interconnected with the coil to form a resonant circuit. An external circuit for impedance measurement, among other things, and a processor may be connected to the micro-coil chip.
-
Citations
6 Claims
-
1. A micro-coil device comprising:
-
a first silicon wafer having a trench defining an inductive cavity, said trench having metal formed therein;
a second silicon wafer having at least one hole therein for providing a non metallic path for magnetic flux to exit said inductive cavity without passing through the solid part of either of said first or said second silicon wafer;
a first metal formed on said first wafer and having a first pad connected thereto; and
a second metal formed on said second wafer and having a second pad connected thereto; and
wherein;
said first and second wafers are proximate to each other; and
said first and second metals are connected at one end to form a first coil having at least one turn and the coil is formed around an inductive cavity, and are situated between said first and second wafers. - View Dependent Claims (2, 3)
a third metal formed on said first wafer; and
a fourth metal formed on said second wafer; and
wherein said first and second metals are situated between said first and second wafers.
-
-
3. The device of claim 2, wherein said third and fourth metals are first and second electrodes of a capacitor.
-
4. A micro-coil device comprising:
-
a first silicon wafer having a first conductive metal strip and a first conductive plate formed thereon, said first wafer further having a trench defining an inductive cavity, said trench having metal formed therein;
a second silicon wafer having a second conductive metal strip and a second conductive plate formed thereon, said first and second conductive plates forming a capacitor, said second wafer further having at least one hole therein for providing a non metallic path for magnetic flux to exit said inductive cavity without passing through the solid part of either of said first or said second silicon wafer;
wherein;
said first and second wafers are proximate to each other so that the first and second conductive strips are connected to each other, said first and second strips forming a coil having at least one turn, said inductive cavity in said trench providing a core volume for said coil. - View Dependent Claims (5, 6)
a plurality of first conductive strips and a plurality of second conductive strips; and
wherein each of first and second conductive strips of the pluralities are interconnected so as to form a toroidal inductor.
-
Specification