Thin film transistor for a liquid crystal display device and a fabrication process thereof

• US 6,445,428 B1
• Filed: 08/29/2001
• Issued: 09/03/2002
• Est. Priority Date: 05/28/1998
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Fujitsu Limited
• Inventors: Misaki, Katsunori, Fujikawa, Tetsuya
• Primary Examiner(s): DUDEK, JAMES A
• Application Number:
  US09/942,194
• Publication Number:
  US 20020047950A1
• Time in Patent Office: 370 Days
• Field of Search: 349/43, 349/46, 252/59, 252/72
• US Class Current: 349/43
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: H01L 29/41733 for thin film transistors with insulated gate
• CPC Class Codes: H01L 29/458 for thin film silicon, e.g. source or drain electrode

Abstract

A thin-film transistor of a liquid crystal display device includes an ohmic electrode such that the ohmic electrode is formed of a first conductor film of a refractory metal element defined by a first lateral edge and a second conductor film containing Al and defined by a second lateral edge, wherein the second lateral edge is receded with respect to the first lateral edge when viewed in a direction perpendicular to a substrate on which the thin-film transistor is formed.

Claims

1. A method of fabricating a thin-film transistor, comprising the steps of:

forming a gate electrode on a substrate;

forming a gate insulation film on said substrate so as to cover said gate electrode;

forming a semiconductor film on said gate insulation film;

forming an electrode layer on said semiconductor film by depositing a first conductor layer containing a refractory metal element and a second conductor layer containing Al consecutively;

applying a dry etching process to said electrode layer to form a first ohmic electrode parttern located at a first side of said gate electrode and a second ohmic electrode pattern located at a second, opposite side of said gate electrode;

covering said first and second ohmic electrode patterns by a protective insulation film such that said protective insulation film contacts each of said first and second ohmic electrode patterns intimately;

forming a contact hole in said protective insulation film so as to expose said second conductor layer at said contact hole; and

forming a pixel electrode on said protective insulation film to as to achieve an electrical contact with said second ohmic electrode pattern at said contact hole.

2. A method as claimed in claim 1, wherein said dry etching process is conducted by using a mixture of Cl₂ and BCl₃.

3. A method as claimed in claim 1, wherein said dry etching process is conducted such that an etching rate of said second conductor film in a lateral direction thereof is equal to or larger than an etching rate of said first conductor film in said lateral direction.

4. A method as claimed in claim 1, further including the step of forming, after said step of forming said semiconductor film and before said step of forming said electrode layer, another semiconductor film on said semiconductor film, and wherein said dry etching process is conducted such that said electrode layer and said another semiconductor film are etched substantially simultaneously.

5. A method as claimed in claim 4, wherein said dry etching process is conducted such that an etching rate of said first conductor film in a lateral direction thereof is equal to or larger than an etching rate of said another semiconductor film in said lateral direction.

6. A method as claimed in claim 1, wherein said step of forming said pixel electrode includes the steps of:

forming a conductor pattern containing a refractory metal on said protective insulation film such that said conductor pattern makes a contact with said second conductor film of said second electrode pattern at said contact hole; and

forming a transparent electrode pattern of In₂SnO₅ on said conductor pattern as said pixel electrode.

7. A method as claimed in claim 1, wherein said step of forming said pixel electrode includes a step of forming a conductor pattern containing a refractory metal element on said protective insulation film with a thickness allowing a substantial passage of an optical beam, such that said conductor pattern makes a contact with said second conductor film of said second electrode pattern at said contact hole.

8. A method as claimed in claim 1, wherein said step of forming said gate insulation film includes the steps of:

forming an insulation pattern on said gate electrode with a shape corresponding to a shape of said gate electrode to form a gate structure;

forming a planarized insulation film on said first substrate by a spin-coating process such that said planarized insulation film covers said gate structure; and

etching back said planarized insulation film.

9. A method of fabricating a liquid crystal display device comprising:

a first substrate;

a second substrate facing said first substrate;

a liquid crystal layer confined between said first substrate and said second substrate;

a thin-film transistor provided on said first substrate;

a protective insulation film covering said thin-film transistor; and

a pixel electrode provided on said protective insulation film in electrical connection with said thin-film transistor, said method comprising the steps of;

forming said gate electrode on said first substrate;

forming a gate insulation film on said first substrate so as to cover said gate electrode;

forming said semiconductor film on said gate insulation film;

forming an electrode layer on said semiconductor film by depositing a first conductor layer containing a refractory metal element and a second conductor layer containing Al consecutively;

applying a dry etching process to said electrode layer to form a first ohmic electrode pattern located at a first side of said gate electrode and a second ohmic electrode pattern located at a second, opposite side of said gate electrode;

covering said first and second ohmic electrode patterns by said protective insulation film such that said protective insulation film contacts each of said first and second ohmic electrode patterns intimately;

forming a contact hole in said protective insulation film so as to expose said second conductor layer at said contact hole; and

forming said pixel electrode on said protective insulation film to as to achieve an electrical contact with said second ohmic electrode pattern at said contact hole.