Integrated circuit inductors

• US 6,446,327 B2
• Filed: 05/31/2001
• Issued: 09/10/2002
• Est. Priority Date: 07/09/1999
• Status: Expired due to Term

• Current Assignee: Kie Y. Ahn, Leonard Forbes
• Original Assignee: Kie Y. Ahn, Leonard Forbes
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Primary Examiner(s): Nguyen, Viet Q.
• Application Number:
  US09/871,062
• Publication Number:
  US 20010022019A1
• Time in Patent Office: 467 Days
• Field of Search: 296/04, 296/05, 296/06, 296/07, 257/528, 257/531
• US Class Current: 29/604
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a semiconductor substrate;

a conductive path through the semiconductor substrate and operable for creating a reinforcing magnetic flux within the semiconductor substrate.

2. The inductor of claims 1, wherein the semiconductor substrate is silicon.

3. The inductor of claim 1, further comprising:

a test coil embedded in the substrate for measuring the reinforcing magnetic flux.

4. The inductor of claim 3, wherein the test coil is fabricated from gold.

5. The inductor of claim 4, wherein the test coil is initially fabricated as part of the conductive path and then decoupled from the conductive path.

6. An inductor comprising:

a semiconductor substrate;

a conductive path woven through the semiconductor substrate, the conductive path operable for creating a reinforcing magnetic flux within the semiconductor substrate; and

a test coil embedded in the semiconductor substrate and coupled to the reinforcing magnetic flux.

7. The inductor of claim 6, wherein the test coil comprises copper.

8. The inductor of claim 7, wherein the test coil comprises a detachable test coil.

9. An inductor comprising:

a silicon carbide substrate;

a conductive path woven through the silicon carbide substrate, the conductive path operable for creating a reinforcing magnetic flux within the silicon carbide substrate; and

a detachable test coil embedded in the silicon carbide substrate and coupled to the reinforcing magnetic flux.

10. The inductor of claim 9, wherein the test coil comprises aluminum.

11. The inductor of claim 10, wherein the conductive path comprises a triangle.

12. An inductor comprising:

a gallium arsenide substrate;

a conductive path woven through the gallium arsenide substrate, the conductive path operable for creating a reinforcing magnetic flux within the gallium arsenide substrate; and

a detachable test coil embedded in the gallium arsenide substrate and coupled to the reinforcing magnetic flux.

13. The inductor of claim 12, wherein the test coil comprises a rectangular coil.

14. The inductor of claim 13, wherein the detachable test coil comprises gold.

15. An inductor comprising:

a germanium substrate;

a conductive path woven through the germanium substrate, the conductive path operable for creating a reinforcing magnetic flux within the germanium substrate; and

a test coil embedded in the germanium substrate and coupled to the reinforcing magnetic flux.

16. The inductor of claim 15, wherein the conductive path comprises a coil.

17. The inductor of claim 16, wherein the test coil comprises a spiral test coil.

18. An inductor comprising:

a semiconductor substrate;

a conductive path woven through the semiconductor substrate, the conductive path operable for creating a reinforcing magnetic flux within the semiconductor substrate; and

a spiral test coil formed on the semiconductor substrate and coupled to the reinforcing magnetic flux.

19. The inductor of claim 18, wherein spiral test coil comprises gold.

20. The inductor of claim 19, wherein the conductive path comprises a rectangular coil.

21. An inductor comprising:

a gallium arsenide substrate;

a conductive path woven through the gallium arsenide substrate, the conductive path operable for creating a reinforcing magnetic flux within the gallium arsenide substrate; and

a laser detachable test coil embedded in the gallium arsenide substrate and coupled to the reinforcing magnetic flux.

22. The inductor of claim 21, wherein the conductive path comprises a plurality of conductive materials.

23. The inductor of claim 22, wherein at least one of the plurality of conductive materials comprises gold.

24. The inductor of claim 23, wherein at last one of the plurality of conductive materials comprises copper.