Semiconductor wirebond machine leadframe thermal map system
First Claim
1. A thermal mapping apparatus for measuring temperatures on at least a portion of a surface of an object for forming correlations of measured temperatures with locations on said surface of said object at a time of the measurement of said temperatures, said thermal mapping apparatus comprising:
- a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;
a sensor probe mount attached to said bonding arm of said wire bonding machine, said sensor probe mount including a plurality of members connected together for passage of a conductor therethrough;
a decay temperature sensor probe having a conductor having a sensing tip located on one end thereof and having an opposite signal output end, said decay temperature sensor probe attached to one member of the plurality of members of said sensor probe mount attached to said bonding arm of said wire bonding machine;
pulse generating apparatus connected to said opposite signal output end of said decay temperature sensor probe to generate a pulse through said conductor to material at said sensing tip and to receive from said opposite signal output end a signal representative of a temperature at said sensing tip;
an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;
stage apparatus attached to a portion of said wire bonding machine for mounting said object thereon;
control apparatus for manipulating a position of said stage apparatus relative to said sensing tip; and
computing apparatus having software for receiving said temperature indication and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said at least a portion of said surface of said object.
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Accused Products
Abstract
A method and apparatus for measuring the surface temperatures of wire-bonded semiconductor devices and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic wire bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
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Citations
53 Claims
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1. A thermal mapping apparatus for measuring temperatures on at least a portion of a surface of an object for forming correlations of measured temperatures with locations on said surface of said object at a time of the measurement of said temperatures, said thermal mapping apparatus comprising:
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a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;
a sensor probe mount attached to said bonding arm of said wire bonding machine, said sensor probe mount including a plurality of members connected together for passage of a conductor therethrough;
a decay temperature sensor probe having a conductor having a sensing tip located on one end thereof and having an opposite signal output end, said decay temperature sensor probe attached to one member of the plurality of members of said sensor probe mount attached to said bonding arm of said wire bonding machine;
pulse generating apparatus connected to said opposite signal output end of said decay temperature sensor probe to generate a pulse through said conductor to material at said sensing tip and to receive from said opposite signal output end a signal representative of a temperature at said sensing tip;
an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;
stage apparatus attached to a portion of said wire bonding machine for mounting said object thereon;
control apparatus for manipulating a position of said stage apparatus relative to said sensing tip; and
computing apparatus having software for receiving said temperature indication and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said at least a portion of said surface of said object. - View Dependent Claims (2, 3, 4, 5)
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6. An apparatus for thermal mapping of temperatures on at least a portion of a surface of an object and for forming correlations of measured temperatures with locations on said surface, said apparatus comprising:
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a wire bonding machine including an arm and an ultrasonic bonding generator controller;
a sensor probe mount attached to said arm of said wire bonding machine, said sensor probe mount including a plurality of members connected together for passage of a conductor therethrough;
a decay temperature sensor probe having a conductor having an end having a sensing tip thereon and an opposite signal output end, said decay temperature sensor probe attached to one member of the plurality of members of said sensor probe mount attached to said arm of said wire bonding machine;
pulse generating apparatus connected to said opposite signal output end of said conductor for generating a pulse of light through said conductor to material at said sensing tip and for receiving from said opposite signal output end a signal representative of a temperature at said sensing tip;
an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse of light, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a, voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;
apparatus for mounting said object thereon;
control apparatus for manipulating a position of said apparatus for mounting relative to the sensing tip; and
computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication as a function of time and location on said at least a portion of said surface of said object. - View Dependent Claims (7, 8, 9, 10)
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11. An apparatus for thermal mapping of temperatures on at least a portion of a surface of an object and for forming correlations of measured temperatures with locations on said at least a portion of said surface, said apparatus comprising:
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a wire bonding machine including an arm and an ultrasonic bonding generator controller;
a sensor probe mount attached to said arm of said wire bonding machine;
a fluorescence decay temperature sensor probe having a conductor having a sensing tip on one end thereof and having an opposite signal output end, said fluorescence decay temperature sensor probe mountable in said sensor probe mount attached to said arm of said wire bonding machine;
pulse generating apparatus connected to said opposite signal output end for generating a pulse through said conductor to phosphorescent material at said sensing tip and for receiving from said opposite signal output end of said conductor a decaying phosphorescent signal representative of a temperature at said sensing tip;
an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
thermometer apparatus for calculating a temperature indication from said decaying phosphorescent signal;
a stage apparatus for mounting said object thereon;
control apparatus for manipulating a position of said stage apparatus relative to said sensing tip; and
computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication as a function of time and location on said at least a portion of said surface of said object. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method for thermal mapping of at least a portion of a surface of an object comprising:
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providing a wire bonding machine including an arm and an ultrasonic bonding generator controller;
providing a sensor probe mount on said arm of said wire bonding machine;
providing a temperature sensor probe having a conductor having a sensing tip on one end thereof and a signal output end on another end thereof attached to said arm of said wire bonding machine;
initiating generation of a pulse using an electronic trigger circuit connected to said arm of said wire bonding machine for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
generating said pulse through said conductor to material at said sensing tip via means connected to said signal output end;
receiving from said signal output end a signal representative of a temperature at said sensing tip in a computational apparatus having software; and
calculating a temperature indication from said signal. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
mounting said object on a support apparatus; and
manipulating a position of said support apparatus relative to the sensing tip using a control apparatus.
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20. The method of claim 17, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe, substrate, and other electronic device.
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21. The method of claim 17, wherein said sensor probe mount comprises a plurality of connected members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.
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22. The method of claim 18, wherein said correlating said temperature indication with time and location on said at least a portion of said surface includes correlating said temperature indication as a thermal map of said at least a portion of said surface of said object.
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23. The method of claim 17, further including mounting said sensor probe mount in a channel of a capillary holder on said arm of said wire bonding machine.
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24. The method of claim 17, further including permanently mounting said sensor probe mount in a capillary holder removable from said arm.
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25. A method for thermal mapping of at least a portion of a surface of an object comprising:
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providing a wire bonding apparatus including an arm and an ultrasonic bonding generator controller;
providing a sensor probe mount on a portion of said arm of said wire bonding apparatus;
providing a temperature sensor probe having a conductor having a sensing tip end and a signal output end;
mounting said temperature sensor probe in said sensor probe mount on said portion of said arm of said wire bonding apparatus;
initiating the generation of a pulse using an electronic trigger circuit connected to said wire bonding apparatus, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding apparatus;
generating said pulse through said conductor to material at said sensing tip end via apparatus connected to said signal output end;
receiving from said signal output end a signal representative of a temperature at said sensing tip end in computational apparatus having software;
calculating a temperature indication from said signal; and
correlating and storing said temperature indication as a function of time and location on said surface of said object. - View Dependent Claims (26, 27, 28, 29, 30, 31)
mounting said object on a support apparatus, said support apparatus part of said wire bonding apparatus; and
manipulating a position of said support apparatus relative to said sensing tip end using a control apparatus.
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27. The method of claim 25, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe, substrate, and other electronic device.
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28. The method of claim 25, wherein said sensor probe mount comprises at least two concentric connected tubular members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.
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29. The method of claim 25, wherein said correlating said temperature indication with time and location on said surface of said object includes correlating said temperature as a thermal map uses said computational apparatus.
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30. The method of claim 25, wherein said sensor probe mount is mountable in a channel of a capillary holder.
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31. The method of claim 25, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said wire bonding apparatus.
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32. A method for measuring temperatures on at least a portion of a surface of an object comprising:
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providing a wire bonding machine including an arm, a mounting apparatus, and an ultrasonic bonding generator controller;
mounting a sensor probe mount on said arm of said wire bonding machine;
providing a miniature fluorescence temperature sensor probe having a conductor having a sensing tip end and an opposite signal output end, said miniature fluorescence temperature sensor probe mounted in said sensor probe mount on said arm of said wire bonding machine;
providing an apparatus connected to said opposite signal output end;
initiating a signal using an electronic trigger circuit connected to said wire bonding machine for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
initiating the generation of said pulse of light using said electronic trigger circuit connected to said wire bonding machine;
generating a pulse of light through said conductor to phosphorescent material at said sensing tip end;
receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip end;
calculating a temperature indication from said decaying phosphorescent signal;
mounting said object on said mounting apparatus of said wire bonding machine;
manipulating a position of said mounting apparatus relative to said sensing tip end;
computing, correlating, and storing said temperature indication as a function of time and location on said surface of said object using a computational apparatus. - View Dependent Claims (33, 34, 35, 36, 37)
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38. An apparatus for measuring temperatures on a semiconductor die having an active surface having at least one bond pad thereon having one end of a wire bonded thereto in a wire bonding operation and forming correlations of measured temperatures with locations on said active surface of said semiconductor die at a time of the measurement of said temperatures subsequent to bonding of said one end of said wire to said at least one bond pad on said active surface of said semiconductor die, said apparatus comprising:
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a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;
a sensor probe mount attached to said bonding arm of said wire bonding machine;
a decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said decay temperature sensor probe mountable in said sensor probe mount attached to said bonding arm of said wire bonding machine;
pulse of light generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to material at said sensing tip and for receiving from said opposite signal output end a decaying signal representative of a temperature at said sensing tip;
a signal isolation trigger circuit connected to said wire bonding machine for initiating the generation of said pulse of light, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
calculating apparatus for calculating a temperature indication from said decaying signal;
stage apparatus for mounting said semiconductor die thereon attached to a portion of said wire bonding machine;
control apparatus for manipulating a position of said stage apparatus relative to said sensing tip; and
computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said active surface of said semiconductor die subsequent to the bonding of said one end of said wire to said at least one bond pad on said active surface of said semiconductor die. - View Dependent Claims (39, 40, 41)
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42. A temperature measuring apparatus comprising:
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a wire bonding machine having an arm and an ultrasonic bonding generator controller;
a sensor probe mount attached to said arm of said wire bonding machine;
a decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said decay temperature sensor probe mounted in said sensor probe mount attached to said arm of said wire bonding machine;
pulse of light generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to material at said sensing tip and for receiving from said opposite signal output end a decaying signal representative of a temperature at said sensing tip;
a signal isolation trigger circuit connected to said wire bonding machine for initiating the generation of said pulse of light, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
calculating apparatus for calculating a temperature indication from said decaying signal;
apparatus for mounting a semiconductor die thereon located on a portion of said wire bonding machine;
control apparatus for manipulating a position of said apparatus for mounting relative to the sensing tip; and
computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication in machine-readable form as a function of one of time and location on at least a portion of a surface of said semiconductor die. - View Dependent Claims (43, 44)
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45. A temperature measuring apparatus comprising:
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a wire bonding machine having an arm and an ultrasonic bonding generator controller;
a sensor probe mount attached to said arm of said wire bonding machine;
a fluorescence decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said fluorescence decay temperature sensor probe mountable in said sensor probe mount attached to said arm of said wire bonding machine;
pulse of light generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to phosphorescent material at said sensing tip and for receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip;
a signal isolation trigger circuit connected to said wire bonding machine for initiating the generation of said pulse of light, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
calculating apparatus for calculating a temperature indication from said decaying phosphorescent signal;
a stage for mounting an object thereon on a portion of said wire bonding machine;
control apparatus for manipulating a position of said stage relative to said sensing tip; and
computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication in machine-readable form as a function of one of time and location on at least a portion of a surface of said object. - View Dependent Claims (46, 47)
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48. A temperature measuring method comprising:
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providing a wire bonding machine having an arm and an ultrasonic bonding generator controller;
providing a sensor probe mount on said arm of said wire bonding machine;
providing a decay temperature sensor probe having a fiber optic conductor with a sensing tip and a signal output end attached to said arm of said wire bonding machine;
initiating generation of a pulse of light using a signal isolation trigger circuit connected to said arm of said wire bonding machine for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
generating a pulse of light through said fiber optic conductor to material at said sensing tip via means connected to said signal output end;
receiving from said signal output end a signal representative of a temperature at said sensing tip in machine-readable form in a computational apparatus having software; and
calculating a temperature indication from said electrical voltage signal. - View Dependent Claims (49, 50, 51)
providing a mounting apparatus for mounting an object thereon; and
manipulating a position of said mounting apparatus relative to the sensing tip using a control apparatus.
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50. The method of claim 48, wherein said sensor probe mount comprises a plurality of tubular members fitted together for passage of said fiber optic conductor therethrough and attachment of said decay temperature sensor probe at one end thereof.
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51. The method of claim 48, further including:
- correlating said temperature indication with one of time and location on a surface of an object as a thermal map.
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52. A method for measuring temperature on at least a portion of a surface of an object comprising:
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providing a wire bonding apparatus having an arm and an ultrasonic bonding generator controller;
providing a sensor probe mount attached to a portion of said arm of said wire bonding apparatus;
providing a decay temperature sensor probe having a fiber optic conductor with a sensing tip and a signal output end;
mounting said decay temperature sensor probe in said sensor probe mount attached to said portion of said arm of said wire bonding apparatus;
initiating generation of a pulse of light using a signal isolation trigger circuit connected to said wire bonding apparatus, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding apparatus;
generating a pulse of light through said fiber optic conductor to material at said sensing tip via apparatus connected to said signal output end;
receiving from said signal output end a signal representative of a temperature at said sensing tip in machine-readable form in a computational apparatus having software;
calculating a temperature indication from said signal; and
correlating and storing said temperature indication as a function of one of time and location on said at least a portion of said surface of said object.
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53. A method for measuring temperature on at least a portion of a surface of an object comprising:
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providing a wire bonding machine having an arm, a mounting apparatus, and an ultrasonic bonding generator controller;
mounting a sensor probe mount to said arm of said wire bonding machine;
providing a miniature fluorescence decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said miniature fluorescence decay temperature sensor probe mounted in said sensor probe mount of said arm of said wire bonding machine;
providing an apparatus connected to said opposite signal output end;
initiating a signal using a signal isolation trigger circuit connected to said wire bonding machine for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;
generating a pulse of light through said fiber optic conductor to phosphorescent material at said sensing tip;
receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip;
initiating the generation of said pulse of light using said signal isolation trigger circuit connected to said wire bonding machine;
calculating a temperature indication from said decaying phosphorescent signal;
mounting said object on said mounting apparatus of said wire bonding machine;
manipulating a position of said mounting apparatus relative to said sensing tip;
computing, correlating, and storing said temperature indication in machine-readable form as a function of one of time and location on said at least a portion of said surface of said object using a computational apparatus.
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Specification