Hot melt adhesives for dermal application
First Claim
Patent Images
1. An pressure sensitive hot melt adhesive composition comprising a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and having a G′
- of less than 15×
104 dynes/cm2 at 10 rad/s at 25°
C.
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Accused Products
Abstract
A pressure sensitive hot melt adhesive composition which comprises a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and has a G′ of less than about 15×104 dynes/cm2 at 10 rad/s at 25° C. is useful for adhesive skin application (e.g., surgical tape), including transdermal drug delivery applications.
146 Citations
20 Claims
-
1. An pressure sensitive hot melt adhesive composition comprising a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and having a G′
- of less than 15×
104 dynes/cm2 at 10 rad/s at 25°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
- of less than 15×
Specification