Method and apparatus for wafer-level testing of semiconductor lasers
First Claim
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1. A device for wafer level testing of semiconductor lasers, comprising:
- a chuck on which a wafer including lasers to be tested is received, wherein a first side of the wafer contacting the chuck includes optical apertures through which output beams of the lasers are emitted;
an electrical probe accessing individual ones of the lasers on a second side of the wafer to stimulate emission from the accessed lasers; and
a light detector receiving light from the accessed lasers after the light has passed through the chuck.
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Abstract
A method and device for wafer level testing of semiconductor lasers allows probing from one side while detecting light output from the opposite side. A chuck with a transparent substrate receives the optical aperture side of a wafer of semiconductor lasers. The wafer is probed form the side opposite the side contacting the chuck and emitted light is detected on a side of the chuck opposite the side contacting the wafer.
19 Citations
19 Claims
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1. A device for wafer level testing of semiconductor lasers, comprising:
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a chuck on which a wafer including lasers to be tested is received, wherein a first side of the wafer contacting the chuck includes optical apertures through which output beams of the lasers are emitted;
an electrical probe accessing individual ones of the lasers on a second side of the wafer to stimulate emission from the accessed lasers; and
a light detector receiving light from the accessed lasers after the light has passed through the chuck. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for wafer level testing of semiconductor lasers comprising the steps of:
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positioning a wafer having a plurality of lasers formed thereon on a chuck so that a surface of the wafer from which the lasers emit their respective output beams contacts the chuck, wherein the chuck includes a partially reflective layer which returns a portion of light incident thereon toward the wafer;
electrically stimulating a desired one of the lasers by coupling a probe to a portion of a side of the wafer opposite the side contacting the chuck, the contacted portion corresponding to the desired one of the lasers; and
detecting light emitted by the desired one of the lasers after the light has passed through the chuck. - View Dependent Claims (11)
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12. A method for wafer level testing of semiconductor lasers, comprising the steps of:
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positioning a wafer on a chuck with a first side of the wafer contacting the chuck including optical apertures through which output beams of the lasers included therein are emitted;
electrically probing a desired one of the lasers on a second side of the wafer to stimulate emission from the desired one of the lasers; and
detecting light from the desired one of the lasers after the light has passed through the chuck. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification