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Method and apparatus for wafer-level testing of semiconductor lasers

  • US 6,448,805 B1
  • Filed: 02/12/2001
  • Issued: 09/10/2002
  • Est. Priority Date: 02/12/2001
  • Status: Expired due to Term
First Claim
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1. A device for wafer level testing of semiconductor lasers, comprising:

  • a chuck on which a wafer including lasers to be tested is received, wherein a first side of the wafer contacting the chuck includes optical apertures through which output beams of the lasers are emitted;

    an electrical probe accessing individual ones of the lasers on a second side of the wafer to stimulate emission from the accessed lasers; and

    a light detector receiving light from the accessed lasers after the light has passed through the chuck.

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