Inboard retention system for processor enclosure assemblies with substrate alignment

• US 6,449,163 B1
• Filed: 06/08/1998
• Issued: 09/10/2002
• Est. Priority Date: 06/08/1998
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Rutigliano, Michael L., Stark, Michael R.
• Primary Examiner(s): Schuberg, Darren
• Assistant Examiner(s): DUONG, HUNG V
• Application Number:
  US09/093,138
• Time in Patent Office: 1,555 Days
• Field of Search: 361/752, 361/801, 361/802, 361/764, 361/759, 361/789, 361/715, 361/728, 361/729, 361/730, 361/767, 361/753, 361/756, 361/704, 361/796, 439/377, 211/41.1
• US Class Current: 361/752
• CPC Class Codes: H05K 7/1431 Retention mechanisms for CPU modules

Abstract

A retention mechanism which may include a pair of flexible tabs. The flexible tabs may be pressed into opposing side edges of a substrate which supports an integrated circuit package. The substrate may be part of an electronic cartridge which has a cover. The flexible tab may extend through a space between the substrate and the cover such that the retention mechanism has a profile that is no greater than the cartridge. The retention mechanism may be mounted to a motherboard. The motherboard may have a connector that receives the substrate. An insertion tool can be used to plug the cartridge into the connector and couple the flexible tab to the substrate. An extraction tool can be used to pull the cartridge out of the connector and separate the substrate from the flexible tabs.

Claims

1. A retention mechanism for capturing a substrate which has a corner, comprising:

a cover coupled to said substrate; and

a first retention beam which has a first flexible tab having a slot that is adapted to engage said corner of the substrate, said flexible tab being adapted to extend between said substrate and said cover.

2. The retention mechanism as recited in claim 1, further comprising a second retention beam that has a second flexible tab and which is separated from said first retention beam by a support beam.

3. The retention mechanism as recited in claim 2, wherein said first and second retention beams each have a hinge.

4. An electronic assembly, comprising:

a substrate which has a corner;

an integrated circuit package mounted to said substrate;

a cover coupled to said substrate;

a circuit board; and

,

a retention mechanism that is mounted to said circuit board and which has a flexible tab having a slot that is adapted to engage said corner of said substrate, said flexible tab being adapted to extend between said substrate and said cover.

5. The assembly as recited in claim 4 further comprising a thermal plate that is coupled to said substrate.

6. The assembly as recited in claim 4, further comprising a connector that is mounted to said circuit board and is coupled to said substrate.

7. The assembly as recited in claim 4, wherein the circuit board is a motherboard.

8. An insertion tool for an electronic cartridge that can be coupled to a retention mechanism which has a flexible tab, the electronic cartridge having a cover with a port, comprising:

a base which has a tab that is adapted to be inserted into the cover port;

a lever which extends from said base and is adapted to engage the electronic cartridge.

9. An extraction tool for an electronic cartridge that can be coupled to a retention mechanism which has a pair of flexible tabs, the electronic cartridge having a cover with a port and a pair of openings, comprising:

a base which has a tab that is adapted to be inserted into the cover port; and

,

a lever that extends from said base and which has a pair of tabs adapted to be inserted into the openings and engage the flexible tabs.

10. An electronic assembly, comprising:

a substrate which has an edge;

an integrated circuit package mounted to said subsrate;

cover coupled to said substrate;

a circuit board;

a retention mechanism that is mounted to said circuit board and which has a flexible tab that is adapted to be pressed into said edge of said substrate; and

,

an insertion tool including a tab that can be inserted into a port of said cover.

11. The assembly as recited in claim 10, further comprising a thermal plate that is coupled to said substrate.

12. The assembly as recited in claim 11, further comprising a connector that is mounted to said circuit board and is coupled to said substrate.

13. An electronic assembly, comprising:

a substrate which has an edge;

an integrated circuit package mounted to said substrate;

a cover coupled to said substrate;

a circuit board;

a retention mechanism that is mounted to said circuit board and which has a flexible tab that is adapted to be pressed into said edge of said substrate; and

an extraction tool including a tab that can be inserted into a port of said cover.

14. The assembly as recited in claim 13, further comprising a thermal plate that is coupled to said substrate.

15. The assembly as recited in claim 14, further comprising a connector that mounted to said circuit board and is coupled to said substrate.

16. An electronic assembly, comprising:

a substrate having a corner;

a cover coupled to said substrate;

a circuit board;

a retention mechanism mounted to said circuit board, said retention mechanism including a flexible tab having a slot that is adapted to engage said corner of said substrate; and

an insertion tool including a tab that can be inserted into a port of said cover.

17. The electronic assembly as recited in claim 16 further comprising an integrated circuit package mounted to said substrate.

18. An electronic assembly, comprising:

a substrate having a corner;

a an integrated circuit package mounted to said substrate;

a cover coupled to said substrate;

a circuit board;

a retention mechanism mounted to said circuit board, said retention mechanism including a flexible tab having a slot that is adapted to engage said corner of said substrate; and

an extraction tool including a tab that can be inserted into a port of said cover.

19. The electronic assembly as recited in claim 18 further comprising an integrated circuit package mounted to said substrate.