Computer chassis identification method

• US 6,449,579 B1
• Filed: 09/13/2000
• Issued: 09/10/2002
• Est. Priority Date: 02/04/1999
• Status: Expired due to Term

• Current Assignee: Dell USA LP (Dell Technologies Inc.)
• Original Assignee: Dell USA LP (Dell Technologies Inc.)
• Inventors: Brame, Steve J., Nikazm, Ayedin
• Primary Examiner(s): ASSOUAD, PATRICK J
• Application Number:
  US09/661,001
• Time in Patent Office: 727 Days
• Field of Search: 361/796, 361/752, 361/753, 710/104, 710/8, 710/10, 710/15, 702/122
• US Class Current: 702/122
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: H05K 7/1455 Coding for prevention of wrong insertion

Abstract

A method to allow a computer system board to automatically identify the chassis in which the system board is installed. The method includes the steps of a) attaching at least one spring action grounding clip to the chassis, b) incorporating at least one conducting pad into the artwork of the printed wire assembly on the system board, c) connecting at least one conducting pad to a logic circuit on the system board, d) installing the system board in the chassis, and e) ensuring that at least one spring action grounding clip contacts at least one conducting pad.

Claims

1. A method to allow a computer system board to automatically identify a chassis in which the system board is installed, the method comprising:

forming a plurality of conducting pads on the system board in a pattern;

forming a plurality of attachment sites on the chassis in a pattern corresponding to the pattern of the conducting pads;

connecting a separate logic circuit to each of the conductive pads;

attaching a spring action grounding clip to at least one of the attachment sites for contact with a corresponding one of the conducting pads;

determining an output of the logic circuits;

causing a first output to the respective logic circuit due to the presence of the spring action grounding chip;

causing a second output to the respective logic due to the absence of the spring action grounding chip; and

depending on the first or second output being received, the system board identifying the chassis in which the system board is installed.

2. The method of claim 1, further comprising comparing an output of the logic circuit with a look-up table in a memory of a system board.

3. The method of claim 2, further comprising identifying a chassis by the results of the comparing step.

4. The method of claim 3, further comprising incorporating three conducting pad into the artwork of the printed wire assembly.

5. The method of claim 4, further comprising attaching three spring action grounding clips.