Method for interconnecting printed circuit boards and interconnection structure

• US 6,449,836 B1
• Filed: 07/26/2000
• Issued: 09/17/2002
• Est. Priority Date: 07/30/1999
• Status: Expired due to Term

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Nanami, Tomoyuki, Hirano, Kenzo, Miyake, Toshihiro, Totani, Makoto, Yokochi, Tomohiro, Yazaki, Yoshitaro, Teramae, Takehito, Kojima, Katsuaki, Iwama, Hiroyasu
• Primary Examiner(s): Vo, Peter
• Assistant Examiner(s): Trinh, Minh
• Application Number:
  US09/626,243
• Time in Patent Office: 783 Days
• Field of Search: 298/30, 298/40, 298/43, 291/791, 174/264, 174/263, 228/180.1, 228/177, 219/605, 219/616, 219/633, 439/67, 439/493, 439/74, 156/273.3, 156/275.5
• US Class Current: 29/830
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/065 Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/363 by soldering
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding

Abstract

In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.

Claims

1. A method for interconnecting printed circuit boards, comprising:

preparing a first printed circuit board having an insulating substrate made of a thermoplastic resin and having a conductive pattern with a land, and a second printed circuit board having a conductive pattern with a land;

overlapping the land of the first printed circuit board with the land of the second printed circuit board to form an interconnection portion of the first printed circuit board and the second printed circuit board;

heating the interconnection portion to a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying a pressure to the interconnection portion to electrically interconnect the land of the first printed circuit board with the land of the second printed circuit board; and

softening and deforming a part of the thermoplastic resin forming the insulating substrate of the first printed circuit board to cover and seal the electrical interconnection portion.

2. The method of claim 1, wherein the preparing of a first printed circuit board having an insulating substrate made of a thermoplastic resin further includes preparing the first printed circuit board to have the insulating substrate made of the thermoplastic resin contain at least one selected from a group consisting of polyether imide, polyether ether ketone, polyethylene naphthalate and polyethylene terephthalate.

3. The method of claim 2, wherein the preparing of a first printed circuit board having an insulating substrate made of a thermoplastic resin further includes preparing the first printed circuit board to have the insulating substrate composed of a base member made of polyimide and a layer provided on the base member and containing at least one selected from a group consisting of polyether imide, polyether ether ketone, polyethylene naphthalate, and polyethylene terephthalate.

4. The method of claim 1, further comprising:

overlapping the insulating substrate of the first printed circuit board with an insulating substrate of the second printed circuit board to interpose a film therebetween that includes a material which can reduce a modulus of elasticity of the insulating substrate of the first printed circuit board;

heating the interconnection portion to form an adhesion enhancing layer having a modulus of elasticity smaller than that of the insulating substrate of the first printed circuit board in which the material is dispersed at a surface portion of the insulating substrate of the first printed circuit board, and to adhere the insulating substrate of the first printed circuit board with the insulating substrate of the second printed circuit board with the adhesion enhancing layer interposed therebetween.

5. The method of claim 4, wherein the overlapping of the insulating substrate of the first printed circuit board with an insulating substrate of the second printed circuit board to interpose a film therebetween that includes a material which can reduce a modulus of elasticity of the insulating substrate of the first printed circuit board further comprises overlapping the insulating substrate of the first printed circuit board with the insulating substrate of the second printed circuit board to interpose the film therebetween that includes a hydrocarbon compound.

6. The method of claim 5, wherein the overlapping of the insulating substrate of the first printed circuit board with the insulating substrate of the second printed circuit board to interpose the film therebetween that includes a hydrocarbon compound further comprises overlapping the insulating substrate of the first printed circuit board with the insulating substrate of the second printed circuit board to inter pose the film therebetween that includes a hydrocarbon compound that is one of an alkane, an alkene and an alkyne.

7. The method of claim 1, wherein:

preparing the first printed circuit board and the second printed circuit board includes forming the conductive pattern on a region of a connection surface of the first printed circuit board, the region excluding a front edge portion of the first printed circuit board; and

heating the interconnection portion softens and deforms the thermoplastic resin to seal the interconnection portion with the thermoplastic resin.

8. The method of claim 7, wherein preparing the first printed circuit board and the second printed circuit board includes:

forming a first protective film on the conductive pattern of the first printed circuit board except the land; and

forming a second protective film on the conductive pattern of the second printed circuit board except the land.

9. The method of claim 8, further comprising:

adhering the front edge portion of the connection surface of the first printed circuit board to the second protective film on the second printed circuit board.

10. The method of claim 8, wherein:

the conductive pattern of the second printed circuit board is disposed on a region of a connection surface of the second printed circuit board, the region excluding a front edge portion of the second printed circuit board; and

the front edge portion of the second printed circuit board is adhered to the first protective film of the first printed circuit board.

11. The method of claim 8, wherein the forming of a first protective film on the conductive pattern of the first printed circuit board except the land further comprises forming the first protective film from a thermoplastic resin.

12. The method of claim 7, wherein the preparing of a first printed circuit board having an insulating substrate made of a thermoplastic resin and having a conductive pattern with a land, and a second printed circuit board having a conductive pattern with a land further comprises preparing the conductive pattern of the first printed circuit board and the conductive pattern of the second printed circuit board to have a plurality of wiring members and a plurality of lands respectively connected to the plurality of wiring members.

13. The method of claim 1, wherein the heating of the interconnection portion further comprises pulse heating the interconnection portion.

14. The method of claim 1, wherein the overlapping of the land of the first printed circuit board with the land of the second printed circuit board through a bonding material further comprises overlapping the land of the first printed circuit board with the land of the second printed circuit board through a solder plating film or conductive adhesive.

15. A method for interconnecting printed circuit boards, comprising:

forming a first board conductive pattern including a land on a first board connection surface of a first printed circuit board that is composed of an insulating substrate made of a thermoplastic resin;

forming a first board protective film on the first printed circuit board to cover the first board conductive pattern except the land, and to cover an edge area of the first board connection surface;

forming a second board conductive pattern including a land on a second board connection surface of a second printed circuit board;

overlapping the land of the first printed circuit board with the land of the second printed circuit board through a bonding material to form an interconnection portion between the first printed circuit board and the second printed circuit board;

heating the interconnection portion to a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying a pressure to the interconnection portion to electrically interconnect the land of the first printed circuit board and the land of the second printed circuit board through the bonding material,

wherein the forming of the first board protective film on the first printed circuit board to cover the edge area of the first board connection surface impedes the bonding material from flowing toward an outside of the first board connection surface; and

softening and deforming the thermoplastic resin constituting the insulating substrate of the first printed circuit board to cover and seal the interconnection portion.

16. The method of claim 15, further comprising deforming the thermoplastic resin to cover the first board protective film covering the edge portion of the first board connection surface.

17. The method of claim 15, further comprising forming a second board protective film to cover the second board conductive pattern except the land.

18. The method of claim 17, further comprising deforming the thermoplastic resin to cover the first board protective film disposed at the edge portion of the first board connection surface, and to adhere the thermoplastic resin to the second board protective film on the second printed circuit board.

19. The method of claim 15, wherein:

the second board conductive pattern is formed on a region of the second board connection surface, the region excluding a front edge area of the second printed circuit board; and

the first board protective film of the first printed circuit board is adhered to the front edge area of the second printed circuit board.

20. The method of claim 15, wherein the first board protective film is made of a thermoplastic resin material.

21. The method of claim 15, wherein each of the first board conductive pattern and the second board conductive pattern includes a plurality of wiring members and a plurality of lands respectively connected to the plurality of wiring members.

22. The method of claim 15, wherein the heating of the interconnection portion further comprises pulse heating the interconnection portion.

23. The method of claim 15, wherein the overlapping of the land of the first printed circuit board with the land of the second printed circuit board through a bonding material further comprises overlapping the land of the first printed circuit board with the land of the second printed circuit board through a conductive adhesive or solder plating film.

24. A method for interconnecting printed circuit boards, comprising:

forming a first board conductive pattern including a land on a first board connection surface of a first printed circuit board that is composed of an insulating substrate made of a thermoplastic resin;

forming a first board protective film on the first printed circuit board to cover the first board conductive pattern except the land, the first board protective film having a protective film protruding end portion covering the first board conductive pattern to expose the first board connection surface at both sides thereof;

forming a second board conductive pattern with a land on a second board connection surface of a second printed circuit board, the second board conductive pattern being terminated at a position located at a predetermined distance from a front edge portion of the second printed circuit board;

overlapping the land of the first printed circuit board with the land of the second printed circuit board so that the first board connection surface exposed at the both sides of the protective film protruding end portion faces the second board connection surface of the front edge portion of the second printed circuit board;

heating an interconnection portion between the first and second printed circuit boards to a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying a pressure to the interconnection portion to electrically interconnect the land of the first printed circuit board with the land of the second printed circuit board; and

softening and deforming a part of the thermoplastic resin forming the insulating substrate of the first printed circuit board to cover and seal the electrical interconnection portion.

25. The method of claim 24, wherein:

the forming of a first board conductive pattern further comprises forming the first board conductive pattern on a region of the first board connection surface, the region excluding a front edge portion of the first printed circuit board so that the thermoplastic resin is exposed at the front edge portion; and

the heating of an interconnection portion between the first and second printed circuit boards further comprises adhering the thermoplastic resin exposed at the front edge portion to the second board connection surface.

26. The method of claim 24, further comprising, after forming the second board conductive pattern, forming a second board protective film on the second printed circuit board to cover the second board conductive pattern except the land.

27. The method of claim 24, wherein the forming of the first board conductive pattern and the second board conductive pattern further includes forming the first board conductive pattern and the second conductive pattern to include a plurality of wiring members and a plurality of lands respectively connected to the plurality of wiring members.

28. The method of claim 24, wherein the heating of the interconnection portion further comprises pulse heating the interconnection portion.

29. The method of claim 24, wherein the overlapping the land of the first printed circuit board with the land of the second printed circuit board further comprises applying a conductive adhesive or solder plating film between the land of the first printed circuit board and the land of the second printed circuit board.