Transparent substrate and hinged optical assembly

• US 6,450,704 B1
• Filed: 09/13/2001
• Issued: 09/17/2002
• Est. Priority Date: 10/05/2000
• Status: Expired due to Term

• Current Assignee: Sumitomo Electric Device Innovations, U.S.A., Inc. (Sumitomo Corporation)
• Original Assignee: Corona Optical Systems, Inc. (Emcore Corporation)
• Inventors: Greene, John, Wickman, Randy, Mansur, Daniel, Gregory, Bryan, Barneson, Dave, OʼConnor, Gary
• Primary Examiner(s): Kim, Ellen E.
• Application Number:
  US09/951,646
• Publication Number:
  US 20020041740A1
• Time in Patent Office: 369 Days
• Field of Search: 385/92, 385/52, 385/88-91
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4259 of the transparent type
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/4283 with electrical insulation means
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures. Optical signals of the optical devices of the optical array are coupled to respective optical fibers of the aligned optical fiber holder. A printed circuit board having a first surface is attached to a mating surface of the substrate'"'"'s second planar element.

Claims

1. A method for providing an electro-optic signal processing assembly, such method comprising the steps of:

providing an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge, and a plurality of alignment apertures formed in the substrate;

disposing a guide pin in each of the plurality of alignment apertures;

disposing a plurality of optical devices of an optical array on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate;

disposing a signal processor on the first planar element of the substrate;

aligning an optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder to the optical array using the guide pins and guide pin apertures;

coupling optical signals of the optical devices of the optical array to respective optical fibers of the aligned optical fiber holder; and

attaching a printed circuit board having a first surface to a mating surface of the substrate'"'"'s second planar element.

2. The method for providing an electro-optic signal processing device as in claim 1 further comprising defining the signal processor as an amplifier.

3. The method for providing an electro-optic signal processing device as in claim 2 further including disposing conductive traces on a first surface of the substrate traversing both planar elements of the substrate.

4. The method for providing an electro-optic signal processing device as in claim 3 further comprising coupling the optical devices of the optical array and amplifier with at least some of the conductive traces traversing both planar elements of the substrate.

5. The method for providing an electro-optic signal processing device as in claim 4 further comprising the amplifier on the substrate amplifying a driving signal of a laser of the optical array.

6. The method for providing an electro-optic signal processing device as in claim 5 further comprising the amplifier on the optically transparent substrate amplifying a signal from a photodetector of the optical array.

7. The method for providing an electro-optic signal processing device as in claim 4 further including providing an etched groove disposed on the second surface of the substrate, and forming the substrate into an L-shaped bracket defined by the first and second planar elements along the etched groove.

8. The method for providing an electro-optic signal processing device as in claim 7 further comprising interconnecting the first and second planar elements of the substrate with a flexible hinge formed from the at least some of the conductive traces disposed on the first surface of the substrate.

9. The method for providing an electro-optic signal processing device as in claim 8 further including disposing a flexible material on the first surface of the substrate across the interconnecting hinge.

10. The method for providing an electro-optic signal processing device as in claim 9 further comprising defining the flexible material disposed on the first surface of the substrate as a layer of polyimide disposed across the interconnecting hinge connecting the first and second planar elements.

11. An electro-optic signal processing device, such package comprising:

an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles, and alignment apertures formed in the substrate,

a plurality of optical devices of the optical array disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate,

a signal processor disposed on the first planar element of the substrate,

means for holding a plurality of optical fibers and for guiding the optical devices of the array into alignment with the respective optical fibers using guide pin apertures located on a first surface of the substrate, and

a printed circuit board having a first surface attached to a mating surface of the substrate'"'"'s second planar element.

12. The electro-optic signal processing device as in claim 11 wherein the signal processor further comprises an amplifier.

13. The electro-optic signal processing device as in claim 12 further comprising conductive traces traversing both planar elements of the substrate.

14. The electro-optic signal processing device as in claim 13 wherein at least some of the conductive traces traversing the planar elements of the substrate further comprise an electrical coupling between the optical devices of the optical array and the amplifier.

15. The electro-optic signal processing device as in claim 14 further comprising the amplifier on the substrate connected to amplify a driving signal of a laser of the optical array.

16. The electro-optic signal processing device as in claim 15 further comprising the amplifier on the optically transparent substrate connected to amplify a signal from a photodetector of the optical array.

17. The electro-optic signal processing device as in claim 14 further comprising an etched groove disposed on the second surface of the substrate, and the substrate formed into an L-shaped bracket defined by the first and second planar elements on respective sides of the etched groove.

18. The electro-optic signal processing device as in claim 17 wherein at least some of the conductive traces disposed on the first surface of the substrate interconnect the first and second planar elements of the substrate, forming an interconnect hinge.

19. The electro-optic signal processing device as in claim 18 further including a flexible material disposed on the first surface of the substrate substantially proximate the interconnect hinge.

20. The electro-optic signal processing device as in claim 19 wherein the flexible material disposed on the first surface of the substrate substantially proximate the interconnect hinge further comprises attaching a layer of polyimide across the interconnect hinge to the first and second planar elements.