Method and apparatus for overcoming infection in a tissue pocket surrounding an implanted device

• US 6,451,003 B1
• Filed: 08/16/2000
• Issued: 09/17/2002
• Est. Priority Date: 08/16/2000
• Status: Expired due to Term

• Current Assignee: ND Partners LLC
• Original Assignee: Biolink Corp. (Acacia Capital Corp.)
• Inventors: Polaschegg, Hans-Dietrich, Prosl, Frank R., Estabrook, Brian K., Sodemann, Klaus
• Primary Examiner(s): Tapolcai, William E.
• Application Number:
  US09/640,292
• Time in Patent Office: 762 Days
• Field of Search: 604/265, 604/507, 604/509, 604/514
• US Class Current: 604/507
• CPC Class Codes: A61L 2300/104 Silver, e.g. silver sulfadiazine
• CPC Class Codes: A61L 2300/204 with nitrogen-containing functional groups, e.g. aminoxides, nitriles, guanidines
• CPC Class Codes: A61L 2300/404 Biocides, antimicrobial agents, antiseptic agents
• CPC Class Codes: A61L 27/54 Biologically active materials, e.g. therapeutic substances A61L27/227 takes precedence
• CPC Class Codes: A61L 29/16 Biologically active materials, e.g. therapeutic substances A61L29/048 takes precedence
• CPC Class Codes: A61M 39/0208 Subcutaneous access sites for injecting or removing fluids transcutaneous access sites A61M39/0247; implantable infusion devices A61M5/14276

Abstract

An improvement in an implantable port of the type including a housing that is implanted within a subcutaneous tissue pocket is disclosed, wherein the improvement comprises the presence of metallic silver, an inorganic silver compound, a silver salt of an organic acid, or other antimicrobial substances such as taurolidine on the surfaces of the port in contact with, or proximate to, the tissue of said pocket.

Claims

1. A process for disinfecting and rendering inhospitable to infections the space between an implanted device and encapsulating tissue which forms around the device, said process comprising the step of applying an antimicrobial substance to the external surface of the implanted device in a configuration such that the antimicrobial substance is able to leach into said space.

2. The process of claim 1 wherein the step of applying the antimicrobial substance to the external surface of the implanted device is performed by a process chosen from the group plating, electroless plating, and sputtering.

3. The process of claim 1 comprising an additional step inserted before the applying step, said additional step comprising preparing the surface of the implanted device by a process chosen from the group comprising roughening and grooving.

4. The process of claim 1 wherein the step of applying the antimicrobial substance to the external surface of the implanted device is performed by a process of attaching an adhesive mixture of a proteinaceous or polymeric matrix and particles of an antimicrobial substance.

5. The process of claim 4 in which the particles of an antimicrobial substance comprise an oligodynamic metal.

6. The process of claim 4 in which the particles of an antimicrobial substance comprise taurolidine.

7. The process of claim 1 in which the antimicrobial substance comprises silver and the silver is applied by first applying an emulsion of silver halide to the exterior of the device, second exposing said emulsion to light, and third subjecting the emulsion to the reducing action of a photographic developer.

8. A process for disinfecting and rendering inhospitable to infections the space between an implanted device and the encapsulating tissue which forms around the device, said process comprising the steps of first partially withdrawing a needle from the implanted device and then flowing a solution comprising an antimicrobial substance into said space.

9. The process of claim 8 in which the implanted device is configured with an additional flow path hydraulically connected to a main flow path in the implanted device and opening into the pocket, said main flow path and said additional flow path being configured such that partial withdrawal of the needle opens the additional flow path into the pocket.