RFID manufacturing concepts

• US 6,451,154 B1
• Filed: 02/18/2000
• Issued: 09/17/2002
• Est. Priority Date: 02/18/2000
• Status: Expired due to Term

• Current Assignee: Moore North America Incorporated (RR Donnelley & Sons Company)
• Original Assignee: Moore North America Incorporated (RR Donnelley & Sons Company)
• Inventors: Nash, Thomas P., Palmer, Eric V., Soltysiak, John R., Shipston, Adele C., Mitchell, Nancy G., Grabau, Robert E.
• Primary Examiner(s): Ball, Michael W.
• Assistant Examiner(s): Rossi, Jessica
• Application Number:
  US09/506,577
• Time in Patent Office: 942 Days
• Field of Search: 156/290, 156/291, 156/293, 156/295, 156/799, 156/300, 156/555, 156/580-581, 156/582, 257/679, 257/723-724, 257/778, 361/737, 340/825.34, 340/572.1, 297/38--40
• US Class Current: 156/300
• CPC Class Codes: B31D 1/021 Making adhesive labels having a multilayered structure, e.g. provided on carrier webs
• CPC Class Codes: B31D 1/027 involving, marking, printing or coding
• CPC Class Codes: B31D 1/028 Applying RFID chips
• CPC Class Codes: G06K 17/0025 the arrangement consisting of a wireless interrogation device in combination with a device for optically marking the record carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: Y10T 156/1093 with covering of discrete laminae with additional lamina
• CPC Class Codes: Y10T 156/1095 Opposed laminae are running length webs
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 156/1741 Progressive continuous bonding press [e.g., roll couples]
• CPC Class Codes: Y10T 29/5317 Laminated device
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive
• CPC Class Codes: Y10T 428/1471 Protective layer
• CPC Class Codes: Y10T 428/1486 Ornamental, decorative, pattern, or indicia
• CPC Class Codes: Y10T 428/15 Sheet, web, or layer weakened to permit separation through thickness
• CPC Class Codes: Y10T 428/24851 Intermediate layer is discontinuous or differential
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2848 Three or more layers

Abstract

Radio frequency identification labels are made in a high speed and effective manner in a variety of different ways utilizing a number of different sources of RFID inlets, each inlet including an antenna and a chip. A plurality of webs are matched together and RFID labels are die cut from the webs, to produce lined RFID labels. Alternatively linerless RFID labels are produced from a composite web with a release material on one face and pressure sensitive adhesive on the other, the labels formed by perforations in the web.

Claims

1. A method of making RFID labels, comprising:

(a) providing a plurality of RFID inlets, each including a chip, on a first web;

(b) covering the RFID inlets with a second web to provide a composite web;

(c) providing pressure sensitive adhesive on a portion of one of the webs that will be an exterior portion of a label once ultimately formed;

(d) at least one of verifying the functionality of, or programming, the chips prior to formation of the composite web; and

(e) acting on the composite web so as to provide the composite web into labels having a top face, and a bottom face with pressure sensitive adhesive,

wherein (b) is practiced by laminating the first and second webs by passing them between laminating rolls without harming the inlets, wherein (b) is practiced without harming the chips by providing a recess in at least one of the laminating rolls in alignment with the inlets.

2. A method as recited in claim 1 further comprising sensing the RFID chips or inlets prior to formation of the composite web so as to establish a registration signal for what will become each label.

3. A method as recited in claim 1 further comprising (f) making a final RFID chip read verification after (e).

4. A method as recited in claim 1 wherein (e) is practiced by die cutting the labels from one of the webs to provide a plurality of labels and matrix material on a liner, and removing the matrix material from the labels on the liner.

5. A method as recited in claim 1 further comprising applying a coating of adhesive release material to one of the webs, opposite the pressure sensitive adhesive;

and wherein (e) is practiced by perforating the composite web to form a plurality of linerless labels.

6. A method as recited in claim 1 wherein (a) is practiced using a paper web as the first web, and wherein (b) is practiced using transfer tape, or a liner which coated with pressure sensitive adhesive prior to engagement between the webs, as the second web.

7. A method as recited in claim 1 further comprising (f) imaging variable indicia on the top face of said labels, and (a)-(e) are practiced at a rate of at least about 100 ft./minute.

8. A method as recited in claim 7 wherein (f) is practiced after (e).

9. A method as recited in claim 1 wherein (b) is practiced by cutting the first web to provide separate sheets each having an inlet, and placing the sheets onto the second web.

10. A method as recited in claim 9 wherein (b) is further practiced by placing the sheets onto adhesive on the second web.

11. A method as recited in claim 9 wherein (b) is further practiced by laminating a third web onto the composite web so that the sheets with inlets are disposed between the second and third webs by passing the webs between laminating rolls to sandwich the chips between the second and third webs.

12. A method as recited in claim 11 further comprising (f) forming openings or recesses in the third web aligned with the inlets, and wherein (b) is further practiced by insuring that the inlets enter the openings or recesses in the third web.

13. A method as recited in claim 12 wherein (f) is practiced by die cutting openings in the third web.

14. A method as recited in claim 12 wherein (f) is practiced by calendering recesses in the third web.

15. A method as recited in claim 1 wherein (a) is practiced using RFID film.

16. A method as recited in claim 15 wherein (b) is practiced by separating a face stock and liner of a label laminate, and using one of the face stock or liner as the second web and the other as a third web;

and further comprising, after (b), (g) laminating the third web onto the composite web with the first web and RFID inlets between the second and third webs by passing the webs between laminating rolls to sandwich the chips between the second and third webs.

17. A method as recited in claim 16 further comprising (g) forming openings or recesses in the third web aligned with the inlets, and wherein (f) is further practiced by insuring that the inlets enter the openings or recesses in the third web.

18. A method as recited in claim 17 further comprising (h) imaging variable indicia on the top face of the labels after (e);

(i) sensing the RFID inlets prior to formation of the composite web so as to establish a registration signal for what will become each label;

(j) making a final RFID chip read verification after (e).