Electronics module having power components, and a method of manufacture

• US 6,452,808 B2
• Filed: 01/11/2001
• Issued: 09/17/2002
• Est. Priority Date: 01/11/2000
• Status: Expired due to Term

• Current Assignee: Johnson Controls Automotive Electronic (Johnson Controls International plc)
• Original Assignee: Sagem SA (Safran SA)
• Inventors: Hoche, Jean
• Primary Examiner(s): Martin, David
• Assistant Examiner(s): BUI, HUNG S
• Application Number:
  US09/757,530
• Publication Number:
  US 20010007287A1
• Time in Patent Office: 614 Days
• Field of Search: 361/774, 361/720, 361/760, 361/753, 361/799, 361/800, 361/748, 361/777, 361/778, 361/772, 361/773, 361/805, 174/35.R, 174/51, 174/52.4, 174/260, 174/261, 174/250, 438/619, 257/276, 257/776, 257/691, 257/690, 439/507, 439/508, 439/509, 439/510, 439/514, 439/515, 439/952, 439/957
• US Class Current: 361/774
• CPC Class Codes: H01R 12/526 the printed circuits being on the same board with plated through holes H05K3/42
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 31/08 Short-circuiting members for bridging contacts in a counterpart
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 3/222 Completing of printed circuits by adding non-printed jumper connections printed jumper connections H05K3/4685

Abstract

A power electronics module has a metal substrate, a printed circuit card carried on one of the faces of the substrate, and components, at least some of which are power components, mounted on the card. The card also carries electrical interconnection tracks between the components themselves and with external power supply. Conductive bridges of a shape enabling each of them to extend over a power component mutually interconnect short segments of interconnection tracks, that carry power current.

Claims

1. Power electronics module comprising:

a metal substrate having two faces

a printed circuit car carried on one of the faces of the substrate;

a plurality on components, at least some of which are power components, mounted on the card; and

electrical interconnection means between said components and between said components and external means;

wherein said interconnection means include

a plurality of short segments of equipotential interconnection tracks on the printed circuit card for carrying power currents, and

a plurality of conductive bridges of a shape enabling each of them to extend over a respective and beyond one of said power components and each of them mutually interconnecting two of said short segments of said equipotential interconnection tracks, that carry power currents.

2. Module according to claim 1, wherein said equipotential interconnection tracks printed on the printed circuit card further include equipotential tracks carrying control currents and wherein said short segments have a cross-sectional area greater than a cross-sectional area of said equipotential tracks carrying control currents.

3. Module according to claim 1, wherein said bridges have ends thereof soldered onto the card.

4. Module according to claim 1, wherein the printed circuit card is single layer.

5. Module according to claim 1, wherein the printed circuit card is multi-layer with an insulated face, bonded to the substrate.

6. Module according to claim 1, wherein said substrate is carried by a cooled wall or contains a circuit for a cooling fluid.

7. Power electronics module comprising:

a metal substrate having two faces

printed circuit card carried on one of the faces of the substrate;

a plurality on components, at least some of which are power components, mounted on the card; and

electrical interconnection means between said components and between said components and external means;

wherein said interconnection means include

a plurality of equipotential interconnection tracks each having short segments for carrying power currents, and

a plurality of staple-shaped conductive bridges each of them having a length and height sufficient to straddle a respective one of said power components without contact with said respective one of said power components and each of them mutually interconnecting two of said short segments of those of said equipotential interconnection tracks that carry power currents.

8. Power electronics module according to claim 7, wherein all of the bridges have the same size.

9. Power electronics module according to claim 7, wherein most of the bridges have the same size.