Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout

• US 6,453,457 B1
• Filed: 09/29/2000
• Issued: 09/17/2002
• Est. Priority Date: 09/29/2000
• Status: Active Grant

• Current Assignee: Synopsys Merger Holdings LLC (Synopsys Incorporated)
• Original Assignee: Numerical Technologies Inc. (Synopsys Incorporated)
• Inventors: Pierrat, Christophe, Zhang, Youping
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): PERT, EVAN T
• Application Number:
  US09/676,356
• Time in Patent Office: 718 Days
• Field of Search: 716/19, 716/20, 716/21, 430/5, 257/618, 438/129
• US Class Current: 716/53
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G03F 1/70 Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
• CPC Class Codes: Y10S 977/734 Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.

Abstract

Techniques for fabricating a device include forming a fabrication layout such as a mask layout, for a physical design layer, such as a design for an integrated circuit, and identifying evaluation points on an edge of a polygon corresponding to the design layer for correcting proximity effects. Included are techniques that correct for proximity effects associated with an edge in a layout corresponding to a design layer. An evaluation point is determined for the edge based on a profile of amplitudes output from a proximity effects model along a transect. The transect includes a target edge in the design layer corresponding to the edge. It is then determined how to correct at least a portion of the edge for proximity effects based on an analysis at the evaluation point. In other techniques, a dissection length parameter is derived based on a profile of amplitudes output by a proximity effects model along a transect. The transect includes a second edge in a second layout. An evaluation point is determined for a first edge based on the dissection length parameter. Then it is determined how to correct at least a portion of the first edge based on an analysis at the evaluation point.

Claims

1. A method of correcting for proximity effects associated with an edge in a layout corresponding to a design layer, the method comprising:

determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge; and

determining how to correct at least a portion of the edge for proximity effects based on an analysis at the evaluation point.

2. The method of claim 1, further comprising executing a routine implementing the proximity effects model for a plurality of points on the transect before said determining an evaluation point.

3. The method of claim 1, further comprising retrieving stored amplitudes for a plurality of points on the transect before said determining an evaluation point.

4. The method of claim 1, wherein the layout is the design layer for a printed features layer.

5. The method of claim 1, wherein the layout is an originally proposed fabrication layout for the design layer.

6. The method of claim 1, wherein:

the layout is an adjusted fabrication layout for the design layer; and

the adjusted fabrication layout includes at least a segment of the edge displaced from a corresponding target edge in the design layer.

7. The method of claim 1, before said determining an evaluation point, further comprising:

determining whether the target edge is a critical edge; and

if it is determined that the target edge is a critical edge, then executing a routine implementing the proximity effects model for a plurality of points on the transect.

8. The method of claim 7, wherein a target edge is a critical edge if it includes an edge of a true-gate.

9. The method of claim 7, wherein a target edge is a critical edge if it lies within a predetermined halo distance of another edge.

10. The method of claim 7, wherein a target edge is a critical edge if a corresponding edge in the layout has been adjusted for proximity effects in a previous round of corrections.

11. The method of claim 1, said determining an evaluation point further comprising determining a corresponding segment on the target edge, wherein said corresponding segment is associated with the portion of the edge corrected based on the analysis at the evaluation point.

12. The method of claim 11, said determining an evaluation point further comprising establishing an evaluation point where the profile substantially equals a predetermined percentage of a threshold value, wherein the threshold value defines an amplitude where the proximity effects model predicts an edge is printed in the printed features layer.

13. The method of claim 11, said determining the corresponding segment further comprising determining a corner segment extending from a vertex nearest the evaluation point to a corner segment dissection point where the profile exceeds a predetermined percentage of a threshold value, wherein the threshold value defines an amplitude where the proximity effects model predicts an edge is printed in the printed features layer.

14. The method of claim 11, said determining the corresponding segment further comprising determining a corner segment extending from a vertex nearest the evaluation point to a corner segment dissection point where the profile flattens.

15. The method of claim 11, said determining the evaluation point further comprising establishing a corner evaluation point where the profile substantially equals a predetermined fraction of an amplitude value where the profile flattens.

16. The method of claim 11, said determining the evaluation point further comprising establishing the evaluation point where the profile deviates more than a predetermined amount from an ideal profile having no proximity effects from another edge in the layout.

17. The method of claim 11, said determining the corresponding segment further comprising establishing the segment where the profile deviates more than a predetermined amount from an ideal profile having no proximity effects from another edge in the layout.

18. The method of claim 11, said determining the evaluation point further comprising establishing the evaluation point substantially between two local maxima in an absolute value of a first derivative of the profile.

19. The method of claim 11, said determining the corresponding segment further comprising establishing the segment to extend substantially from one local maximum in an absolute value of a first derivative of the profile to a next adjacent local maximum in the absolute value of the first derivative.

20. The method of claim 11, said determining the corresponding segment further comprising establishing the segment to extend substantially from a local maximum in an absolute value of a first derivative of the profile to a next adjacent local minimum in the absolute value of the first derivative.

21. The method of claim 11, said determining the evaluation point further comprising establishing the evaluation point substantially at a local maximum in an absolute value of a second derivative of the profile.

22. The method of claim 11, said determining the corresponding segment further comprising establishing the segment to extend substantially from a point where a second derivative of the profile crosses zero to a next adjacent point where the second derivative crosses zero.

23. A method of using a computer to correct for proximity effects associated with an edge in a layout corresponding to a design layer, the computer having a processor coupled to a computer-readable medium, the computer-readable medium storing at least a portion of the design layer, the design layer corresponding to a portion of an integrated circuit, the method comprising:

determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge; and

determining how to correct at least a portion of the edge for proximity effects based on an analysis at the evaluation point.

24. A method of correcting for proximity effects associated with an edge in a layout corresponding to a design layer, the method comprising:

determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;

determining an evaluation point based on at least one of the profile and the dissection points; and

determining how to correct a segment of the edge corresponding to two dissection points for proximity effects based on an analysis at the evaluation point.

25. A method of using a computer to correct for proximity effects associated with an edge in a layout corresponding to a design layer, the computer having a processor coupled to a computer-readable medium, the computer-readable medium storing at least a portion of the design layer, the design layer corresponding to a portion of an integrated circuit, the method comprising:

determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,

determining an evaluation point based on at least one of the profile and the dissection points;

determining how to correct a segment of the edge corresponding to two dissection points for proximity effects based on an analysis at the evaluation point.

26. A method of correcting for proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the method comprising:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout; and

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

27. The method of claim 26, wherein the first layout is also the second layout.

28. The method of claim 26, wherein:

the first layout is a proposed fabrication layout for the printed features layer; and

the second layout is a test layout.

29. The method of claim 28, before said deriving a dissection length, the method further comprising retrieving amplitudes stored during building of the proximity effects model.

30. The method of claim 26, said deriving a dissection length parameter further comprising:

determining a segment based on the profile; and

setting the dissection length parameter based on a length of the segment.

31. The method of claim 30, wherein:

a threshold value is an amplitude where the proximity effects model predicts an edge is printed in the printed features layer;

said determining a segment further comprises establishing a corner segment extending from a vertex of the second edge to a corner segment dissection point where the profile exceeds a predetermined percentage of the threshold value; and

the dissection length parameter is a corner dissection segment length.

32. The method of claim 30, wherein:

said determining a segment further comprises establishing a corner segment extending from a vertex of the second edge to a corner segment dissection point where the profile flattens; and

the dissection length parameter is a corner dissection segment length.

33. The method of claim 30, wherein:

said determining a segment further comprises establishing a segment where the profile deviates more than a predetermined amount from an ideal profile with no proximity effects from another edge in the second layout; and

the dissection length parameter is a detail dissection segment length.

34. The method of claim 30, wherein:

said determining a segment further comprises establishing the segment to extend from one local maximum in an absolute value of a first derivative of the profile to a next adjacent local maximum in the absolute value of the first derivative; and

the dissection length parameter is at least one of a detail dissection segment length and a maximum dissection segment length.

35. The method of claim 30, wherein:

said determining a segment further comprises establishing the segment to extend from a local maximum in an absolute value of a first derivative of the profile to a next adjacent local minimum in the absolute value of the first derivative; and

the dissection length parameter is at least one of a detail dissection segment length and a maximum dissection segment length.

36. The method of claim 30, wherein:

said determining a segment further comprises establishing the segment to extend from a point where a second derivative of the profile crosses zero a next adjacent point where the second derivative crosses zero; and

the dissection length parameter is at least one of a detail dissection segment length and a maximum dissection segment length.

37. The method of claim 30, wherein:

the dissection length parameter is a halo distance; and

said deriving the dissection length parameter comprises determining whether the profile deviates more than a predetermined amount from an ideal profile with no proximity effects from another edge in the first layout,

if the profile deviates more than the predetermined amount, then determining a distance to a third edge in the second layout associated with each deviation, and

including the distance in a set of distances; and

setting the halo distance based on the set of distances.

38. The method of claim 30, wherein:

said deriving a dissection length parameter further comprises,

after said determining a segment based on the profile, including a length of the segment in a set of segment lengths,

determining another segment based on another profile of amplitudes along another transect including another edge in the second layout,

including another length of the segment in the set of segment lengths, and repeating said determining another segment for a plurality of edges in the second layout; and

setting the dissection length parameter further comprises setting the dissection length parameter based on the set of segment lengths.

39. The method of claim 38, wherein:

the dissection length parameter is a corner dissection segment length;

a corner segment includes one vertex of an edge; and

only a corner segment has a length included in the set of segment lengths.

40. The method of claim 38, wherein:

the dissection length parameter is at least one of a detail dissection segment length and a maximum dissection segment length;

a non-corner segment includes no vertex of an edge; and

only a non-corner segment has a length included in the set of segment lengths.

41. The method of claim 38, wherein the dissection length parameter is based on a mode of the set of segment lengths.

42. A method of using a computer to correct for proximity effects associated with a first edge in a first layout corresponding to a design layer, the computer having a processor coupled to a computer-readable medium, the computer-readable medium storing at least a portion of the design layer, the design layer corresponding to a portion of an integrated circuit, the method comprising:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout; and

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

43. A method of correcting for proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the method comprising:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout; and

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

44. The method of claim 43, wherein the first layout is also the second layout.

45. The method of claim 43, wherein:

the first layout is a proposed fabrication layout for the printed features layer; and

the second layout is a test layout.

46. The method of claim 43, said deriving a dissection length parameter further comprising obtaining the profile by retrieving amplitudes stored during building of the proximity effects model.

47. The method of claim 43, wherein:

the plurality of polygons comprises a plurality of polygon sets associated with corresponding pitch distances;

a threshold value is a particular amplitude where the proximity effects model predicts an edge is printed in the printed features layer; and

said deriving a dissection length parameter further comprises,

determining whether a set of points along the profile associated with a polygon set includes a point having an amplitude that exceeds the threshold value,

if it is determined that the set of points includes an amplitude that exceeds the threshold value, then including a pitch distance associated with the polygon set in a set of printable pitches, and

deriving the dissection length parameter based on the set of printable pitches.

48. The method of claim 47, deriving the dissection length parameter comprises setting the dissection length parameter substantially equal to a smallest pitch distance in the set of printable pitches.

49. The method of claim 43, wherein:

the plurality of polygons comprises a plurality of polygon sets associated with corresponding pitch distances;

a threshold value is a particular amplitude where the proximity effects model predicts an edge is printed in the printed features layer; and

the step of deriving a dissection length parameter based on the profile further comprises,

finding a plurality of peak amplitudes corresponding to the plurality of pitch distances, each peak amplitude substantially equal to a maximum amplitude among all points on the profile associated with a polygon

interpolating the plurality of peak amplitudes and the corresponding plurality of pitch distances to obtain a particular distance associated with the threshold value, and

deriving the dissection length parameter based on the particular distance.

50. The method of claim 43, wherein the dissection length parameter is a corner dissection segment length used as a target length for a segment on the first edge that includes one vertex of the first edge.

51. The method of claim 43, wherein the dissection length parameter is a detail dissection segment length used as a target length for a segment on the first edge that includes neither vertex of the first edge.

52. A method of using a computer to correct for proximity effects associated with a first edge in a first layout corresponding to a design layer, the computer having a processor coupled to a computer-readable medium, the computer-readable medium storing at least a portion of the design layer, the design layer corresponding to a portion of an integrated circuit, the method comprising:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout; and

determining an evaluation point on the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

53. A computer readable medium for correcting proximity effects associated with an edge in a layout corresponding to a design layer, the computer readable medium carrying instructions to cause one or more processors to perform:

determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge; and

determining how to correct at least a portion of the edge for proximity effects based on an analysis at the evaluation point.

54. A computer readable medium for correcting proximity effects associated with an edge in a layout corresponding to a design layer, the computer readable medium carrying instructions to cause one or more processors to perform:

determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;

determining an evaluation point based on at least one of the profile and the dissection points; and

determining how to correct a segment of the edge corresponding to two dissection points for proximity effects based on an analysis at the evaluation point.

55. A computer readable medium for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the computer readable medium carrying instructions to cause one or more processors to perform:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout; and

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

56. A computer readable medium for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the computer readable medium carrying instructions to cause one or more processors to perform:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout; and

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

57. A carrier wave for correcting proximity effects associated with an edge in a layout corresponding to a design layer, the carrier wave carrying instructions to cause one or more processors to perform:

determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge; and

determining how to correct at least a portion of the edge for proximity effects based on an analysis at the evaluation point.

58. A carrier wave for correcting proximity effects associated with an edge in a layout corresponding to a design layer, the carrier wave carrying instructions to cause one or more processors to perform:

determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;

determining an evaluation point based on at least one of the profile and the dissection points; and

determining how to correct a segment of the edge corresponding to two dissection points for proximity effects based on an analysis at the evaluation point.

59. A carrier wave for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the carrier wave carrying instructions to cause one or more processors to perform:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout; and

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

60. A carrier wave for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the carrier wave carrying instructions to cause one or more processors to perform:

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout; and

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter; and

determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

61. A computer system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the computer system comprising:

a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit; and

one or more processors coupled to the computer readable medium, the one or more processors configured for

determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,

determining a correction based on an analysis of an amplitude from the profile at the evaluation point, and

applying the correction to at least a portion of the edge.

62. A computer system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the computer system comprising:

a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit; and

one or more processors coupled to the computer readable medium, the one or more processors configured for

determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,

determining an evaluation point based on at least one of the profile and the dissection points,

determining a correction based on an analysis of an amplitude from the profile at the evaluation point, and

applying the correction to at least a portion of the edge corresponding to two dissection points.

63. A computer system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the computer system comprising:

a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit; and

one or more processors coupled to the computer readable medium, the one or more processors configured for

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout,

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,

executing a routine implementing the proximity effects model for the evaluation point to produce a model amplitude at the evaluation point,

determining a correction based on an analysis of the model amplitude at the evaluation point, and

applying the correction to at least a portion of the edge.

64. A computer system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the computer system comprising:

a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit; and

one or more processors coupled to the computer readable medium, the one or more processors configured for

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout,

determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,

executing a routine implementing the proximity effects model for the evaluation point to produce a model amplitude at the evaluation point

determining a correction based on an analysis of the model amplitude at the evaluation point, and

applying the correction to at least a portion of the edge.

65. A system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the system comprising:

a means for determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,

the proximity effects model for producing the profile;

a means for analyzing an amplitude from the profile at the evaluation point to determine a correction; and

a means for applying the correction to at least a portion of the edge.

66. A system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the system comprising:

a means for determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge and determining an evaluation point based on at least one of the profile and the dissection points,

the proximity effects model for producing the profile;

a means for analyzing an amplitude from the profile at the evaluation point to determine a correction; and

a means for applying the correction to at least a portion of the edge corresponding to two dissection points.

67. A system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the system comprising:

a means for deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout,

a means for determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,

the proximity effects model for producing a model amplitude at the evaluation point;

a means for analyzing the model amplitude at the evaluation point to determine a correction; and

a means for applying the correction to at least a portion of the first edge.

68. A system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the system comprising:

a means for deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout,

a means for determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,

the proximity effects model for producing a model amplitude at the evaluation point;

a means for analyzing the model amplitude at the evaluation point to determine a correction; and

a means for applying the correction to at least a portion of the first edge.

69. A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a edge of a polygon;

determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,

analyzing an amplitude from the profile at the evaluation point to determine a correction;

applying the correction to at least a portion of the edge;

producing a mask based on the portion of the edge corrected; and

producing the printed features layer in a fabrication process using the mask.

70. A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a edge of a polygon;

determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;

determining an evaluation point based on at least one of the profile and the dissection points;

analyzing an amplitude from the profile at the evaluation point to determine a correction;

applying the correction to at least a portion of the edge;

producing a mask based on the portion of the edge corrected; and

producing the printed features layer in a fabrication process using the mask.

71. A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a first edge of a first polygon;

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout;

determining an evaluation point for the first edge in the initial fabrication layout based on the dissection length parameter;

executing a routine implementing a proximity effects model for producing a model amplitude at the evaluation point;

analyzing the model amplitude to determine a correction;

applying the correction to at least a portion of the edge;

producing a mask based on the portion of the edge corrected; and

producing the printed features layer in a fabrication process using the mask.

72. A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a first edge of a first polygon;

deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout;

determining an evaluation point for the first edge in the initial fabrication layout based on the dissection length parameter;

executing a routine implementing a proximity effects model for producing a model amplitude at the evaluation point;

analyzing the model amplitude to determine a correction;

applying the correction to at least a portion of the edge;

producing a mask based on the portion of the edge corrected; and

producing the printed features layer in a fabrication process using the mask.

73. A method of fabricating an integrated circuit using a mask, the mask including a segment corresponding to at least one portion of an edge in a design layer for the integrated circuit, the method comprising:

determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a target edge in the design layer collinear with the edge; and

displacing at least a portion of the edge for proximity effects based on an analysis at the evaluation point.

74. The method of claim 73, before determining the evaluation point, further comprising:

determining whether the target edge is a critical edge; and

if it is determined that the target edge is a critical edge, then executing a routine implementing the proximity effects model for a plurality of points on the target edge.

75. The method of claim 74, wherein the target edge is a critical edge if it lies within a predetermined halo distance of another edge.

76. The method of claim 73, wherein determining an evaluation point includes establishing where the profile substantially equals a predetermined percentage of a threshold value, wherein the threshold value defines an amplitude where the proximity effects model predicts an edge is printed on the integrated circuit.