Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology

• US 6,455,930 B1
• Filed: 09/18/2000
• Issued: 09/24/2002
• Est. Priority Date: 12/13/1999
• Status: Expired due to Term

• Current Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Original Assignee: Lamina Ceramics, Inc.
• Inventors: Palanisamy, Ponnuswamy, Sreeram, Attiganal Narayanaswamy, Tormey, Ellen Schwartz, Thaler, Barry Jay, Connolly, John, Martinelli, Ramon Ubaldo, Prabhu, Ashok Narayan, Hammond, Mark Stuart
• Primary Examiner(s): Talbott, David L.
• Assistant Examiner(s): Chambliss, Alonzo
• Application Number:
  US09/664,599
• Time in Patent Office: 736 Days
• Field of Search: 257/706, 257/707, 257/710, 257/712, 257/717, 257/720, 257/723, 257/724, 257/668, 257/700, 257/701, 257/703, 257/713, 257/738, 257/758, 257/778, 174/52.4, 174/252, 361/702, 361/704, 361/709, 361/711, 361/712, 361/719, 361/703, 438/121, 438/122
• US Class Current: 257/706
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/02415 by using a thermo-electric cooler [TEC], e.g. Peltier element
• CPC Class Codes: H01S 5/02484 Sapphire or diamond heat spreaders

Abstract

Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Claims

1. A low temperature cofired ceramic-metal (LTCC-M) system integrated package comprising:

at least one ceramic circuit board, the circuit board having one or more conductive traces,

at least one electronic component mounted on the ceramic circuit board, the electronic component electrically connected to one or more of the conductive traces;

a first metal substrate supporting the ceramic circuit board, the circuit board bonded to the metal substrate with a bonding material; and

a second metal substrate thermally connected to the first metal substrate via thermoelectric plates, wherein the thermoelectric plates regulate and control the temperature of the electronic component.

2. An integrated package according to claim 1 further comprising a flip chip electrically connected to the ceramic circuit board.

3. An integrated package according to claim 2 wherein a flexible circuit is bonded to the flip chip and to the ceramic circuit board.

4. An integrated package according to claim 2 wherein the ceramic circuit board and the flip chip each has a metallization pattern to receive an array of solder balls.

5. An integrated package according to claim 1 wherein a lid is hermetically sealed over the electronic component.

6. An integrated package according to claim 1 wherein the metal substrate is selected from the group consisting of Kovar®

, molybdenum, copper/tungsten composite, AlSiC, Al-graphite composite and Cu-graphite composite.

7. An integrated package according to claim 1 wherein the electronic component is a semiconductor laser.

8. An integrated package according to claim 7 further comprising an optical wave guide, optically coupled to the semiconductor laster, the optical waveguide supported within the integrated package.