Single or dual band parasitic antenna assembly

• US 6,456,249 B1
• Filed: 04/18/2001
• Issued: 09/24/2002
• Est. Priority Date: 08/16/1999
• Status: Expired due to Fees

• Current Assignee: RangeStar Wireless Inc.
• Original Assignee: Tyco Electronics Logistics AG (TE Connectivity Limited)
• Inventors: Newman, Ben, Johnson, Greg
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): VANNUCCI, JAMES
• Application Number:
  US09/837,132
• Time in Patent Office: 524 Days
• Field of Search: 343/700.MS, 343/712, 343/848, 343/815, 343/702, 343/846
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 19/005 Patch antenna using one or more coplanar parasitic elements
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence
• CPC Class Codes: H01Q 9/0442 with particular tuning means

Abstract

A compact single or multiple band antenna assembly for wireless communications devices. One multi-band embodiment includes a high frequency portion and a low frequency portion, both fed at a common point by a single feed line. Both portions may be formed as a single stamped metal part or metallized plastic part. The overall size is suitable for integration within a wireless device such as a cell phone. The low frequency portion consists of two resonant sections which are stagger tuned to achieve a wide resonant bandwidth, thus allowing greater tolerance for manufacturing variations and temperature than a single resonant section, and is useful for single band antennas as well as multi-band antennas where it may be used to enhance bandwidth for both sections of a dual band antenna as well. The resonant sections for single or multi-band antennas operate in conjunction with a second planar conductor, which may be provided by the ground trace portion of the printed wiring board of a wireless communications device. The antenna assembly provides a moderate front-to-back ratio of 3-12 dB and forward gain of +1 to +5 dBi. The front to back ratio reduces the near field toward the user of a hand held wireless communications device, thus reducing SAR (specific absorption rate) of RF energy by the body during transmit. The antenna pattern beam width and bandwidth are increased for a handset during normal user operation, as compared to a half wave dipole.

Claims

1. An antenna assembly for use in a wireless communications device, the antenna assembly comprising:

a conductive ground plane element;

a high frequency resonator element having a conductive surface disposed a predetermined distance away from the ground plane element and having a ground end and a free end, said ground end being coupled to the ground plane element, said resonator element having a shunt feed point disposed on the conductive surface proximate the ground end;

a low frequency resonator element having a conductive surface disposed a predetermined distance away from the ground plane element and having a ground end and a free end, said ground end being coupled to the ground plane element; and

a conductive element functioning as high impedance transmission line, said conductive element coupling the low frequency resonator element to the high frequency resonator element, said conductive element having a first end and a second end, said first end being connected proximate to the shunt feed point and said second end being connected at the free end of the low frequency resonator element.

2. An antenna according to claim 1, wherein the ground plane element is defined by a portion of the ground traces of a printed wiring board.

3. An antenna according to claim 1, wherein the ground plane element has a dimension of at least one-quarter of an operational wavelength.

4. An antenna according to claim 1, wherein the high frequency resonator element includes a plurality of generally planar surfaces, including a top planar surface which is generally parallel to the ground plane element.

5. An antenna according to claim 1, wherein the high frequency resonator element and the low frequency resonator element are coupled to the ground plane element proximate an edge of the ground plane element.

6. An antenna according to claim 1, wherein the conductive element functioning as a high impedance transmission line is selected from among the group including:

a single conductive wire, a microstrip transmission line, and a bent metal conductor.

7. An antenna according to claim 1, wherein the conductive element functioning as a high impedance transmission line has an electrical length of approximately one-quarter wavelength of a wavelength proximate a middle frequency of an operational frequency band.

8. An antenna according to claim 1, wherein the conductive element functioning as a high impedance transmission line is coupled to the low frequency resonator element proximate its free end and is coupled to the high frequency resonator element proximate its ground end.

9. An antenna according to claim 1, further comprising:

a parasitic low frequency resonator element having a conductive surface disposed a predetermined distance away from the ground plane element and having a ground end and a free end, said ground end being coupled to the ground plane element.

10. An antenna according to claim 1, further comprising:

a capacitive tuning element coupled between the free end of the low frequency resonator element and the ground plane element.

11. An antenna according to claim 10, further comprising:

a capacitive tuning element coupled between the free end of the parasitic low frequency resonator element and the ground plane element.

12. An antenna according to claim 1, wherein the low frequency resonator element and the high frequency resonator element are bent metal components.

13. An antenna assembly for use in a wireless communication device, the antenna assembly comprising:

a conductive ground plane element;

a high frequency resonator element having a conductive surface disposed a predetermined distance away from the ground plane element and having a ground end and a free end, said ground end being coupled to the ground plane element,

a shunt feed location on the conductive surface of the high frequency resonator element substantially closer to the ground end than the free end;

a low frequency resonator element having a conductive surface disposed a predetermined distance away from the ground plane element and having a ground end and a free end, said ground end being coupled to the ground plane element; and

a conductive element functioning as high impedance transmission line, said conductive element being coupled between the shunt feed location of the high frequency resonator element and the free end of the low frequency resonator element.

14. An antenna according to claim 13, wherein the ground plane element is defined by a portion of the ground traces of a printed wiring board.

15. An antenna according to claim 13, wherein the ground plane element has a dimension of at least one-quarter of an operational wavelength.

16. An antenna according to claim 13, wherein the high frequency resonator element includes a plurality of generally planar surfaces, including a top planar surface which is generally parallel to the ground plane element.

17. An antenna according to claim 13, wherein the high frequency resonator element and the low frequency resonator element are coupled to the ground plane element proximate an edge of the ground plane element.

18. An antenna according to claim 13, wherein the conductive element functioning as a high impedance transmission line is selected from among the group including:

a single conductive wire, a microstrip transmission line, and a bent metal conductor.

19. An antenna according to claim 13, wherein the conductive element functioning as a high impedance transmission line has an electrical length of approximately one-quarter wavelength of a wavelength proximate a middle frequency of an operational frequency band.

20. An antenna according to claim 13, further comprising:

a parasitic low frequency resonator element having a conductive surface disposed a predetermined distance away from the ground plane element and having a ground end and a free end, said ground end being coupled to the ground plane element.

21. An antenna according to claim 13, further comprising:

a capacitive tuning element coupled between the free end of the low frequency resonator element and the ground plane element.

22. An antenna according to claim 21, further comprising:

a capacitive tuning element coupled between the free end of the parasitic low frequency resonator element and the ground plane element.

23. An antenna according to claim 13, wherein the low frequency resonator element and the high frequency resonator element are bent metal components.

24. A method of manufacturing an antenna assembly for use in a wireless communications device having a ground plane and a signal conductor, the method including the steps of:

forming a high frequency resonator element of a substantially planar conductive material, said element having a conductive surface and a ground leg and a free end;

coupling the ground leg of the high frequency resonator element to the ground plane, said conductive surface of the high frequency resonator element being disposed substantially parallel to the ground plane;

forming a low frequency resonator element out of a substantially planar conductive material, said element having a conductive surface and a ground leg and a free end;

coupling the ground leg of the low frequency resonator element to the ground plane, said conductive surface of the low frequency resonator element being disposed substantially parallel to the ground plane;

coupling the signal conductor of the wireless communications device at a feed point defined upon the conductive surface of the high frequency resonator element; and

coupling a high impedance conductive signal transmission line between the signal conductor and the free end of the low frequency resonator element.

25. The method of claim 24, wherein the step of forming the high frequency resonator element comprises the steps of:

stamping a pattern from a sheet of conductive material, and

bending ends of the pattern to form the conductive surface and the ground leg.