Microelectromechanical elevating structures

• US 6,456,420 B1
• Filed: 07/27/2000
• Issued: 09/24/2002
• Est. Priority Date: 07/27/2000
• Status: Expired due to Term

• Current Assignee: Micross Advanced Interconnect Technology LLC
• Original Assignee: MCNC, Inc.
• Inventors: Goodwin-Johansson, Scott Halden
• Primary Examiner(s): Lester, Evelyn A
• Application Number:
  US09/626,725
• Time in Patent Office: 789 Days
• Field of Search: 359/290-298, 333/101, 333/33, 333/105, 333/202, 333/262, 333/263, 333/246, 338/92, 338/96, 338/97, 338/200-202, 330/66, 361/277, 361/278, 361/281, 361/287, 361/292
• US Class Current: 359/291
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: B81B 3/0035 Constitution or structural means for controlling the movement of the flexible or deformable elements
• CPC Class Codes: H01H 2059/0081 with a tapered air-gap between fixed and movable electrodes
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

A MEMS apparatus is provided that includes a microelectronic substrate and an elevating structure having a fixed portion attached to the substrate and a distal portion raised from the surface of the substrate. The distal portion of the elevating structure defines at least one zone of attachment. Additionally, the MEMS apparatus comprises a MEMS device attached to the distal portion of the elevating structure at one of the zones of attachment. The attached MEMS device may comprise an electrostatic actuator having a first and second electrode film that are attached to the elevating structure at one of the zones of attachment. In those embodiments in which the MEMS devices comprise an electrostatic actuator the force and movement provided by the actuator may be used to incorporate switches, pumps, valves or other similar MEMS devices.

Claims

1. A microelectromechanical (MEMS) apparatus, comprising:

a microelectronic substrate having a first surface;

an elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion capable of being raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one zone of attachment; and

a MEMS device attached to the distal portion of said elevating structure at the least one zone of attachment.

2. The MEMS apparatus of claim 1, wherein said MEMS device further comprises a MEMS electrostatic actuator having a first electrode film and a second electrode film, wherein said first and second electrode films are attached to said elevating structure at the at least one zone of attachment.

3. The MEMS apparatus of claim 2, wherein said first electrode film comprises a first electrode layer.

4. The MEMS apparatus of claim 3, wherein said first electrode film further comprises at least one insulating layer.

5. The MEMS apparatus of claim 3, wherein said first electrode film further comprises at least one biasing layer.

6. The MEMS apparatus of claim 2, wherein said second electrode film comprises a second electrode layer.

7. The MEMS apparatus of claim 6, wherein said second electrode film further comprises at least one insulating layer.

8. The MEMS apparatus of claim 6, wherein said second electrode film further comprises at least one biasing layer.

9. The MEMS apparatus of claim 2, wherein said second electrode film is more flexible than said first electrode film.

10. The MEMS apparatus of claim 9, wherein said second electrode film. is positionally biased to curl generally away from the first electrode film prior to applying voltage.

11. The MEMS apparatus of claim 9, wherein said second electrode film is positionally biased to curl generally towards the first electrode film prior to applying voltage.

12. The MEMS apparatus of claim 2, wherein said first electrode film and said second electrode film are generally flexible structures.

13. The MEMS apparatus of claim 12, wherein said first and second electrode films are positionally biased to curl in the same general direction.

14. The MEMS apparatus of claim 12, wherein said first and second electrode films are positionally biased to curl in generally opposite directions.

15. The MEMS apparatus of claim 2, wherein said first electrode film is an extension of said elevating structure.

16. The MEMS apparatus of claim 2, wherein said second electrode film is an extension of said elevating structure.

17. The MEMS apparatus of claim 2, wherein said first electrode film has a reflective surface capable of deflecting the path of a light beam.

18. The MEMS apparatus of claim 2, wherein said second electrode film has a reflective surface capable of deflecting the path of a light beam.

19. The MEMS apparatus of claim 2, wherein said first and second electrode films have reflective surfaces capable of deflecting the path of a light beam.

20. The MEMS apparatus of claim 1, wherein said MEMS device further comprises a MEMS thermal bimorph structure capable of being actuated by supplying heat to the structure.

21. The MEMS apparatus of claim 2, wherein said elevating structure further comprises means for electrical communication between a source of electrical energy and the first and second electrode films.

22. The MEMS apparatus of claim 1, wherein said elevating structure is positionally biased so that the distal portion curves away from the first surface of said microelectronic substrate.

23. The MEMS apparatus of claim 1, wherein said at least one zone of attachment is generally parallel to the plane of the first surface of said microelectronic substrate.

24. The MEMS apparatus of claim 1, wherein said at least one zone of attachment is generally perpendicular to the plane of the first surface of said microelectronic substrate.

25. The MEMS apparatus of claim 1, wherein said at least one zone of attachment generally lies in a plane that is non-orthogonal to the plane of the first surface of the microelectronic substrate.

26. The MEMS apparatus of claim 1, wherein said distal portion of said elevating structure comprises a biased curled segment and a generally flat segment that follows said biased curled segment.

27. The MEMS apparatus of claim 26, wherein the generally flat segment lies in a plane generally perpendicular to the plane of said first surface of said microelectronic substrate.

28. The MEMS apparatus of claim 26, wherein the generally flat segment lies in a plane that is non-orthogonal to the plane of said first surface of said microelectronic substrate.

29. The MEMS apparatus of claim 26, wherein said flat segment of said distal portion has a generally rectangular shape that defines three zones of attachment.

30. The MEMS apparatus of claim 26, wherein said flat segment of said distal portion has a generally triangular shape that defines two zones of attachment.

31. The MEMS apparatus of claim 26, wherein said flat segment of said distal portion has a predetermined shape that defines more than one zones of attachment.

32. The MEMS apparatus of claim 1, further comprising a substrate electrode disposed on said microelectronic substrate and an elevating structure electrode disposed on said elevating substrate, wherein applying voltage to the substrate electrode and the elevating structure electrode actuates the elevating structure to alter the position of the elevating structure relative to said microelectronic substrate.

33. The MEMS apparatus of claim 1, wherein the MEMS device attached to the distal portion of said elevating structure defines at least one zone of attachment for attaching additional MEMS devices to said MEMS device.

61. The MEMS apparatus of claim 1, wherein said distal portion of said elevating structure comprises a biased curled segment and a generally flat segment that follows said biased curled segment.

62. The MEMS apparatus of claim 61, wherein the generally flat segment lies in a plane generally perpendicular to the plane of said first surface of said microelectronic substrate.

63. The MEMS apparatus of claim 61, wherein the generally flat segment lies in a plane that is non-orthogonal to the plane of said first surface of said microelectronic substrate.

64. The MEMS apparatus of claim 61, wherein said flat segment of said distal portion has a generally rectangular shape that defines three zones of attachment.

65. The MEMS apparatus of claim 61, wherein said flat segment of said distal portion has a generally triangular shape that defines two zones of attachment.

66. The MEMS apparatus of claim 61, wherein said flat segment of said distal portion has a predetermined shape that defines more than one zones of attachment.

34. A microelectromechanical (MEMS) electrostatic actuator, comprising:

a microelectronic substrate having a first surface;

an elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion capable of being raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one zone of attachment;

a first electrode film extending from one of said at least one zone of attachment; and

a second electrode film attached to said elevating structure at the one of said at least one zone of attachment, wherein the first and second electrode films are adapted for electrostatic actuation to controllably move relative to one another.

35. An array of MEMS apparatus comprising:

a microelectronic substrate having a first surface;

a plurality of elevating structures arranged in a pattern, each elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion capable of being raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one zone of attachment; and

a plurality of MEMS devices attached to the distal portion of respective elevating structures at a predetermined zone of attachment.

36. An array of MEMS electrostatic actuators comprising:

a microelectronic substrate having a first surface;

a plurality of elevating structures arranged in a pattern, each elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one zone of attachment;

a first electrode film extending from one of said at least one zone of attachment of each elevating structure; and

a second electrode film attached to each of said elevating structures at the one of said at least one zone of attachment, wherein the first and second electrode films are adapted for electrostatic actuation to controllably move relative to one another.

37. A MEMS electrostatic switch comprising:

a microelectronic substrate having a first surface;

an elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion capable of being raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one zone of attachment;

a first electrode film extending from one of said at least one zone of attachment and having a first electrical contact; and

a second electrode film attached to said elevating structure at the one of said at least one zone of attachment and having a second electrical contact, wherein the first and second electrode films are adapted for electrostatic actuation to controllably move relative to one another and provide for electrical connection between said first and second contacts.

38. A MEMS electrostatic optical attenuator comprising:

a microelectronic substrate having a first surface;

an elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one zone of attachment;

a first electrode film extending from one of said at least one zone of attachment; and

a second electrode film attached to said elevating structure at the one of said at least one zone of attachment and having a reflective surface, wherein the first and second electrode films are adapted for electrostatic actuation to controllably move relative to one another for the purpose of altering optical beams that are proximate to said substrate.

39. A microelectromechanical (MEMS) apparatus, comprising:

a microelectronic substrate having a first surface;

an elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion capable of being raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one elevating structure zone of attachment;

a MEMS device attached to the distal portion of said elevating structure at the least one zone of attachment and defining at least one MEMS device zone of attachment; and

a secondary MEMS device attached to the MEMS device zone of attachment.

40. The MEMS apparatus of claim 39, wherein the secondary MEMS device defines at least one secondary MEMS device zone of attachment and said apparatus further comprises a tertiary MEMS device attached to the secondary MEMS device zone of attachment.

41. A microelectromechanical (MEMS) apparatus, comprising:

a microelectronic substrate having a first surface;

an elevating structure having a fixed portion attached to said first surface of said microelectronic substrate and a distal portion capable of being raised from said first surface of said microelectronic substrate, wherein the distal portion defines at least one zone of attachment; and

a MEMS electrostatic actuator having a first electrode film and a second electrode film, wherein said first and second electrode films are attached to said elevating structure at the at least one zone of attachment.

42. The MEMS apparatus of claim 41, wherein said first electrode film comprises a first electrode layer and at least one insulating layer.

43. The MEMS apparatus of claim 42, wherein said first electrode film further comprises at least one biasing layer.

44. The MEMS apparatus of claim 41, wherein said second electrode film comprises a second electrode layer and at least one insulating layer.

45. The MEMS apparatus of claim 44, wherein said second electrode film further comprises at least one biasing layer.

46. The MEMS apparatus of claim 41, wherein said second electrode film is more flexible than said first electrode film.

47. The MEMS apparatus of claim 46, wherein said second electrode film is positionally biased to curl generally away from the first electrode film prior to applying voltage.

48. The MEMS apparatus of claim 46, wherein said second electrode film is positionally biased to curl generally towards the first electrode film prior to applying voltage.

49. The MEMS apparatus of claim 41, wherein said first and second electrode films are positionally biased to curl in the same general direction.

50. The MEMS apparatus of claim 41, wherein said first and second electrode films are positionally biased to curl in generally opposite directions.

51. The MEMS apparatus of claim 41, wherein said first electrode film is an extension of said elevating structure.

52. The MEMS apparatus of claim 41, wherein said second electrode film is an extension of said elevating structure.

53. The MEMS apparatus of claim 41, wherein said first electrode film has a reflective surface capable of deflecting the path of a light beam.

54. The MEMS apparatus of claim 41, wherein said second electrode film has a reflective surface capable of deflecting the path of a light beam.

55. The MEMS apparatus of claim 41, wherein said first and second electrode films have reflective surfaces capable of deflecting the path of a light beam.

56. The MEMS apparatus of claim 41, wherein said elevating structure further comprises means for electrical communication between a source of electrical energy and the first and second electrode films.

57. The MEMS apparatus of claim 41, wherein said elevating structure is positionally biased so that the distal portion curves away from the first surface of said microelectronic substrate.

58. The MEMS apparatus of claim 41, wherein said at least one zone of attachment is generally parallel to the plane of the first surface of said microelectronic substrate.

59. The MEMS apparatus of claim 41, wherein said at least one zone of attachment is generally perpendicular to the plane of the first surface of said microelectronic substrate.

60. The MEMS apparatus of claim 41, wherein said at least one zone of attachment generally lies in a plane that is non-orthogonal to the plane of the first surface of the microelectronic substrate.

67. The MEMS apparatus of claim 41, further comprising a substrate electrode disposed on said microelectronic substrate and an elevating structure electrode disposed on said elevating substrate, wherein applying voltage to the substrate electrode and the elevating structure electrode actuates the elevating structure to alter the position of the elevating structure relative to said microelectronic substrate.