Decapsulating method and apparatus for integrated circuit packages

• US 6,457,506 B1
• Filed: 10/29/1999
• Issued: 10/01/2002
• Est. Priority Date: 06/29/1998
• Status: Expired due to Term

• Current Assignee: Intersil Corporation (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Lowry, Robert K.
• Primary Examiner(s): Osele, Mark A.
• Application Number:
  US09/430,391
• Time in Patent Office: 1,068 Days
• Field of Search: 156/344, 156/584, 294/020.6, 294/261, 294/263, 294/264, 294/265, 294/266, 295/643, 297/62, 219/678, 219/756
• US Class Current: 156/750
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: Y10S 156/941 Means for delaminating semiconductive product
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/1126 Using direct fluid current against work during delaminating
• CPC Class Codes: Y10T 156/1158 Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
• CPC Class Codes: Y10T 156/19 Delaminating means
• CPC Class Codes: Y10T 29/49726 Removing material
• CPC Class Codes: Y10T 29/49821 by altering or destroying work part or connector
• CPC Class Codes: Y10T 29/49822 by applying force
• CPC Class Codes: Y10T 29/53274 Means to disassemble electrical device

Abstract

The decapsulating method is for an integrated circuit package and includes the steps of subjecting the encapsulant to electromagnetic radiation, and, more preferably microwave radiation, to break the polymer bonds of the polymer resin and convert the encapsulant to loosened particles. The loosened particles can then be removed to thereby decapsulate the integrated circuit package. The method may further include the step of maintaining the integrated circuit package below a predetermined temperature during the subjecting step. The step of maintaining the temperature below the predetermined temperature may be performed by controlling a power of the electromagnetic radiation, such as based upon sensing a temperature of the integrated circuit package. The method may further comprise the step of varying a frequency of the microwave radiation during the subjecting step.

Claims

1. Apparatus for decapsulating an integrated circuit package of a type comprising an encapsulant including a polymer resin, the apparatus comprising:

a microwave shielded chamber;

a support for supporting the integrated circuit package within said microwave shielded chamber;

a microwave generator coupled to said shielded microwave chamber for generating microwave radiation therein so as to subject the encapsulant of the integrated circuit package to microwave radiation to break polymer bonds in the polymer resin and convert the encapsulant to loosened particles, said microwave generator further comprising frequency varying means or varying a frequency of the microwave radiation over a predetermined frequency range;

means for removing loosened particles from the integrated circuit package, the loosened particle removing means comprising one of a rotating brush and means for directing a fluid stream toward the loosened particles.

2. An apparatus according to claim 1 further comprising temperature control means for maintaining the integrated circuit package below a predetermined temperature during the subjecting step.

3. An apparatus according to claim 2 wherein said temperature control means comprises a temperature sensor and power control means for controlling a power of said microwave generator responsive to said temperature sensor.

4. An apparatus according to claim 1 wherein said frequency varying means comprises means for varying the frequency over a range of about 5 GHz to 8 GHz.

5. An apparatus for decapsulating an integrated circuit package of a type comprising an encapsulant including a polymer resin, the apparatus comprising:

a chamber;

a support for supporting the integrated circuit package within said chamber;

a microwave generator coupled to said chamber for generating microwave radiation therein varying in frequency over a predetermined range so as to subject the encapsulant of the integrated circuit package to microwave radiation to break polymer bonds in the polymer resin and convert the encapsulant to loosened particles;

a temperature sensor cooperating with said microwave generator for maintaining the integrated circuit package below a predetermined temperature during the subjecting step;

a loosened particle remover for removing loosened particles from the integrated circuit package, the loosened particle remover comprising one of a rotating brush and a nozzle for directing a fluid stream toward the loosened particles.

6. An apparatus according to claim 5 wherein the predetermined frequency range is about 5 GHz to 8 GHz.